公开(公告)号：US20190318972A1

公开(公告)日：2019-10-17

申请号：US16347676

申请日：2017-06-12

Applicant: NGK Spark Plug Co., Ltd.

Inventor： Makoto NAGAI

IPC: H01L23/13 ,  H04N5/225 ,  H04N5/369 ,  H01L23/34 ,  H01L27/146

Abstract: Disclosed is a wiring board on which an optical element is mounted in a state of being sealed by a transparent plate, lens or the like while preventing or reducing the occurrence of condensation or freezing on a surface of the transparent plate, lens or the like. In one embodiment, the wiring board includes: a board body formed with opposed front and back surfaces by stacking of a plurality of ceramic layers (insulating layers); and a plurality of optical element-mounting pads disposed on a bottom surface of a cavity open to the front surface of the board body. The wiring board further includes a heater circuit arranged at the front surface of the board body or an interface of the ceramic layers of the board body along a peripheral side in plan view.

公开(公告)号：US20150357277A1

公开(公告)日：2015-12-10

申请号：US14762185

申请日：2013-12-12

Applicant: NGK SPARK PLUG CO., LTD.

Inventor： Makoto NAGAI ,  Seiji MORI ,  Tatsuya ITO ,  Takahiro HAYASHI

IPC: H01L23/498 ,  H01L23/544

CPC classification number: H01L23/49838 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/544 ,  H01L2223/5442 ,  H01L2223/54426 ,  H01L2223/54486 ,  H01L2224/16237 ,  H01L2924/15311 ,  H05K1/141 ,  H05K3/3436 ,  H05K3/3457 ,  H05K3/4007 ,  H05K2201/098 ,  H05K2201/099

Abstract: To provide a wiring substrate which can reliably prevent progress of cracking in a solder bump, and which exhibits improved reliability. The wiring substrate 10 of the present invention includes a substrate main body 11, pads 61, and a solder resist 81. The pads 61 are provided on the substrate back surface 13 of the substrate main body, and have surfaces 62 on which solder bumps 84 employed for connection of a motherboard 91 can be formed. The solder resist 81 covers the substrate back surface 13 of the substrate main body, and has openings 82 through which the pads 61 are exposed. A protrusion 71 is formed on a portion of the surface 62 of each pad 61. The height A4 of the end surface 72 of the protrusion 71, as measured from the surface 62 of the pad 61, is smaller than the depth of each opening 82. The protrusion 71 is provided in the opening 82 such that the peripheral surface 73 of the protrusion 71 faces the inner surface of the opening 82, and the protrusion 71 has a plan-view shape similar to that of the opening 82.

Abstract translation: 提供一种可以可靠地防止焊料凸块的开裂进行的布线基板，其可靠性提高。 本发明的布线基板10包括基板主体11，焊盘61和阻焊剂81.焊盘61设置在基板主体的基板背面13上，并且具有表面62，焊料凸块84 用于连接主板91可以形成。 阻焊剂81覆盖基板主体的基板背面13，并且具有开口82，焊盘61通过该开口82露出。 在每个垫61的表面62的一部分上形成突起71.突起71的端面72的高度A4，从垫61的表面62测量，小于每个开口82的深度 突起71设置在开口82中，使得突起71的周面73面对开口82的内表面，突起71具有与开口82相似的平面形状。

公开(公告)号：US20160095216A1

公开(公告)日：2016-03-31

申请号：US14858409

申请日：2015-09-18

Applicant: NGK SPARK PLUG CO., LTD.

Inventor： Makoto NAGAI ,  Seiji MORI ,  Tatsuya ITO

IPC: H05K1/11 ,  H05K1/03 ,  H05K1/02

CPC classification number: H05K1/11 ,  H01L2224/16225 ,  H05K1/0298 ,  H05K1/0313 ,  H05K1/111 ,  H05K3/3436 ,  H05K3/3452 ,  H05K3/4069 ,  H05K3/4644 ,  Y02P70/611

Abstract: A circuit board is provided that includes an outermost conductor layer including a plurality of terminals for flip-chip bonding and an outermost resin insulating layer defining a first opening and a second opening in an electronic-component mounting region. One of a power supply terminal and a ground terminal is exposed in the first opening. A plurality of signal terminals are exposed in the second opening. The resin insulating layer includes a reinforcing portion that defines an inner bottom surface of the second opening. A height of a portion of the terminal exposed in the first opening, the portion projecting from an inner bottom surface of the first opening, is greater than a height of portions of the terminals exposed in the second opening, the portions projecting from the inner bottom surface of the second opening.

Abstract translation: 提供了一种电路板，其包括最外面的导体层，其包括用于倒装芯片接合的多个端子和限定电子部件安装区域中的第一开口和第二开口的最外层树脂绝缘层。 电源端子和接地端子中的一个在第一开口中露出。 多个信号端子在第二开口中露出。 树脂绝缘层包括限定第二开口的内底面的加强部。 在第一开口中暴露的端子的部分的高度，从第一开口的内底表面突出的部分的高度大于在第二开口中露出的端子的部分的高度，从内底部突出的部分 第二个开口的表面。

公开(公告)号：US20150313015A1

公开(公告)日：2015-10-29

申请号：US14647212

申请日：2013-05-27

Applicant: NGK SPARK PLUG CO., LTD.

Inventor： Hidetoshi WADA ,  Tatsuya ITO ,  Makoto NAGAI

IPC: H05K1/11

CPC classification number: H05K1/11 ,  H01L23/49811 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49844 ,  H01L2924/0002 ,  H05K1/113 ,  H05K3/3436 ,  H05K3/3452 ,  H05K3/4007 ,  H05K3/4644 ,  H05K2201/0347 ,  H05K2201/09536 ,  H05K2201/096 ,  H05K2201/097 ,  H05K2201/09709 ,  H05K2201/09727 ,  H05K2203/0594 ,  H05K2203/0597 ,  H01L2924/00

Abstract: Provided is a wiring substrate which allows connection terminals to be disposed at high density, can increase the degree of freedom of wiring layout, and can enhance the reliability of connection of the connection terminals. A wiring substrate of the present invention includes a laminate which includes one or more insulating layers and one or more conductor layers laminated together; a wiring formed on the laminate; a columnar connection terminal which is formed directly on the wiring and is in contact with at least one of opposite side surfaces of the wiring; and a solder resist layer which covers the wiring and which exposes at least a portion of the connection terminal. The width of the wiring at a position at which the connection terminal is formed is smaller than the length of the connection terminal in the width direction.

Abstract translation: 提供了一种允许以高密度设置连接端子的布线基板，可以增加布线布局的自由度，并且可以提高连接端子的连接的可靠性。 本发明的布线基板包括一层叠体，其包括一层或多层绝缘层和层压在一起的一层或多层导体层; 形成在层压板上的布线; 一个柱形连接端子，其直接形成在布线上并且与布线的相对侧表面中的至少一个相接触; 以及覆盖所述布线并且暴露所述连接端子的至少一部分的阻焊层。 形成连接端子的位置处的配线的宽度小于连接端子在宽度方向上的长度。

公开(公告)号：US20140318846A1

公开(公告)日：2014-10-30

申请号：US14258984

申请日：2014-04-22

Applicant: NGK Spark Plug Co., Ltd.

Inventor： Takahiro HAYASHI ,  Makoto WAKAZONO ,  Takeshi TOYOSHIMA ,  Makoto NAGAI ,  Makoto ORIGUCHI

IPC: H05K1/11 ,  H05K3/40

CPC classification number: H05K1/144 ,  H01L24/05 ,  H05K3/0014 ,  H05K3/3452 ,  H05K3/3489 ,  H05K2201/099 ,  H05K2203/0577 ,  H05K2203/0594

Abstract: A wiring substrate includes a layered structure including one or more insulating layers and one or more conductor layers; a plurality of connection terminals formed on the layered structure; a first resin layer formed on the layered structure and having (defining) a plurality of first openings through which the connection terminals are respectively exposed; and a second resin layer formed on the first resin layer and having (defining) a plurality of second openings through which the connection terminals are respectively exposed and which are smaller in opening diameter than the first openings, wherein the second resin layer has, around each of the second openings, an inclined surface which is formed such that the distance between the inclined surface and the layered structure decreases toward the second opening.

Abstract translation: 布线基板包括层叠结构，其包括一个或多个绝缘层和一个或多个导体层; 形成在层状结构上的多个连接端子; 形成在所述层状结构上并具有（限定）所述连接端子分别暴露的多个第一开口的第一树脂层; 以及形成在第一树脂层上并具有（限定）多个第二开口的第二树脂层，连接端子分别通过该开口分别露出，并且开口直径小于第一开口，其中第二树脂层在每个 第二开口的倾斜表面形成为使得倾斜表面和层状结构之间的距离朝向第二开口减小。

公开(公告)号：US20140097007A1

公开(公告)日：2014-04-10

申请号：US14037496

申请日：2013-09-26

Applicant: NGK Spark Plug Co., Ltd.

Inventor： Makoto NAGAI ,  Seiji MORI ,  Takahiro HAYASHI ,  Tatsuya ITO

IPC: H05K1/02 ,  H05K3/00

CPC classification number: H05K1/0265 ,  H05K3/00 ,  H05K3/3452 ,  H05K3/3484 ,  H05K3/4007 ,  H05K2201/09881 ,  H05K2203/0574

Abstract: Embodiments of the present wiring substrate include a stacked body including one or more insulation layers and one or more conductive layers, wherein the wiring substrate has a plurality of connection terminals formed on the stacked body, each connection terminal has a top surface whose area is smaller than that of each of opposite side surfaces thereof, and a filling member provided in a filling manner between the connection terminals. The top surface of each connection terminal has an area larger than that of a portion of each side surfaces portion exposed from the filling member, and a bonding layer containing a solder is formed on the top surface.

Abstract translation: 本发明的布线基板的具体实施方式包括具有一个以上的绝缘层和一个以上的导电层的层叠体，其中，布线基板具有形成在层叠体上的多个连接端子，各连接端子的面积较小的顶面 比其各个相对侧面的填充构件和填充构件设置在连接端子之间。 每个连接端子的顶表面的面积大于从填充构件露出的每个侧表面部分的部分的面积，并且在顶表面上形成包含焊料的接合层。