公开(公告)号：US20160307954A1

公开(公告)日：2016-10-20

申请号：US15193760

申请日：2016-06-27

Applicant: NIKON CORPORATION

Inventor： Hirofumi ARIMA ,  Ryoichi SUGANUMA ,  Ryuuzou MOTOORI

IPC: H01L27/146 ,  H04N5/369 ,  H04N5/232 ,  H04N5/225

Abstract: An image-capturing unit includes; an image-capturing chip; a power supply circuit unit that outputs electrical power to be fed to the image-capturing chip; a power supply line that feeds electrical power from the power supply circuit unit to the image-capturing chip; a disconnecting unit that is provided to the power supply line and is electrically disconnecting the power supply circuit unit and the image-capturing chip when a leakage current of the image-capturing chip is measured; and an implementation substrate on which the power supply circuit unit, the image-capturing chip, the power supply line and the disconnecting unit are implemented.

Abstract translation: 图像捕获单元包括： 图像捕捉芯片; 输出要被馈送到图像捕获芯片的电力的电源电路单元; 电源线，其将来自所述电源电路单元的电力馈送到所述图像捕获芯片; 当测量图像捕获芯片的漏电流时，提供给电源线并断开电源电路单元和图像捕获芯片的断开单元; 以及其上实现了电源电路单元，图像捕获芯片，电源线和断开单元的实现基板。

公开(公告)号：US20170374735A1

公开(公告)日：2017-12-28

申请号：US15679340

申请日：2017-08-17

Applicant: NIKON CORPORATION

Inventor： Ryoichi SUGANUMA ,  Hirofumi ARIMA ,  Satoru SUZUKI ,  Takuya SATO

IPC: H05K1/02 ,  H01L27/146 ,  H04N5/225 ,  H05K1/18 ,  H05K3/46 ,  H05K1/05 ,  H05K1/11 ,  H05K3/44 ,  H05K1/03

CPC classification number: H05K1/0271 ,  H01L27/14618 ,  H01L27/14636 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/15153 ,  H01L2924/1531 ,  H01L2924/16195 ,  H04N5/2253 ,  H05K1/0206 ,  H05K1/0283 ,  H05K1/0366 ,  H05K1/05 ,  H05K1/056 ,  H05K1/111 ,  H05K1/181 ,  H05K3/445 ,  H05K3/4608 ,  H05K2201/0133 ,  H05K2201/068 ,  H05K2201/10015 ,  H05K2201/10121 ,  H01L2924/00014

Abstract: A substrate comprises: a first insulating layer; a second insulating layer having an elastic modulus that is different from an elastic modulus of the first insulating layer; and a core layer that is sandwiched by the first insulating layer and the second insulating layer, and is more rigid than the first insulating layer and the second insulating layer.

公开(公告)号：US20140339668A1

公开(公告)日：2014-11-20

申请号：US14454475

申请日：2014-08-07

Applicant: NIKON CORPORATION

Inventor： Hirofumi ARIMA ,  Ryoichi SUGANUMA ,  Takuya SATO ,  Satoru SUZUKI

IPC: H01L23/34 ,  H01L27/146

CPC classification number: H01L23/34 ,  H01L23/4006 ,  H01L27/14601 ,  H01L27/14618 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/16195 ,  H04N5/2253 ,  H04N5/2257 ,  H01L2924/00014

Abstract: An imaging unit comprising an imaging chip and a mounting substrate that has the imaging chip mounted thereon and includes a first metal layer for outputting a signal generated by the imaging chip to the outside. An imaging apparatus comprises an imaging unit that includes an imaging chip and a mounting substrate that has the imaging chip mounted thereon and includes a first metal layer for outputting a signal generated by the imaging chip to the outside.

Abstract translation: 一种成像单元，包括具有安装在其上的成像芯片的成像芯片和安装基板，并且包括用于将由成像芯片产生的信号输出到外部的第一金属层。 一种成像装置包括成像单元，其包括成像芯片和安装有成像芯片的安装基板，并且包括用于将由成像芯片产生的信号输出到外部的第一金属层。

公开(公告)号：US20210337142A1

公开(公告)日：2021-10-28

申请号：US17368062

申请日：2021-07-06

Applicant: NIKON CORPORATION

Inventor： Hirofumi ARIMA ,  Ryoichi SUGANUMA ,  Ryuuzou MOTOORI

IPC: H04N5/357 ,  H01L27/146 ,  H04N5/225 ,  H04N5/369 ,  G01R31/30 ,  H04N5/232 ,  H04N5/361

Abstract: An image-capturing unit includes: an image-capturing chip; a power supply circuit unit that outputs electrical power to be fed to the image-capturing chip; a power supply line that feeds electrical power from the power supply circuit unit to the image-capturing chip; a disconnecting unit that is provided to the power supply line and is electrically disconnecting the power supply circuit unit and the image-capturing chip when a leakage current of the image-capturing chip is measured; and an implementation substrate on which the power supply circuit unit, the image-capturing chip, the power supply line and the disconnecting unit are implemented.

公开(公告)号：US20200273902A1

公开(公告)日：2020-08-27

申请号：US16872674

申请日：2020-05-12

Applicant: NIKON CORPORATION

Inventor： Hirofumi ARIMA ,  Ryoichi SUGANUMA ,  Ryuuzou MOTOORI

IPC: H01L27/146 ,  H04N5/225 ,  H04N5/369 ,  G01R31/30 ,  H04N5/232 ,  H04N5/361 ,  H04N5/357

Abstract: An image-capturing unit includes: an image-capturing chip; a power supply circuit unit that outputs electrical power to be fed to the image-capturing chip; a power supply line that feeds electrical power from the power supply circuit unit to the image-capturing chip; a disconnecting unit that is provided to the power supply line and is electrically disconnecting the power supply circuit unit and the image-capturing chip when a leakage current of the image-capturing chip is measured; and an implementation substrate on which the power supply circuit unit, the image-capturing chip, the power supply line and the disconnecting unit are implemented.

公开(公告)号：US20190237380A1

公开(公告)日：2019-08-01

申请号：US16382604

申请日：2019-04-12

Applicant: NIKON CORPORATION

Inventor： Hirofumi ARIMA ,  Ryoichi SUGANUMA ,  Takuya SATO ,  Satoru SUZUKI

IPC: H01L23/34 ,  H01L27/146 ,  H01L23/40 ,  H04N5/225

CPC classification number: H01L23/34 ,  H01L23/4006 ,  H01L27/14601 ,  H01L27/14618 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/16195 ,  H04N5/2253 ,  H04N5/2257 ,  H01L2924/00014

Abstract: An imaging unit comprising an imaging chip and a mounting substrate that has the imaging chip mounted thereon and includes a first metal layer for outputting a signal generated by the imaging chip to the outside. An imaging apparatus comprises an imaging unit that includes an imaging chip and a mounting substrate that has the imaging chip mounted thereon and includes a first metal layer for outputting a signal generated by the imaging chip to the outside.

公开(公告)号：US20150181698A1

公开(公告)日：2015-06-25

申请号：US14579108

申请日：2014-12-22

Applicant: NIKON CORPORATION

Inventor： Ryoichi SUGANUMA ,  Hirofumi ARIMA ,  Satoru SUZUKI ,  Takuya SATO

IPC: H05K1/02 ,  H05K1/11 ,  H05K1/05 ,  H05K1/03 ,  H01L27/146 ,  H05K1/18

CPC classification number: H05K1/0271 ,  H01L27/14618 ,  H01L27/14636 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/15153 ,  H01L2924/1531 ,  H01L2924/16195 ,  H04N5/2253 ,  H05K1/0206 ,  H05K1/0283 ,  H05K1/0366 ,  H05K1/05 ,  H05K1/056 ,  H05K1/111 ,  H05K1/181 ,  H05K3/445 ,  H05K3/4608 ,  H05K2201/0133 ,  H05K2201/068 ,  H05K2201/10015 ,  H05K2201/10121 ,  H01L2924/00014

Abstract: A substrate comprises: a first insulating layer; a second insulating layer having an elastic modulus that is different from an elastic modulus of the first insulating layer; and a core layer that is sandwiched by the first insulating layer and the second insulating layer, and is more rigid than the first insulating layer and the second insulating layer.

Abstract translation: 基板包括：第一绝缘层; 具有与第一绝缘层的弹性模量不同的弹性模量的第二绝缘层; 以及由第一绝缘层和第二绝缘层夹持的芯层，并且比第一绝缘层和第二绝缘层更刚性。