公开(公告)号：US20210403759A1

公开(公告)日：2021-12-30

申请号：US17474253

申请日：2021-09-14

Applicant: NITTO DENKO CORPORATION

Inventor： Akiko YOSHIDA ,  Kenichi OKADA ,  Koji AKAZAWA

IPC: C09J5/04 ,  C09J163/00 ,  C09J7/30 ,  C09J7/10 ,  C09J7/40

Abstract: An adhesion method including: a step (1), disposing a stickable-curable adhesive layer on a first adherend; a step (2), disposing a curing agent layer on a second adherend, the curing agent layer being able to cure the stickable-curable adhesive layer by contacting and reacting with the stickable-curable adhesive layer; and a step (3), bringing the stickable-curable adhesive layer into contact with the curing agent layer so that they are sandwiched by the first adherend and the second adherend.

公开(公告)号：US20180327635A1

公开(公告)日：2018-11-15

申请号：US15773586

申请日：2016-10-31

Applicant: NITTO DENKO CORPORATION

Inventor： Akiko YOSHIDA ,  Kenichi OKADA ,  Koji AKAZAWA

IPC: C09J5/04 ,  C09J7/40 ,  C09J163/00

CPC classification number: C09J5/04 ,  C09J7/00 ,  C09J7/403 ,  C09J7/405 ,  C09J11/06 ,  C09J163/00

Abstract: An adhesion method including: a step (1), disposing a stickable-curable adhesive layer on a first adherend; a step (2), disposing a curing agent layer on a second adherend, the curing agent layer being able to cure the stickable-curable adhesive layer by contacting and reacting with the stickable-curable adhesive layer; and a step (3), bringing the stickable-curable adhesive layer into contact with the curing agent layer so that they are sandwiched by the first adherend and the second adherend.