公开(公告)号：US20220267889A1

公开(公告)日：2022-08-25

申请号：US17596204

申请日：2020-10-26

Applicant: NANJING UNIVERSITY

Inventor： Xuecou TU ,  Mengxin LIU ,  Lin KANG ,  Labao ZHANG ,  Xiaoqing JIA ,  Qingyuan ZHAO ,  Jian CHEN ,  Peiheng WU

IPC: C23C14/16 ,  C23C14/30 ,  C23C14/02 ,  C23C14/58

Abstract: A fabrication method of a silicon nanoneedle array with ultra-high aspect ratio includes the following steps: spin-coating two photoresist layers of methyl methacrylate (MMA) and polymethyl methacrylate (PMMA) A2 on a silicon substrate; subjecting the silicon substrate coated with the two photoresist layers of MMA and PMMA A2 to electron beam lithography to form a photoresist pattern on the silicon substrate; subjecting the silicon substrate on which the photoresist pattern is formed to electron beam evaporation (EBE) to deposit an Al film layer on the silicon substrate; subjecting the silicon substrate on which the Al film layer is deposited to stripping to obtain an Al film array deposited on the silicon substrate, which provides a mask for the subsequent inductively coupled plasma (ICP) etching process; and subjecting the silicon substrate covered with the Al mask to ICP silicon etching to obtain a silicon nanoneedle array structure.

公开(公告)号：US20230304980A1

公开(公告)日：2023-09-28

申请号：US18033072

申请日：2021-05-13

Applicant: NANJING UNIVERSITY

Inventor： Aidong LI ,  Qiang REN ,  Jian CHEN ,  Jiabin FANG ,  Min HAN

IPC: G01N33/00 ,  B82B3/00 ,  C23C16/455

CPC classification number: G01N33/005 ,  B82B3/0023 ,  C23C16/45555

Abstract: Disclosed is a flexible hydrogen sensor with ultra-high sensitivity and a wide range and a fabrication method therefor. The sensor includes a conductive electrode layer (4), a sensing layer and a flexible substrate layer (1) in sequence from top to bottom. The sensing layer includes a MOxfilm (2) and Pd nanoparticles (NPs) (3), and the Pd NPs (3) are covered on the MOx film (2). A traditional metal oxide type hydrogen sensor and a quantum conductance-based hydrogen sensor are combined on a flexible polymer substrate by means of an atomic layer deposition (ALD) technology and a cluster beam deposition (CBD) technology, so as to obtain a flexible hydrogen sensor with ultra-high sensitivity, a wide range and excellent selectivity and lower working temperature.

公开(公告)号：US20210261405A1

公开(公告)日：2021-08-26

申请号：US17288536

申请日：2020-06-11

Applicant: Nanjing University of Aeronautics and Astronautics ,  Nanjing Li-Hang Industry Institute of Bionic Technology Limited Company

Inventor： Zhendong DAI ,  Keju JI ,  Enhua CUI ,  Jian CHEN ,  Cong YUAN ,  Yiqiang TANG

IPC: B81C1/00 ,  C09J183/04 ,  C09J133/08 ,  C09J109/00 ,  B81B1/00 ,  B81C99/00 ,  B29C33/38 ,  C25D7/00

Abstract: A preparation method of a bionic adhesive material with a tip-expanded microstructural array includes the following steps: machining through-holes on a metal sheet; modifying morphology of a through-hole by electroplating, using the metal sheet in step 1 as an electroplating cathode, and arranging the electroplating cathode and an electroplating anode in parallel to prepare a hyperboloid-like through-hole array assembly, fitting a lower surface of the hyperboloid-like through-hole array assembly tightly to an upper surface of a substrate assembly to prepare a through-hole assembly of a mold; and filling the mold assembly with a polymer, curing, and demolding to obtain the adhesive material with the tip-expanded microstructural array.