公开(公告)号：US20140175705A1

公开(公告)日：2014-06-26

申请号：US14136872

申请日：2013-12-20

Applicant: NGK Spark Plug Co., Ltd.

Inventor： Yousuke MORITA

IPC: B29C59/16

CPC classification number: H05K1/0269 ,  B23K26/048 ,  B23K26/082 ,  B23K26/083 ,  B23K26/361 ,  H05K3/0032 ,  H05K3/28 ,  H05K2201/09936 ,  H05K2203/0571 ,  H05K2203/107 ,  H05K2203/1476

Abstract: A method for manufacturing a substrate includes manufacturing a substrate with an identifying mark having a plurality of elements, the substrate having a laminated construction including a plurality of resin insulating layers. The method includes the steps of: forming a first element of the identifying mark by irradiating the substrate with a laser to create a first plurality of projections in parallel at equal intervals; and forming another element of the identifying mark by irradiating the substrate with a laser to create a second plurality of projections in parallel at equal intervals that do not overlap the first plurality of projections.

Abstract translation: 一种基板的制造方法，其特征在于，制造具有多个元件的识别标记的基板，所述基板具有包含多个树脂绝缘层的叠层结构。 该方法包括以下步骤：通过用激光照射基板来形成识别标记的第一元件，以相等的间隔平行地产生第一多个突起; 以及通过用激光照射所述基板来形成所述识别标记的另一元件，以与所述第一多个突起不重叠的相等间隔平行地产生第二多个突起。