公开(公告)号：US20180035537A1

公开(公告)日：2018-02-01

申请号：US15543264

申请日：2016-01-08

Applicant: NGK SPARK PLUG CO., LTD.

Inventor： Tatsuya KATOH ,  Masanori ITO ,  Masaki KUTSUNA

IPC: H05K1/03 ,  H05K3/12 ,  C04B35/63 ,  H05K3/46 ,  H01L23/15 ,  H05K1/09 ,  H05K3/28

CPC classification number: H05K3/40 ,  B32B9/005 ,  B32B2307/202 ,  C03C4/14 ,  C03C10/0054 ,  C03C2204/00 ,  C04B35/6303 ,  C04B2237/40 ,  C04B2237/704 ,  H01L23/15 ,  H05K1/0296 ,  H05K1/0306 ,  H05K1/09 ,  H05K1/092 ,  H05K3/12 ,  H05K3/1291 ,  H05K3/28 ,  H05K3/285 ,  H05K3/321 ,  H05K3/4061 ,  H05K3/46 ,  H05K3/4629 ,  H05K3/4664 ,  H05K2201/017 ,  H05K2201/0769 ,  H05K2203/1126 ,  Y10T29/49163

Abstract: A method of manufacturing a ceramic substrate includes the steps of preparing a ceramic paste in which a powder of at least one of a metal boride and a metal silicide is added to a raw material powder of a glass ceramic, applying the ceramic paste to a green sheet which is to become a ceramic layer after firing, applying a conductor paste which is to become a conductor trace after firing to the ceramic paste having been applied to the green sheet, and firing the green sheet carrying the ceramic paste and the conductor paste applied thereto.

公开(公告)号：US20180324957A1

公开(公告)日：2018-11-08

申请号：US16031828

申请日：2018-07-10

Applicant: NGK SPARK PLUG CO., LTD.

Inventor： Tatsuya KATOH ,  Masanori ITO ,  Masaki KUTSUNA

IPC: H05K3/40 ,  H01L23/15 ,  C03C10/00 ,  H05K3/46 ,  C04B35/63 ,  B32B9/00 ,  H05K3/32 ,  H05K3/28 ,  H05K3/12 ,  H05K1/09 ,  H05K1/03 ,  H05K1/02 ,  C03C4/14

Abstract: A method of manufacturing a circuit substrate includes the steps of preparing a conductor paste in which a powder of at least one of a metal boride and a metal silicide is added to a powder of silver (Ag), applying the conductor paste to a surface of a ceramic substrate which has been fired, applying a glass paste to the surface of the ceramic substrate after applying the conductor paste, firing the conductor paste applied to the surface so as to form a conductor trace, and firing the glass paste applied to the surface so as to form a coating layer.

公开(公告)号：US20180035549A1

公开(公告)日：2018-02-01

申请号：US15543253

申请日：2016-01-08

Applicant: NGK SPARK PLUG CO., LTD.

Inventor： Tatsuya KATOH ,  Masanori ITO ,  Masaki KUTSUNA

IPC: H05K3/40 ,  H05K3/32 ,  H05K1/02 ,  H05K1/03

Abstract: A method of manufacturing a circuit substrate includes the steps of preparing a conductor paste in which a powder of at least one of a metal boride and a metal silicide is added to a powder of silver (Ag), applying the conductor paste to a surface of a ceramic substrate which has been fired, applying a glass paste to the surface of the ceramic substrate after applying the conductor paste, firing the conductor paste applied to the surface so as to form a conductor trace, and firing the glass paste applied to the surface so as to form a coating layer.

公开(公告)号：US20180014408A1

公开(公告)日：2018-01-11

申请号：US15543290

申请日：2016-01-08

Applicant: NGK SPARK PLUG CO., LTD.

Inventor： Tatsuya KATOH ,  Masanori ITO ,  Masaki KUTSUNA

IPC: H05K3/12 ,  B32B9/00 ,  H05K3/46 ,  H05K3/40 ,  H05K1/09 ,  H05K1/03

Abstract: A method for manufacturing a ceramic substrate containing glass includes a firing step in which an unfired silver-based conductor material is disposed on an unfired ceramic layer and is fired. The unfired silver-based conductor material contains at least one of a metal boride and a metal silicide.

公开(公告)号：US20180027653A1

公开(公告)日：2018-01-25

申请号：US15542871

申请日：2016-01-08

Applicant: NGK SPARK PLUG CO., LTD.

Inventor： Tatsuya KATOH ,  Masanori ITO ,  Masaki KUTSUNA

IPC: H05K1/03 ,  C03C10/00 ,  C03C4/14 ,  H05K1/09

Abstract: A ceramic substrate includes a ceramic layer mainly formed of a glass ceramic and a conductor trace mainly formed of silver (Ag). In an adjacent region located adjacent to the conductor trace, the concentration of boron atoms (B) contained in the ceramic layer increases toward the conductor trace.