公开(公告)号：US20190316009A1

公开(公告)日：2019-10-17

申请号：US16309534

申请日：2017-06-27

Applicant: NAMICS CORPORATION

Inventor： Katsunori ARAI

IPC: C09J11/06 ,  C08K5/14 ,  C08K5/32 ,  C08G73/06 ,  C09J11/04 ,  C09J4/00 ,  C08K3/08 ,  C08F20/18

Abstract: To provide adhesive compositions that have a long pot life which, when used in a two-stage process involving partial curing and complete curing, can be cured completely at a temperature lower than that for partial curing. An adhesive composition including: a curable resin that is radically polymerizable; an organic peroxide having a one-minute half-life temperature of less than 100° C.; and a radical polymerization inhibitor, wherein a rate of viscosity increase of the adhesive composition at 25° C. and after 48 hours is 1.5 or less, partial curing of the adhesive composition is possible by heating at 100° C. to 180° C. for 1 to 5 second(s), and complete curing of the adhesive composition is possible by heating at 70° C. to 100° C. after the partial curing.