公开(公告)号：US11542417B2

公开(公告)日：2023-01-03

申请号：US17287833

申请日：2019-10-28

Applicant: NAMICS CORPORATION

Inventor： Irma Yolanda Kapoglis ,  Masayoshi Otomo

IPC: C09J9/02 ,  C09J11/04 ,  C09J175/14 ,  H01L23/00 ,  C08K3/08

Abstract: A low temperature rapid curing type low elastic conductive adhesive is provided which is useful as a conductive adhesive for component mounting in a field of FHE. The conductive resin composition contains (A) at least two types of urethane acrylate oligomers, (B) a radical polymerizable monomer, (C) a free radical generation curing agent, and (D) conductive particle. In the conductive resin composition, the component (A) preferably contains a high molecular weight urethane acrylate oligomer having a weight average molecular weight of 10,000 or more (A1), and a low molecular weight urethane acrylate oligomer having a weight average molecular weight of 9,999 or less (A2).