公开(公告)号：US11817398B2

公开(公告)日：2023-11-14

申请号：US17280256

申请日：2019-09-24

Applicant: NAMICS CORPORATION

Inventor： Masashi Kajita ,  Masahiro Kitamura ,  Takayuki Higuchi ,  Noritsuka Mizumura

IPC: H01L23/00 ,  B22F1/107 ,  B22F1/054 ,  B22F1/052

CPC classification number: H01L23/562 ,  B22F1/052 ,  B22F1/054 ,  B22F1/056 ,  B22F1/107 ,  H01L24/29 ,  H01L2224/29247 ,  H01L2924/15747 ,  H01L2924/3512 ,  B22F2999/00 ,  B22F1/05 ,  B22F2304/058 ,  C22C1/0425 ,  B22F2999/00 ,  B22F2304/056 ,  B22F1/054 ,  B22F1/056 ,  B22F2304/056 ,  B22F2304/054 ,  C22C1/0425

Abstract: A conductive paste contains (A) copper fine particles having an average particle diameter of 50 nm to 400 nm and a crystallite diameter of 20 nm to 50 nm, (B) copper particles having an average particle diameter of 0.8 μm to 5 μm and a ratio of a crystallite diameter to the crystallite diameter of the copper fine particles (A) of 1.0 to 2.0, and (C) a solvent.