公开(公告)号：US20250026920A1

公开(公告)日：2025-01-23

申请号：US18770676

申请日：2024-07-12

Applicant: SK hynix Inc. ,  NAMICS CORPORATION

Inventor： Minsuk KIM ,  Hyunsuk LEE ,  Sungho CHO ,  Tsuyoshi KAMIMURA ,  Yosuke SAKAI ,  Makoto SUZUKI

IPC: C08K13/06 ,  C08G59/62 ,  H01L21/56 ,  H01L23/00 ,  H01L23/29 ,  H01L25/065

Abstract: An object of the present invention is to provide a liquid epoxy resin composition suitable for use as a mold underfill material for TSV, which composition may provide an electronic component having high wiring density, satisfactorily releasing heat generated during its driving and having high reliability. The liquid epoxy resin composition of the present invention comprises an epoxy resin (A), a curing agent (B), an inorganic filler (C) consisting of a silica filler and an alumina filler and carbon black (D); the epoxy resin (A) comprises a specific aliphatic epoxy resin, the alumina filler has a specific particle size distribution, and the liquid epoxy resin composition gives a cured product having a thermal conductivity within a predetermined range. The liquid epoxy resin composition of the present invention gives a cured product having high thermal conductivity. Thus, in a semiconductor device that includes electronic components manufactured using the composition as a mold underfill material for TSV, deterioration of performance due to heat is suppressed. Furthermore, an electronic component manufactured using the liquid epoxy resin composition of the present invention as a mold underfill material for TSV exhibits sufficient reliability. Thus, the liquid epoxy resin composition of the present invention is highly suitable for use as a mold underfill material for TSV.

公开(公告)号：US20240368374A1

公开(公告)日：2024-11-07

申请号：US18291751

申请日：2022-08-05

Applicant: NAMICS CORPORATION

Inventor： Makoto SUZUKI ,  Yosuke SAKAI ,  Tsuyoshi KAMIMURA

IPC: C08K3/28 ,  C08G59/14 ,  C08G59/22 ,  C08G59/24 ,  C08G59/50 ,  C08G59/62 ,  C08K3/36 ,  H01L23/29

Abstract: [Problem to be solved] To provide an epoxy resin composition that is excellent in injectability and thermal conductivity of the cured product and can also be used for manufacturing a semiconductor device having high operation reliability. [Solution] An epoxy resin composition including an epoxy resin (A), a curing agent (B), a curing catalyst (C), and a filler (D), in which the filler (D) contains an aluminum nitride filler (D-1), the aluminum nitride filler (D-1) has an average particle size of 10.0 μm or less, the aluminum nitride filler (D-1) has a uranium content of 20 ppb or less, and a blending ratio of the aluminum nitride filler (D-1) to a total amount of the filler (D) is 70% by mass or more.

公开(公告)号：US20230203236A1

公开(公告)日：2023-06-29

申请号：US17926965

申请日：2021-04-20

Applicant: NAMICS CORPORATION

Inventor： Makoto SUZUKI ,  Tsuyoshi KAMIMURA ,  Yosuke SAKAI

IPC: C08G59/02 ,  C08G59/14 ,  C08K3/36 ,  B29C43/00

CPC classification number: C08G59/02 ,  C08G59/1444 ,  C08K3/36 ,  B29C43/003 ,  C08K2201/005 ,  B29K2063/00

Abstract: A method for producing a semiconductor element by wafer-level chip-size packaging includes applying a liquid compression molding material to a wafer after completion of circuit formation and subjecting the wafer to sealing treatment by compression molding. The liquid compression molding material includes (A) an epoxy resin; (B) a curing agent; and (C) a filler. The liquid compression molding material having a thixotropic index (TI) of 0.8 to 4.0.

公开(公告)号：US20220072582A1

公开(公告)日：2022-03-10

申请号：US17414754

申请日：2020-01-29

Applicant: NAMICS CORPORATION

Inventor： Hiroki MYODO ,  Yosuke SAKAI ,  Masaaki HOSHIYAMA

IPC: B05C17/005 ,  C08G59/24 ,  C08G59/50 ,  C08F222/10

Abstract: There are provided a syringe filled with a resin composition and a storage method thereof. According to the syringe and the storage method, mixed air, which causes the resin composition to be intermittently discharged from the syringe, is suppressed. The syringe filled with the resin composition includes a syringe, a resin composition filling the syringe, and a plunger. The resin composition contains voids. The ratio of the volume of the voids relative to the volume of the resin composition is 1.0 ppm by volume to 520 ppm by volume. The voids have a maximum diameter of 2,500 μm or less.