公开(公告)号：US20230229079A1

公开(公告)日：2023-07-20

申请号：US18009628

申请日：2021-06-07

Applicant: NAMICS CORPORATION

Inventor： Pawel CZUBAROW ,  Masayoshi OTOMO ,  Irma Yolanda KAPOGLIS ,  Nicholas Charles KRASCO ,  Frank Anthony LETIZIA, III ,  Toshiyuki SATO

IPC: G03F7/033 ,  C08K5/3417 ,  C08L83/06 ,  G03F7/075 ,  C08F290/06

CPC classification number: G03F7/033 ,  C08K5/3417 ,  C08L83/06 ,  G03F7/0757 ,  C08F290/062 ,  C08L2203/16 ,  C08L2203/206

Abstract: There are provided a photosensitive resin composition, a cured product thereof, and a wiring structure body, an electronic component, a semiconductor device, and a camera module each including the cured product. This photosensitive resin composition is cured by irradiation with active energy rays, instead of by heat treatment at high temperatures. In this photosensitive resin composition, film loss after a development process is restrained. Furthermore, a miniaturized pattern can be accurately formed by photolithography. An aspect of the present invention is a photosensitive resin composition including components (A) to (C): (A) a modified polyphenylene ether represented by formula (1) and formula (2), (B) a silsesquioxane compound represented by formula (3), and (C) a photopolymerization initiator, a cured product thereof, and a wiring structure body, an electronic component, a semiconductor device, and a camera module each including the cured product.