公开(公告)号：US20190327396A1

公开(公告)日：2019-10-24

申请号：US16458164

申请日：2019-06-30

Applicant: NINGBO SUNNY OPOTECH CO., LTD.

Inventor： Mingzhu WANG ,  Bojie ZHAO ,  Feifan CHEN ,  Liang DING ,  Nan GUO ,  Ye WU ,  Heng JIANG

IPC: H04N5/225

Abstract: A camera module includes an optical lens, a photosensitive chip and an electrical support. The electrical support includes a circuit module embedded in a support body to form an integral structure, a connecting member provided on the support body to electrically connect with the circuit module, and a camera component coupled at the support body and electrically connected to the connecting member. Therefore, the electrical support not only forms a circuit board to electrically connect with the camera component but only serves as a base to support the camera component.

公开(公告)号：US20190020798A1

公开(公告)日：2019-01-17

申请号：US15780534

申请日：2016-12-01

Applicant: NINGBO SUNNY OPOTECH CO., LTD.

Inventor： Mingzhu WANG ,  Baozhong ZHANG ,  Zhen HUANG ,  Feifan CHEN ,  Nan GUO ,  Zhenyu CHEN ,  Ye WU

IPC: H04N5/225 ,  G02B7/04 ,  H05K3/30 ,  H05K3/34

Abstract: The present disclosure provides a camera module and an electrical bracket thereof. The electrical bracket is provided with a clear aperture. The electrical bracket not only has the functions of a conventional circuit board (conduction of the electrical signal of an electronic device such as a chip and a motor), but also has the effects of a conventional base to support an optical filter and serve as a motor base bracket.

公开(公告)号：US20230083133A1

公开(公告)日：2023-03-16

申请号：US17986436

申请日：2022-11-14

Applicant: NINGBO SUNNY OPOTECH CO., LTD.

Inventor： Mingzhu WANG ,  Nan GUO ,  Zhenyu CHEN ,  Bojie ZHAO ,  Takehiko TANAKA ,  Feifan CHEN ,  Ye WU

IPC: H04N5/225 ,  G01N15/06 ,  G03B17/02 ,  H04M1/02

Abstract: The present disclosure provides a camera module, a circuit board assembly and a manufacturing method thereof, and an electronic device with the camera module, wherein the circuit board assembly comprises at least one electronic component, a substrate, and a molding unit. At least one of the electronic components is connected to the substrate conductively on a back face of the substrate. The molding unit comprises a back molding portion and a molding base, wherein the molding base is bonded to a front face of the substrate integrally when the back molding portion is bonded to at least a part of an area of the back face of the substrate integrally. There may be no need to reserve a position on the front face of the substrate to conductively connect the electronic components, so that the length and width of the camera module can be reduced, thereby reducing the volume of the camera module.

公开(公告)号：US20210250474A1

公开(公告)日：2021-08-12

申请号：US17242211

申请日：2021-04-27

Applicant: NINGBO SUNNY OPOTECH CO., LTD.

Inventor： Mingzhu WANG ,  Bojie ZHAO ,  Feifan CHEN ,  Liang DING ,  Nan GUO ,  Ye WU ,  Heng JIANG

IPC: H04N5/225 ,  H01L27/146

Abstract: A camera module includes an optical lens, a light-sensitive chip and an electrical support. The electrical support includes a circuit module embedded in a support body to form an integral structure, a connecting member provided on the support body to electrically connect with the circuit module, and a camera component coupled at the support body and electrically connected to the connecting member. Therefore, the electrical support not only forms a circuit board to electrically connect with the camera component but only serves as a base to support the camera component.

公开(公告)号：US20220303437A1

公开(公告)日：2022-09-22

申请号：US17829721

申请日：2022-06-01

Applicant: Ningbo Sunny Opotech Co., Ltd.

Inventor： Mingzhu WANG ,  Zhenyu CHEN ,  Zhongyu LUAN ,  Zhen HUANG ,  Nan GUO ,  Fengsheng XI ,  Takehiko TANAKA ,  Bojie ZHAO ,  Heng JIANG ,  Ye WU ,  Zilong DENG

IPC: H04N5/225 ,  H05K1/02

Abstract: A photosensitive component, and a camera module and a manufacturing method therefor. The photosensitive component comprises at least a photosensitive element, at least a window-form circuit board and at least a packaging body, wherein the photosensitive element and the window-form circuit board are integrally packaged through the packaging body. The window-form circuit board comprises a circuit board main body which comprises at least one window arranged thereon, wherein the photosensitive element is arranged within the window.

公开(公告)号：US20170142303A1

公开(公告)日：2017-05-18

申请号：US15057057

申请日：2016-02-29

Applicant: NINGBO SUNNY OPOTECH CO., LTD.

Inventor： Mingzhu WANG ,  Bojie ZHAO ,  Feifan CHEN ,  Liang DING ,  Nan GUO ,  Ye WU ,  Heng JIANG

IPC: H04N5/225

CPC classification number: H04N5/2253 ,  H01L27/14618 ,  H04N5/2252

Abstract: A camera module includes an optical lens, a photosensitive sensor and an electrical support. The electrical support includes a circuit arrangement embedded in a support body to form an integral structure, a connecting member provided on the support body to electrically connect with the circuit arrangement, and a camera component coupled at the support body and electrically connected to the connecting member. Therefore, the electrical support riot only forms a circuit board to electrically connect with the camera component but only serves as a base to support the camera component.

公开(公告)号：US20170134624A1

公开(公告)日：2017-05-11

申请号：US15127412

申请日：2014-05-13

Applicant: NINGBO SUNNY OPOTECH CO., LTD

Inventor： Baozhong ZHANG ,  Bojie ZHAO ,  Ye WU ,  Wei GUO

IPC: H04N5/225 ,  H05K3/22 ,  G03B17/55

CPC classification number: H04N5/2254 ,  G03B17/55 ,  G03B2217/007 ,  H04N5/2253 ,  H04N5/2257 ,  H05K3/22

Abstract: A camera module includes an optical lens unit and a light sensing unit. The light sensing unit is provided along a light outgoing path of the optical lens unit so that the light sensing unit is able to sense light emitted from the optical lens unit. The light sensing unit further includes a photoelectric converting element and a conducting unit connected to the photoelectric converting element. The conducting unit transfers electrical signals converted and generated during operation of the photoelectric converting element, and conducts heat generated during operation of the photoelectric converting element outside.

公开(公告)号：US20210306530A1

公开(公告)日：2021-09-30

申请号：US16322946

申请日：2017-06-02

Applicant: NINGBO SUNNY OPOTECH CO., LTD.

Inventor： Mingzhu WANG ,  Zhenyu CHEN ,  Zhongyu LUAN ,  Zhen HUANG ,  Nan GUO ,  Fengsheng XI ,  Takehiko TANAKA ,  Bojie ZHAO ,  Heng JIANG ,  Ye WU ,  Zilong DENG

IPC: H04N5/225 ,  H05K1/02

Abstract: A photosensitive component, and a camera module and a manufacturing method therefor. The photosensitive component comprises at least a photosensitive element, at least a window-form circuit board and at least a packaging body, wherein the photosensitive element and the window-form circuit board are integrally packaged through the packaging body. The window-form circuit board comprises a circuit board main body which comprises at least one window arranged thereon, wherein the photosensitive element is arranged within the window.

公开(公告)号：US20200321381A1

公开(公告)日：2020-10-08

申请号：US16909290

申请日：2020-06-23

Applicant: Ningbo Sunny Opotech Co., Ltd.

Inventor： Mingzhu WANG ,  Nan GUO ,  Zhenyu CHEN ,  Bojie ZHAO ,  Takehiko TANAKA ,  Feifan CHEN ,  Ye WU

IPC: H01L27/146 ,  H01L31/0203

Abstract: A method for manufacturing a semiconductor module for an image-sensing device is disclosed. The method may comprise forming a first molding component on a first surface of a printed circuit board (PCB); mounting at least a photosensitive member to a second surface of the PCB; and forming a second molding component on the second surface of the PCB. The PCB may comprise at least an electric component on the first surface of the PCB. The first molding component may encapsulate the at least one electric component with the PCB. The second molding component may secure the photosensitive member on the PCB.

公开(公告)号：US20170142304A1

公开(公告)日：2017-05-18

申请号：US15057063

申请日：2016-02-29

Applicant: NINGBO SUNNY OPOTECH CO., LTD.

Inventor： Mingzhu WANG ,  Bojie ZHAO ,  Feifan CHEN ,  Liang DING ,  Nan GUO ,  Ye WU ,  Heng JIANG

IPC: H04N5/225

CPC classification number: H04N5/2253 ,  H04N5/2252

Abstract: A camera module includes an optical lens, a photosensitive chip and an electrical support. The electrical support includes a circuit module embedded in a support body to form an integral structure, a connecting member provided on the support body to electrically connect with the circuit module, and a camera component coupled at the support body and electrically connected to the connecting member. Therefore, the electrical support not only forms a circuit board to electrically connect with the camera component but only serves as a base to support the camera component.