公开(公告)号：US20140318846A1

公开(公告)日：2014-10-30

申请号：US14258984

申请日：2014-04-22

Applicant: NGK Spark Plug Co., Ltd.

Inventor： Takahiro HAYASHI ,  Makoto WAKAZONO ,  Takeshi TOYOSHIMA ,  Makoto NAGAI ,  Makoto ORIGUCHI

IPC: H05K1/11 ,  H05K3/40

CPC classification number: H05K1/144 ,  H01L24/05 ,  H05K3/0014 ,  H05K3/3452 ,  H05K3/3489 ,  H05K2201/099 ,  H05K2203/0577 ,  H05K2203/0594

Abstract: A wiring substrate includes a layered structure including one or more insulating layers and one or more conductor layers; a plurality of connection terminals formed on the layered structure; a first resin layer formed on the layered structure and having (defining) a plurality of first openings through which the connection terminals are respectively exposed; and a second resin layer formed on the first resin layer and having (defining) a plurality of second openings through which the connection terminals are respectively exposed and which are smaller in opening diameter than the first openings, wherein the second resin layer has, around each of the second openings, an inclined surface which is formed such that the distance between the inclined surface and the layered structure decreases toward the second opening.

Abstract translation: 布线基板包括层叠结构，其包括一个或多个绝缘层和一个或多个导体层; 形成在层状结构上的多个连接端子; 形成在所述层状结构上并具有（限定）所述连接端子分别暴露的多个第一开口的第一树脂层; 以及形成在第一树脂层上并具有（限定）多个第二开口的第二树脂层，连接端子分别通过该开口分别露出，并且开口直径小于第一开口，其中第二树脂层在每个 第二开口的倾斜表面形成为使得倾斜表面和层状结构之间的距离朝向第二开口减小。