公开(公告)号：US20250034433A1

公开(公告)日：2025-01-30

申请号：US18710884

申请日：2022-11-17

Applicant: NITTO DENKO CORPORATION

Inventor： Kosuke MORITA ,  Yoshio NAKAGAWA ,  Tomohito HARADA

IPC: C09J7/24

Abstract: Provided is a PSA tape comprising a substrate layer formed of a polyvinyl chloride film, and a PSA layer on at least one side of the substrate layer. The substrate layer comprises polyvinyl chloride, a plasticizer, and an elastomer. The elastomer comprises at least a thermoplastic polyurethane or a thermoplastic polyester elastomer.

公开(公告)号：US20230037303A1

公开(公告)日：2023-02-09

申请号：US17789081

申请日：2020-12-24

Applicant: NITTO DENKO CORPORATION

Inventor： Kosuke MORITA

IPC: C09J7/10 ,  C09J7/38 ,  C09J5/00

Abstract: Provided is a sealing method that uses a photo-curable sealant sheet. The sealing method provided comprises, in the following order, a step of obtaining a photo-curable sealant sheet, a step of subj ecting the sealant sheet to photoirradiation, and a step of applying the sealant sheet to a target object.

公开(公告)号：US20210122958A1

公开(公告)日：2021-04-29

申请号：US17254951

申请日：2019-06-26

Applicant: NITTO DENKO CORPORATION

Inventor： Kosuke MORITA

IPC: C09K3/10 ,  C08G75/14 ,  C08G59/14

Abstract: Provided is a sealant sheet formed in a sheet shape. The sealant sheet comprises an epoxy group-containing polysulfide polymer (AB) having two or more epoxy groups per molecule, and a thiol compound (C) having two or more thiol groups per molecule. In the sealant sheet, sulfur atoms in organic components of the sealant sheet has a weight fraction of 32.0% or higher and 36.0% or lower.

公开(公告)号：US20210122956A1

公开(公告)日：2021-04-29

申请号：US17254973

申请日：2019-06-26

Applicant: NITTO DENKO CORPORATION

Inventor： Kosuke MORITA

IPC: C09J181/04 ,  C08G75/14 ,  C08K3/34 ,  C08K3/40

Abstract: Provided is a sealant sheet formed in a sheet shape. The sealant sheet comprises an epoxy group-containing polysulfide polymer (AB) having two or more epoxy groups per molecule, a thiol compound (C) having two or more thiol groups per molecule, and a photobase generator (D); or a thiol group-containing polysulfide polymer (AC) having two or more thiol groups per molecule, an epoxy compound (B) having two or more epoxy groups per molecule, and a photobase generator (D).

公开(公告)号：US20200291184A1

公开(公告)日：2020-09-17

申请号：US16767844

申请日：2018-11-29

Applicant: NITTO DENKO CORPORATION

Inventor： Kosuke MORITA ,  Kazuhiro KITAYAMA

IPC: C08G75/12 ,  C08L63/04 ,  B32B7/06 ,  B32B27/28

Abstract: Provided is a sealant sheet formed as a sheet. The sealant sheet comprises an epoxy group-containing polysulfide. The epoxy group-containing polysulfide has a disulfide structure and an epoxy group in its molecule.

公开(公告)号：US20160035640A1

公开(公告)日：2016-02-04

申请号：US14782289

申请日：2014-03-27

Applicant: NITTO DENKO CORPORATION

Inventor： Kosuke MORITA ,  Naohide TAKAMOTO ,  Hiroyuki HANAZONO ,  Akihiro FUKUI

IPC: H01L23/31 ,  C09J7/02 ,  H01L21/56

CPC classification number: H01L23/3157 ,  C09J7/38 ,  C09J2201/606 ,  H01L21/563 ,  H01L21/6836 ,  H01L23/295 ,  H01L24/13 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/81 ,  H01L2221/68327 ,  H01L2221/68336 ,  H01L2221/6834 ,  H01L2221/68377 ,  H01L2221/68381 ,  H01L2221/68386 ,  H01L2224/11002 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/14181 ,  H01L2224/16238 ,  H01L2224/16268 ,  H01L2224/27003 ,  H01L2224/27436 ,  H01L2224/2929 ,  H01L2224/29298 ,  H01L2224/29386 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/75753 ,  H01L2224/8113 ,  H01L2224/81193 ,  H01L2224/81203 ,  H01L2224/83191 ,  H01L2224/83862 ,  H01L2224/9211 ,  H01L2224/94 ,  H01L2224/11 ,  H01L2224/27 ,  H01L2924/0103 ,  H01L2924/01083 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2924/01082 ,  H01L2924/05432 ,  H01L2924/207 ,  H01L2224/81 ,  H01L2224/83

Abstract: The present invention provides an underfill film and a sealing sheet that are excellent in thermal conductive property and are capable of satisfactorily filling the space between the semiconductor element and the substrate. The present invention relates to an underfill film having a resin and a thermally conductive filler, in which a content of the thermally conductive filler is 50% by volume or more, an average particle size of the thermally conductive filler is 30% or less of a thickness of the underfill film, and a maximum particle size of the thermally conductive filler is 80% or less of the thickness of the underfill film.

Abstract translation: 本发明提供了导热性优异且能令人满意地填充半导体元件与基板之间的空间的底部填充膜和密封片。 本发明涉及一种具有树脂和导热性填料的底部填充膜，其中导热填料的含量为50体积％以上，导热性填料的平均粒径为30质量％以下 底部填充膜的厚度，导热性填料的最大粒径为底部填充膜的厚度的80％以下。

公开(公告)号：US20230040609A1

公开(公告)日：2023-02-09

申请号：US17789015

申请日：2020-12-24

Applicant: NITTO DENKO CORPORATION

Inventor： Kosuke MORITA

IPC: C09J7/30 ,  C09J7/40 ,  C09J5/00 ,  C09K3/10 ,  B32B7/06 ,  B32B27/28

Abstract: Provided is a sealant sheet that is handled as a laminate with a release liner and can be cured by photoirradiation through the release liner. The release-linered sealant sheet has a photo-curable sealant: sheet, and a release liner placed on at least one face of the sealant sheet. The release liner has a light transmittance of 20% or higher in the wavelength range from 350 nm to 450 non.

公开(公告)号：US20170306185A1

公开(公告)日：2017-10-26

申请号：US15517044

申请日：2015-10-01

Applicant: NITTO DENKO CORPORATION

Inventor： Kosuke MORITA ,  Shuuhei YAMAMOTO ,  Takafumi HIDA ,  Shigeki MUTA ,  Kiichiro MATSUSHITA

IPC: C09J7/02 ,  C25D11/02 ,  C25D11/08 ,  C09J107/00

CPC classification number: C25D11/022 ,  C09J7/20 ,  C09J7/22 ,  C09J7/25 ,  C09J7/255 ,  C09J7/28 ,  C09J7/38 ,  C09J107/00 ,  C09J2201/606 ,  C09J2203/31 ,  C09J2400/163 ,  C09J2407/00 ,  C09J2423/106 ,  C09J2425/00 ,  C09J2453/00 ,  C09J2467/006 ,  C09J2481/006 ,  C09J2493/00 ,  C09J2495/00 ,  C25D11/00 ,  C25D11/02 ,  C25D11/04 ,  C25D11/08

Abstract: Provided is a masking sheet for anodizing, the masking sheet comprising a substrate having first and second faces, and a PSA layer placed on the first face side of the substrate. Here, the substrate is a non-metal substrate. The elastic modulus Et′ of the masking sheet and the thickness Hs of the substrate satisfy the next relation 0.7 N/mm

公开(公告)号：US20170292042A1

公开(公告)日：2017-10-12

申请号：US15516990

申请日：2015-10-01

Applicant: NITTO DENKO CORPORATION

Inventor： Kosuke MORITA ,  Shuuhei YAMAMOTO ,  Takafumi HIDA ,  Shigeki MUTA ,  Kiichiro MATSUSHITA

IPC: C09J7/02 ,  C25D11/04 ,  C25D11/02

CPC classification number: C25D11/022 ,  C09J7/20 ,  C09J7/22 ,  C09J7/25 ,  C09J7/255 ,  C09J7/28 ,  C09J7/38 ,  C09J107/00 ,  C09J2201/606 ,  C09J2203/31 ,  C09J2400/163 ,  C09J2407/00 ,  C09J2423/106 ,  C09J2425/00 ,  C09J2453/00 ,  C09J2467/006 ,  C09J2481/006 ,  C09J2493/00 ,  C09J2495/00 ,  C25D11/00 ,  C25D11/02 ,  C25D11/04 ,  C25D11/08

Abstract: Provided is a masking sheet for chemical solution treatment, the masking sheet comprising a substrate having first and second faces, and a PSA layer placed on the first face side of the substrate. The masking sheet is constituted so that penetration of a chemical solution is visually detectable when inspected from the outer face of the masking sheet.

公开(公告)号：US20230054230A1

公开(公告)日：2023-02-23

申请号：US17789068

申请日：2020-12-24

Applicant: NITTO DENKO CORPORATION

Inventor： Kosuke MORITA

IPC: C09J7/24 ,  C09J7/40 ,  B32B27/36 ,  B32B27/32 ,  B32B27/30

Abstract: Provided is a sealant sheet that shows reduced elongation during application to a target object. A laminate comprising a sealant sheet is provided. The laminate has a support layer satisfying the formula (1): E′×t≥1×104 (N/m). In the formula (1), E′ is the support layer's modulus (MPa) and t is the support layer's thickness (μm).