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公开(公告)号：US20210265096A1
公开(公告)日：2021-08-26
申请号：US17253793
申请日：2019-06-04
Applicant: NITTO DENKO CORPORATION
Inventor： Yoshihiro FURUKAWA , Keisuke OKUMURA
IPC: H01F27/255 , H01F17/04 , H01F27/28 , H01F1/12
Abstract: An inductor includes a wire having a generally circular shape in cross section, and the magnetic layer covering the wire, wherein the wire includes a conductive wire and an insulating layer covering the conductive wire, the magnetic layer contains anisotropic magnetic particles and a binder, and includes in a surrounding region of the wire within 1.5 times the radius of the wire, a first region in which the anisotropic magnetic particles are oriented along the circumferential direction of the wire, and a second region in which the anisotropic magnetic particles are oriented along the crossing direction that crosses the circumferential direction, or in which the anisotropic magnetic particles are not oriented.
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公开(公告)号：US20180199443A1
公开(公告)日：2018-07-12
申请号：US15741940
申请日：2016-06-01
Applicant: NITTO DENKO CORPORATION
Inventor： Keisuke OKUMURA , Eiji TOYODA , Shotaro MASUDA
CPC classification number: H05K3/20 , H05K1/0283 , H05K3/108 , H05K3/22 , H05K2201/0133 , H05K2201/0376
Abstract: A method for producing a wired circuit board includes a step (1) of forming a seed layer on one surface in a thickness direction of a peeling layer, a step (2) of forming a conductive pattern on one surface in the thickness direction of the seed layer, a step (3) of covering the seed layer and the conductive pattern with an insulating layer, a step (4) of peeling the peeling layer from the seed layer, and a step (5) of removing the seed layer. The insulating layer has the number of times of folding endurance measured in conformity with JIS P8115 (2001) of 10 times or more.
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公开(公告)号：US20220285091A1
公开(公告)日：2022-09-08
申请号：US17633449
申请日：2020-06-19
Applicant: NITTO DENKO CORPORATION
Inventor： Keisuke OKUMURA , Yoshihiro FURUKAWA
Abstract: A method for producing an inductor includes a first step of preparing a heat press machine and a second step. The heat press machine includes a first mold; a second mold separated from the first mold by an interval therebetween, and smaller than the first mold; an internal frame member surrounding a periphery of the second mold, separated from the first mold by an interval therebetween in a press direction, and movable with respect to the second mold in the press direction; and a fluid and flexible sheet disposed on a second press surface of the second mold. In the second step, a magnetic sheet containing magnetic particles and a thermosetting resin and a plurality of wires separated from each other by an interval therebetween are heat pressed by the heat press machine.
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公开(公告)号：US20200066441A1
公开(公告)日：2020-02-27
申请号：US16466720
申请日：2017-11-16
Applicant: NITTO DENKO CORPORATION
Inventor： Yoshihiro FURUKAWA , Keisuke OKUMURA
Abstract: A method for producing a module includes a first step of preparing a seed layer disposed at a one-side surface in a thickness direction of a first peeling layer, a second step of forming a conductive pattern at a one-side surface in the thickness direction of the seed layer by plating allowing electric power to be supplied from the seed layer, a third step of pushing the conductive pattern into a first adhesive layer containing a first magnetic particle, and a fourth step of exposing the other-side surfaces in the thickness direction of the conductive pattern and the first adhesive layer.
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公开(公告)号：US20190051807A1
公开(公告)日：2019-02-14
申请号：US15777134
申请日：2016-10-04
Applicant: NITTO DENKO CORPORATION
Inventor： Keisuke OKUMURA , Satoshi HONDA
Abstract: Provided is a semiconductor device manufacturing method which can suppress the occurrence of positional deviation or inclination of a semiconductor element when the semiconductor element is fixed so as to be sandwiched-between two insulating substrates. The semiconductor device manufacturing method includes: obtaining a laminated body in which a semiconductor element is temporarily adhered on a first electrode formed on a first insulating substrate with a first pre-sintering layer sandwiched therebetween; temporarily adhering the semiconductor element on a second electrode formed on a second insulating substrate with a second pre-sintering layer sandwiched therebetween, the second pre-sintering layer being provided on a side opposite to the first pre-sintering layer, to obtain a semiconductor device precursor; and simultaneously heating the first pre-sintering layer and the second pre-sintering layer, to bond the semiconductor element to the first electrode and the second electrode.
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Patent Agency Ranking
公开(公告)号：US20250149225A1
公开(公告)日：2025-05-08
申请号：US18837113
申请日：2023-02-14
Applicant: NITTO DENKO CORPORATION
Inventor： Yoshihiro FURUKAWA , Keisuke OKUMURA
IPC: H01F17/06 , H01F41/061
Abstract: An inductor includes a magnetic sheet and a conductive portion. The magnetic sheet has a penetration hole. The penetration hole is along a thickness direction. The penetration hole is open toward one side and the other side in the thickness direction. The magnetic sheet contains a cured resin and magnetic particles. The conductive portion is filled in the penetration hole. The conductive portion is along the thickness direction of the magnetic sheet.
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公开(公告)号：US20220165481A1
公开(公告)日：2022-05-26
申请号：US17437663
申请日：2020-02-05
Applicant: NITTO DENKO CORPORATION
Inventor： Keisuke OKUMURA , Yoshihiro FURUKAWA
Abstract: An inductor includes a wire, and a magnetic layer having a sheet shape and for embedding the wire. The wire includes a conducting wire, and an insulating film disposed on a conducting wire circumferential surface of the conducting wire. The magnetic layer contains an anisotropic magnetic particle at a ratio of 40% by volume or more. Of a first plane section, a second plane section, and a third plane section along a plane direction of the magnetic layer described below, when viewed in at least each of the two plane sections, in a first direction perpendicular to a flow direction and a thickness direction, an orientated region in which the anisotropic magnetic particle is orientated in the flow direction is observed in a vicinity region within 50 μm from a first directional outer end edge of the insulating film outwardly.
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公开(公告)号：US20210257149A1
公开(公告)日：2021-08-19
申请号：US17174997
申请日：2021-02-12
Applicant: NITTO DENKO CORPORATION
Inventor： Keisuke OKUMURA , Yoshihiro FURUKAWA
Abstract: A mark-including inductor includes a sheet-shaped inductor including a plurality of wirings and a magnetic layer embedding the plurality of wirings, and a mark disposed at one side in a thickness direction of the inductor and/or formed in the magnetic layer.
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公开(公告)号：US20210037640A1
公开(公告)日：2021-02-04
申请号：US17044448
申请日：2019-04-02
Applicant: NITTO DENKO CORPORATION
Inventor： Yoshihiro FURUKAWA , Keisuke OKUMURA
IPC: H05K1/02
Abstract: A magnetic wiring circuit board includes an insulating layer, a plurality of wiring portions spaced from each other, a magnetic layer disposed so as to embed the plurality of wiring portions on the, and a suppressing portion for suppressing magnetic coupling of at least the two wiring portions.
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公开(公告)号：US20200075238A1
公开(公告)日：2020-03-05
申请号：US16467175
申请日：2017-11-16
Applicant: NITTO DENKO CORPORATION
Inventor： Keisuke OKUMURA , Yoshihiro FURUKAWA
Abstract: A method for producing a module includes a first step of preparing a conductive layer disposed at one side in a thickness direction of a first peeling layer, a second step of forming a conductive pattern from the conductive layer, a third step of pushing the conductive pattern into a first adhesive layer containing a first magnetic particle and a first resin component, and a fourth step of peeling the first peeling layer.
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