公开(公告)号：US20020074164A1

公开(公告)日：2002-06-20

申请号：US09985727

申请日：2001-11-06

Applicant: NEC CORPORATION

Inventor： Naomi Ishizuka ,  Akihito Matsumoto ,  Eiichi Kono ,  Motoji Suzuki ,  Akihiro Sato ,  Hiroshi Matsuoka ,  Masafumi Kanai

IPC: H05K001/11 ,  H01R012/04

CPC classification number: H05K3/3447 ,  H01R4/023 ,  H05K1/116 ,  H05K3/3463 ,  H05K2201/0939 ,  H05K2201/099

Abstract: In a circuit board having lands 2 each of which has a through hole 4 through which a lead of an electrical part is inserted, the lead 3 and the land 2 being mounted in the circuit board by using lead-free solder 6, the width of the land 2 corresponding to the difference in radius between the land 2 and the through hole 4 is set to about 0.40 mm or more. The width of the land 2 is set to such a value that the land exfoliation due to the solidification/shrinkage of the lead-free solder 6 and the shrinkage of the circuit board in the thickness direction can be prevented. The circuit board 1 has circuit wires at least on both the surface and the back surface.

Abstract translation: 在具有焊盘2的电路板中，每个焊盘2具有插入电气部件的引线的通孔4，引线3和焊盘2通过使用无铅焊料6安装在电路板中，宽度 对应于焊盘2和通孔4之间的半径差的焊盘2被设定为大约0.40mm或更大。 焊盘2的宽度被设定为可以防止由于无铅焊料6的凝固/收缩导致的焊盘剥离和电路板在厚度方向上的收缩的值。 电路板1至少在表面和背面都具有电路线。