公开(公告)号：US11920932B2

公开(公告)日：2024-03-05

申请号：US17298597

申请日：2020-09-17

Applicant: NATIONAL UNIVERSITY OF DEFENSE TECHNOLOGY

Inventor： Xuezhong Wu ,  Dingbang Xiao ,  Xiang Xi ,  Yulie Wu ,  Hanhui He ,  Yan Shi ,  Kun Lu ,  Bin Li ,  Yimo Chen ,  Chao Yuan ,  Bao Nie

IPC: G01C19/5769 ,  B81B7/00 ,  G01C19/5691 ,  G01C19/5755 ,  G01C25/00

CPC classification number: G01C19/5769 ,  B81B7/007 ,  G01C19/5691 ,  G01C19/5755 ,  G01C25/00 ,  B81B2201/0242 ,  B81B2201/0271

Abstract: A wafer-level assembly method for a micro hemispherical resonator gyroscope includes: after independently manufactured glass substrates are softened and deformed at a high temperature, forming a micro hemispherical resonator on the glass substrate; forming glass substrate alignment holes at both ends of the glass substrate by laser ablation; aligning and fixing a plurality of identical micro hemispherical resonators on a wafer fixture by using the alignment holes as a reference, and then performing operations by using the wafer fixture as a unit to implement subsequent processes that include: releasing the micro hemispherical resonators, metallizing the surface, fixing to the planar electrode substrates, separating the wafer fixture and cleaning to obtain a micro hemispherical resonator gyroscope driven by a bottom planar electrode substrate. The wafer-level assembly method includes: fixedly mounting the plurality of independently manufactured micro hemispherical resonators on the same wafer fixture to implement a wafer-level installation operation.