公开(公告)号：US20160198561A1

公开(公告)日：2016-07-07

申请号：US14907400

申请日：2014-07-17

Applicant: NGK SPARK PLUG CO., LTD.

Inventor： Daiki TSUNEMI ,  Masahito MORITA ,  Naoki KITO ,  Tatsuharu IKAWA ,  Hiroyuki KODAMA

IPC: H05K1/02 ,  H05K3/46

CPC classification number: H05K1/0218 ,  H01L23/13 ,  H01L23/49805 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/552 ,  H01L2924/0002 ,  H01L2924/15159 ,  H01L2924/15162 ,  H05K1/0284 ,  H05K3/4644 ,  H05K2201/0715 ,  H05K2201/0919 ,  H01L2924/00

Abstract: A wiring board including a board main body made of an insulating material and having a front surface and rear surface and side surfaces at four sides located between the front and the rear surfaces, and a wiring conductor for plating, an end surface of which is exposed on any side surface of the board main body, wherein the wiring board includes a first insulating layer formed on the side surface on which the end surface of the wiring conductor for plating is exposed to cover the end surface, and a conductor layer formed on the side surface of the board main body on which the first insulating layer is formed along a side direction of the side surface including a surface of the first insulating layer, and wherein the conductor layer is electrically connected to a ground layer formed inside the board main body.

Abstract translation: 一种布线板，包括由绝缘材料制成并具有前表面和后表面的板主体和位于前表面和后表面之间的四边的侧表面的布线板，以及用于电镀的布线导体，其端表面暴露 在所述板主体的任一侧表面上，所述布线板包括形成在所述侧表面上的用于电镀用布线导体的端面露出以覆盖所述端面的第一绝缘层，以及形成在所述第一绝缘层上的导体层 沿着包括第一绝缘层的表面的侧面的侧面形成有第一绝缘层的板主体的侧面，并且其中导体层电连接到形成在板主体内部的接地层 。