Cold cathode device
    1.
    发明申请
    Cold cathode device 审中-公开
    冷阴极装置

    公开(公告)号:US20030010996A1

    公开(公告)日:2003-01-16

    申请号:US10191477

    申请日:2002-07-10

    Inventor: Hiroo Hongo

    CPC classification number: H01J1/308

    Abstract: A cold cathode device is formed from a p-type semiconductor substrate 1. Two source/drain regions 2 are formed in the p-type semiconductor substrate 1, a silicon oxide film 3, which is an insulating film, is formed on the surface of the p-type semiconductor substrate 1 (the face where the source/drain regions 2 are formed), and a gate electrode 4 is formed on top of the silicon oxide film 3. Furthermore, a substrate electrode 5 is formed on the back surface of the p-type semiconductor substrate 1. The same voltages are applied to the source/drain regions 2 and the gate electrode 4, and a lower voltage is applied to the substrate electrode 5.

    Abstract translation: 冷阴极器件由p型半导体衬底1形成。在p型半导体衬底1中形成两个源极/漏极区域2,在绝缘膜的表面上形成作为绝缘膜的氧化硅膜3 p型半导体衬底1(形成源极/漏极区域2的面)和栅电极4形成在氧化硅膜3的顶部。此外,衬底电极5形成在氧化硅膜3的背面 p型半导体衬底1.对源极/漏极区域2和栅极电极4施加相同的电压,并且向衬底电极5施加较低的电压。

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