公开(公告)号：US09809882B2

公开(公告)日：2017-11-07

申请号：US14596355

申请日：2015-01-14

Applicant: NATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGY

Inventor： Owen Hildreth

IPC: H01L21/285 ,  H01L21/306 ,  C23C18/18 ,  C23C18/16 ,  C23C18/31 ,  H01Q17/00 ,  C25F3/12

CPC classification number: C23C18/1608 ,  C23C18/1879 ,  C23C18/31 ,  C25F3/12 ,  H01L21/28506 ,  H01L21/306 ,  H01L21/30604 ,  H01Q17/00

Abstract: A process for depositing a metal includes disposing an activating catalyst on a substrate; contacting the activating catalyst with a metal cation from a vapor deposition composition; contacting the substrate with a reducing anion from the vapor deposition composition; performing an oxidation-reduction reaction between the metal cation and the reducing anion in a presence of the activating catalyst; and forming a metal from the metal cation to deposit the metal on the substrate. A system for depositing a metal includes an activating catalyst to deposit on a substrate; and a primary reagent to form: a metal cation to deposit on the substrate as a metal; and a reducing anion to provide electrons to the activating catalyst, the metal cation, the substrate, or a combination thereof, wherein the primary reagent forms the metal cation and the reducing anion in response to being subjected to a dissociating condition.

公开(公告)号：US09580809B2

公开(公告)日：2017-02-28

申请号：US14596338

申请日：2015-01-14

Applicant: NATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGY

Inventor： Owen Hildreth

IPC: H01L21/306 ,  H01L29/06 ,  C23C18/16 ,  C23C18/18 ,  C23C18/31 ,  H01L21/285 ,  H01Q17/00 ,  C25F3/12

CPC classification number: C23C18/1608 ,  C23C18/1879 ,  C23C18/31 ,  C25F3/12 ,  H01L21/28506 ,  H01L21/306 ,  H01L21/30604 ,  H01Q17/00

Abstract: An article includes a substrate; and a coating disposed on the substrate that includes a microporous layer; a gradient in a density of a volume of the microporous layer, and a plurality of dendritic veins that are anisotropically disposed in the coating. A process for forming a coating includes disposing an activating catalyst on a substrate; introducing an activatable etchant; introducing an etchant oxidizer, performing an oxidation-reduction reaction between the substrate, the activatable etchant, and the etchant oxidizer in a presence of the activating catalyst, the oxidation-reduction reaction occurring in a liquid medium including the activatable etchant; and the etchant oxidizer, forming an etchant product comprising atoms from the substrate; removing a portion of the etchant product from the substrate; and forming a dendritic vein in the substrate to form the coating, the dendritic vein being anisotropically disposed in the coating.

Abstract translation: 一种制品包括底物; 以及设置在所述基板上的包括微孔层的涂层; 微孔层的体积密度的梯度和各向异性地设置在涂层中的多个树枝状静脉。 一种形成涂层的方法包括在基材上设置活化催化剂; 引入可激活的蚀刻剂; 引入蚀刻剂氧化剂，在活化催化剂的存在下，在底物，可活化蚀刻剂和蚀刻剂氧化剂之间进行氧化还原反应，氧化还原反应在包括可活化蚀刻剂的液体介质中发生; 和蚀刻剂氧化剂，形成包含来自基底的原子的蚀刻剂产物; 从衬底去除蚀刻剂产物的一部分; 并在基质中形成树突状静脉以形成涂层，树突状静脉各向异性地置于涂层中。

公开(公告)号：US20150123249A1

公开(公告)日：2015-05-07

申请号：US14596338

申请日：2015-01-14

Applicant: NATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGY

Inventor： Owen Hildreth

IPC: H01L21/306 ,  H01L29/06

CPC classification number: C23C18/1608 ,  C23C18/1879 ,  C23C18/31 ,  C25F3/12 ,  H01L21/28506 ,  H01L21/306 ,  H01L21/30604 ,  H01Q17/00

Abstract: An article includes a substrate; and a coating disposed on the substrate that includes a microporous layer; a gradient in a density of a volume of the microporous layer, and a plurality of dendritic veins that are anisotropically disposed in the coating. A process for forming a coating includes disposing an activating catalyst on a substrate; introducing an activatable etchant; introducing an etchant oxidizer, performing an oxidation-reduction reaction between the substrate, the activatable etchant, and the etchant oxidizer in a presence of the activating catalyst, the oxidation-reduction reaction occurring in a liquid medium including the activatable etchant; and the etchant oxidizer, forming an etchant product comprising atoms from the substrate; removing a portion of the etchant product from the substrate; and forming a dendritic vein in the substrate to form the coating, the dendritic vein being anisotropically disposed in the coating.

Abstract translation: 一种制品包括底物; 以及设置在所述基板上的包括微孔层的涂层; 微孔层的体积密度的梯度和各向异性地设置在涂层中的多个树枝状静脉。 一种形成涂层的方法包括在基材上设置活化催化剂; 引入可激活的蚀刻剂; 引入蚀刻剂氧化剂，在活化催化剂的存在下，在底物，可活化蚀刻剂和蚀刻剂氧化剂之间进行氧化还原反应，氧化还原反应在包括可活化蚀刻剂的液体介质中发生; 和蚀刻剂氧化剂，形成包含来自基底的原子的蚀刻剂产物; 从衬底去除蚀刻剂产物的一部分; 并在基质中形成树突状静脉以形成涂层，树突状静脉各向异性地置于涂层中。

公开(公告)号：US09828677B2

公开(公告)日：2017-11-28

申请号：US14596349

申请日：2015-01-14

Applicant: NATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGY

Inventor： Owen Hildreth

IPC: H01L21/306 ,  C23C18/16 ,  C23C18/18 ,  C23C18/31 ,  H01L21/285 ,  H01Q17/00 ,  C25F3/12

CPC classification number: C23C18/1608 ,  C23C18/1879 ,  C23C18/31 ,  C25F3/12 ,  H01L21/28506 ,  H01L21/306 ,  H01L21/30604 ,  H01Q17/00

Abstract: A process for etching includes disposing an activating catalyst on a substrate; providing a vapor composition that includes an etchant oxidizer, an activatable etchant, or a combination thereof; contacting the activating catalyst with the etchant oxidizer; contacting the substrate with the activatable etchant; performing an oxidation-reduction reaction between the substrate, the activatable etchant, and the etchant oxidizer in a presence of the activating catalyst and the vapor composition; forming an etchant product that includes a plurality of atoms from the substrate; and removing the etchant product from the substrate to etch the substrate.