公开(公告)号：US20240145113A1

公开(公告)日：2024-05-02

申请号：US18272229

申请日：2022-01-07

Applicant: NAMICS CORPORATION

Inventor： Toshiaki OGIWARA ,  Taku FUJINO

IPC: H01B1/22 ,  H05K1/09 ,  H05K1/18

CPC classification number: H01B1/22 ,  H05K1/095 ,  H05K1/189

Abstract: A conductive composition includes conductive particles, a thermoplastic resin, and a solvent, wherein a glass transition temperature of the thermoplastic resin is 140 to 200 degrees C.

公开(公告)号：US20230272238A1

公开(公告)日：2023-08-31

申请号：US18026484

申请日：2021-09-10

Applicant: NAMICS CORPORATION

Inventor： Taku FUJINO ,  Toshiaki OGIWARA

IPC: C09D11/52 ,  C09D11/102 ,  C09D11/037 ,  H01B1/22

CPC classification number: C09D11/52 ,  C09D11/102 ,  C09D11/037 ,  H01B1/22

Abstract: A conductive paste that can reduce an increase in electrical resistance caused by stretching of a wiring when the wiring of an electrical circuit and/or an electronic circuit is formed on a surface of a stretchable and/or bendable base material. The stretchable conductive paste includes (A) surface-treated silver particles and (B) a thermoplastic resin. The (A) surface-treated silver particles include a surface-treated layer.