公开(公告)号：US20170140974A1

公开(公告)日：2017-05-18

申请号：US15349172

申请日：2016-11-11

Applicant: NITTO DENKO CORPORATION

Inventor： Ryuichi KIMURA ,  Naohide TAKAMOTO

IPC: H01L21/683 ,  B32B7/12 ,  H01L21/78

CPC classification number: H01L21/6836 ,  B32B7/06 ,  B32B7/12 ,  B32B25/08 ,  B32B25/12 ,  B32B25/14 ,  B32B25/18 ,  B32B27/08 ,  B32B27/18 ,  B32B27/20 ,  B32B27/26 ,  B32B27/281 ,  B32B27/308 ,  B32B27/34 ,  B32B27/36 ,  B32B27/365 ,  B32B27/38 ,  B32B27/40 ,  B32B27/42 ,  B32B2250/04 ,  B32B2255/26 ,  B32B2255/28 ,  B32B2264/10 ,  B32B2264/102 ,  B32B2264/104 ,  B32B2264/105 ,  B32B2264/107 ,  B32B2307/306 ,  B32B2307/3065 ,  B32B2307/402 ,  B32B2307/4026 ,  B32B2307/50 ,  B32B2307/51 ,  B32B2307/732 ,  B32B2307/748 ,  B32B2457/00 ,  B32B2457/14 ,  H01L21/6835 ,  H01L21/78 ,  H01L23/544 ,  H01L23/562 ,  H01L2221/68327 ,  H01L2221/68377 ,  H01L2223/54486 ,  H01L2224/16225

Abstract: [PROBLEM] To provide a laminated body and so forth that makes it possible to prevent pieces of post-dicing semiconductor backside protective film from sticking to one another.[SOLUTION MEANS] This relates to a laminated body comprising a two-sided adhesive sheet and a semiconductor backside protective film arranged over the two-sided adhesive sheet. The two-sided adhesive sheet comprises a first adhesive layer, a second adhesive layer, and a base layer. The base layer is disposed between the first adhesive layer and the second adhesive layer. The first adhesive layer has a property such that application of heat causes reduction in the peel strength thereof. The first adhesive layer is disposed between the semiconductor backside protective film and the base layer.

公开(公告)号：US20160056066A1

公开(公告)日：2016-02-25

申请号：US14783339

申请日：2014-04-03

Applicant: NITTO DENKO CORPORATION

Inventor： Goji SHIGA ,  Naohide TAKAMOTO

IPC: H01L21/683 ,  H01L23/00 ,  H01L23/544 ,  C09J7/02 ,  C09J133/08

CPC classification number: H01L21/6836 ,  C08K3/013 ,  C08K3/36 ,  C08K7/18 ,  C08K2201/003 ,  C09J7/38 ,  C09J7/385 ,  C09J133/04 ,  C09J133/08 ,  C09J2201/122 ,  C09J2201/36 ,  C09J2201/606 ,  C09J2203/326 ,  C09J2205/102 ,  C09J2433/00 ,  H01L23/544 ,  H01L24/16 ,  H01L24/17 ,  H01L2221/68327 ,  H01L2221/68377 ,  H01L2223/54433 ,  H01L2223/54453 ,  H01L2223/54486 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2924/01014 ,  H01L2924/0635 ,  C08L33/04

Abstract: The present invention provides an adhesive sheet used in manufacture of a semiconductor device, containing a filler having an average particle size of 0.3 μm or less and an acrylic resin, wherein the content of the filler is in the range of 20 to 45% by weight with respect to the entire adhesive sheet, and the content of the acrylic resin is in the range of 40 to 70% by weight with respect to entire resin components.

Abstract translation: 本发明提供一种用于制造半导体器件的粘合片，其包含平均粒度为0.3μm以下的填料和丙烯酸树脂，其中填料的含量为20〜45重量％ 相对于整个粘合片，丙烯酸树脂的含量相对于树脂成分的总量为40〜70重量％。

公开(公告)号：US20140203458A1

公开(公告)日：2014-07-24

申请号：US14221314

申请日：2014-03-21

Applicant: NITTO DENKO CORPORATION

Inventor： Naohide TAKAMOTO ,  Goji SHIGA ,  Fumiteru ASAI ,  Toshimasa SUGIMURA

IPC: H01L21/683 ,  H01L21/78

CPC classification number: H01L21/6836 ,  C09J7/22 ,  C09J7/38 ,  C09J2203/326 ,  C09J2205/31 ,  H01L21/78 ,  H01L23/544 ,  H01L24/16 ,  H01L24/81 ,  H01L2221/68327 ,  H01L2221/68377 ,  H01L2221/68381 ,  H01L2223/54486 ,  H01L2224/16225 ,  H01L2924/12042 ,  Y10T428/1467 ,  Y10T428/1471 ,  Y10T428/28 ,  H01L2924/00

Abstract: The present invention provides a dicing tape-integrated film for semiconductor back surface, including a film for flip chip type semiconductor back surface for protecting a back surface of a semiconductor element flip chip-connected onto an adherend, and a dicing tape, the dicing tape including a base material and a pressure-sensitive adhesive layer provided on the base material, the film for flip chip type semiconductor back surface being formed on the pressure-sensitive adhesive layer, in which the pressure-sensitive adhesive layer is a radiation-curable pressure-sensitive adhesive layer whose pressure-sensitive adhesive force toward the film for flip chip type semiconductor back surface is decreased by irradiation with a radiation ray.

Abstract translation: 本发明提供了一种用于半导体背面的切割带集成膜，包括用于倒装芯片型半导体背表面的膜，用于保护连接到被粘物上的半导体元件倒装芯片的后表面和切割带，切割带 包括基材和设置在基材上的压敏粘合剂层，在压敏粘合剂层上形成用于倒装芯片型半导体背表面的膜，其中压敏粘合剂层是可辐射固化压力 敏感粘合剂层，其通过用辐射线照射而降低了对于倒装芯片型半导体背表面的膜的压敏粘合力。

公开(公告)号：US20140091480A1

公开(公告)日：2014-04-03

申请号：US14095164

申请日：2013-12-03

Applicant: NITTO DENKO CORPORATION

Inventor： Naohide TAKAMOTO ,  Takeshi MATSUMURA

IPC: H01L21/683 ,  H01L23/00

CPC classification number: H01L21/6836 ,  H01L23/544 ,  H01L23/562 ,  H01L24/81 ,  H01L2221/68327 ,  H01L2223/5448 ,  H01L2224/16 ,  H01L2224/27436 ,  H01L2224/81801 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01025 ,  H01L2924/01046 ,  H01L2924/01079 ,  H01L2924/12042 ,  Y10T428/1467 ,  Y10T428/28 ,  Y10T428/2848 ,  Y10T428/31511 ,  H01L2924/00 ,  H01L2224/0401

Abstract: The present invention provides a dicing tape-integrated wafer back surface protective film including: a dicing tape including a base material and a pressure-sensitive adhesive layer formed on the base material; and a wafer back surface protective film formed on the pressure-sensitive adhesive layer of the dicing tape, in which the wafer back surface protective film is colored. It is preferable that the colored wafer back surface protective film has a laser marking ability. The dicing tape-integrated wafer back surface protective film can be suitably used for a flip chip-mounted semiconductor device.

Abstract translation: 本发明提供一种切片带集成晶片背面保护膜，其包括：切割带，其包括基材和形成在基材上的压敏粘合剂层; 以及形成在切割带的压敏粘合剂层上的晶片背面保护膜，其中晶片背面保护膜着色。 彩色晶片背面保护膜最好具有激光打标能力。 切割带集成的晶片背面保护膜可以适用于倒装芯片安装的半导体器件。

公开(公告)号：US20240409786A1

公开(公告)日：2024-12-12

申请号：US18698184

申请日：2022-09-30

Applicant: NITTO DENKO CORPORATION

Inventor： Satoshi SATO ,  Yuichiro SHISHIDO ,  Naohide TAKAMOTO

IPC: C09J7/38 ,  B32B7/06 ,  B32B27/08 ,  B32B27/36 ,  H01L25/075 ,  H01L33/56

Abstract: A protective sheet according to the present invention is a protective sheet for being attached to a protected surface of an electronic component having the protected surface, one surface of a glass piece forming a display surface of a display apparatus, or one surface of a glass plate for obtaining the glass piece. The protective sheet includes a protective layer for being attached to the protected surface of the electronic component, the one surface of the glass piece, or the one surface of the glass plate. The protective layer is made of one of a water-soluble resin composition and a curable resin composition with its adhesiveness reducible by curing reaction.

公开(公告)号：US20170330785A1

公开(公告)日：2017-11-16

申请号：US15588996

申请日：2017-05-08

Applicant: Nitto Denko Corporation

Inventor： Ryuichi KIMURA ,  Naohide TAKAMOTO

IPC: H01L21/683

CPC classification number: H01L21/6836 ,  H01L23/544 ,  H01L2221/68327 ,  H01L2221/68377 ,  H01L2223/54486 ,  H01L2224/16225

Abstract: [PROBLEM] In accordance with one aspect of the present invention, to provide a tape and a sheet that make it possible to reduce cracking that would otherwise occur at the chip side face during dicing.[SOLUTION MEANS] One aspect of the present invention relates to a sheet. The sheet comprises dicing film. The dicing film comprises a base layer and an adhesive layer disposed on the base layer. The sheet further comprises a semiconductor backside protective film disposed on the adhesive layer. Shear adhesive strength at 25° C. of the semiconductor backside protective film with respect to a silicon chip is not less than 1.7 kgf/mm2.

公开(公告)号：US20160322308A1

公开(公告)日：2016-11-03

申请号：US15140620

申请日：2016-04-28

Applicant: NITTO DENKO CORPORATION

Inventor： Naohide TAKAMOTO ,  Ryuichi KIMURA

IPC: H01L23/544 ,  H01L23/00 ,  H01L23/31 ,  H01L21/683 ,  H01L21/78

CPC classification number: H01L23/544 ,  H01L21/561 ,  H01L21/6836 ,  H01L23/3114 ,  H01L23/3157 ,  H01L23/562 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L2221/68327 ,  H01L2221/68386 ,  H01L2223/5442 ,  H01L2223/54486 ,  H01L2223/54493 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16227 ,  H01L2224/16245 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/81815 ,  H01L2224/81911 ,  H01L2224/83862 ,  H01L2224/92 ,  H01L2924/01082 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01083 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2221/68304 ,  H01L21/78 ,  H01L2221/68381 ,  H01L2224/81 ,  H01L2924/0665

Abstract: Disclosed are a rear surface-protective film making it possible to detect, after this film is bonded to a semiconductor wafer, a notch in this wafer, and to prevent the rear surface-protective film from being stuck out; and others. Disclosed are a rear surface-protective filmmaking it possible to detect, after this film is bonded to a semiconductor wafer, a notch in this wafer; and others. An aspect of the invention relates to a rear surface-protective film for being bonded to a rear surface of a semiconductor wafer. The film is smaller in outer circumstance than the semiconductor wafer, and a notch is provided in the film. Another aspect of the invention relates to a rear surface-protective film having a total light transmittance of 3% or more at a wavelength of 555 nm.

Abstract translation: 公开了一种后表面保护膜，其可以在该膜与半导体晶片接合之后检测该晶片中的凹口，并且防止后表面保护膜被卡住; 和别的。 公开了一种后表面保护膜，其可以在该膜结合到半导体晶片之后检测该晶片中的凹口; 和别的。 本发明的一个方面涉及一种用于接合到半导体晶片的后表面的后表面保护膜。 该膜在外部环境中比半导体晶片小，并且在膜中设置有凹口。 本发明的另一方面涉及一种在555nm波长处具有3％以上的全光线透射率的背面保护膜。

公开(公告)号：US20160172230A1

公开(公告)日：2016-06-16

申请号：US15046235

申请日：2016-02-17

Applicant: NITTO DENKO CORPORATION

Inventor： Naohide TAKAMOTO ,  Goji SHIGA ,  Fumiteru ASAI

IPC: H01L21/683 ,  H01L21/78 ,  H01L21/66 ,  H01L23/00 ,  B32B37/12 ,  B32B7/12

CPC classification number: H01L21/6836 ,  B32B5/022 ,  B32B5/028 ,  B32B7/12 ,  B32B15/08 ,  B32B25/08 ,  B32B25/12 ,  B32B25/14 ,  B32B25/18 ,  B32B27/08 ,  B32B27/10 ,  B32B27/12 ,  B32B27/281 ,  B32B27/306 ,  B32B27/308 ,  B32B27/32 ,  B32B27/34 ,  B32B27/36 ,  B32B27/365 ,  B32B27/38 ,  B32B29/002 ,  B32B37/12 ,  B32B2250/44 ,  B32B2270/00 ,  B32B2274/00 ,  B32B2307/202 ,  B32B2307/302 ,  B32B2307/306 ,  B32B2307/414 ,  B32B2307/514 ,  B32B2307/54 ,  B32B2307/732 ,  B32B2457/14 ,  H01L21/78 ,  H01L22/20 ,  H01L24/81 ,  H01L2221/68327 ,  H01L2221/68386 ,  H01L2924/014 ,  Y10T156/10 ,  Y10T428/24355

Abstract: The present invention relates to a dicing tape-integrated film for semiconductor back surface, which includes: a dicing tape including a base material having an asperities-formed surface, and a pressure-sensitive adhesive layer laminated on the base material, and a film for semiconductor back surface laminated on the pressure-sensitive adhesive layer of the dicing tape, in which the dicing tape has a haze of at most 45%.

Abstract translation: 本发明涉及一种半导体背面用切割带一体化膜，其特征在于，包括：具有凹凸形成面的基材和层叠在基材上的粘合剂层的切割带，以及用于 半导体背表面层叠在切割带的压敏粘合剂层上，其中切割带的雾度为至多45％。

公开(公告)号：US20150364357A1

公开(公告)日：2015-12-17

申请号：US14710696

申请日：2015-05-13

Applicant: NITTO DENKO CORPORATION

Inventor： Naohide TAKAMOTO ,  Hiroyuki HANAZONO ,  Akihiro FUKUI

IPC: H01L21/683 ,  H01L23/00 ,  H01L21/78

CPC classification number: H01L21/6836 ,  H01L23/544 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L2221/68327 ,  H01L2221/68377 ,  H01L2223/54433 ,  H01L2223/54486 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16227 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81007 ,  H01L2224/81191 ,  H01L2224/81815 ,  H01L2224/81911 ,  H01L2224/83007 ,  H01L2224/83022 ,  H01L2224/83104 ,  H01L2224/83862 ,  H01L2224/92125 ,  H01L2924/15311 ,  H01L2924/3512 ,  Y10T428/14 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2924/01082 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01083 ,  H01L2924/0665 ,  H01L2924/066

Abstract: The present invention is to provide a dicing-tape integrated film for the backside of a semiconductor that is capable of suppressing the increase of the peel strength between the dicing tape and the film for the backside of a flip-chip semiconductor due to heating. The dicing-tape integrated film for the backside of a semiconductor has a dicing tape having a substrate and a pressure-sensitive adhesive layer formed on the substrate and a film for the backside of a flip-chip semiconductor formed on the pressure-sensitive adhesive layer of the dicing tape, in which the difference (γ2−γ1) of the surface free energy γ2 and the surface free energy γ1 is 10 mJ/m2 or more, where γ1 represents the surface free energy of the pressure-sensitive adhesive layer and γ2 represents the surface free energy of the film for the backside of a flip-chip semiconductor.

Abstract translation: 本发明提供一种用于半导体背面的切割带一体膜，其能够抑制由于加热而导致的倒装芯片半导体背面的切割带和膜之间的剥离强度的增加。 用于半导体背面的切割胶带集成膜具有切割带，该切割带具有基板和形成在基板上的压敏粘合剂层和形成在压敏粘合剂层上的倒装芯片半导体的背面的膜 其中表面自由能γ2和表面自由能γ1的差（γ2-γ1）为10mJ / m2以上，其中γ1表示压敏粘合剂层的表面自由能，γ2 表示用于倒装芯片半导体背面的膜的表面自由能。

公开(公告)号：US20150162236A1

公开(公告)日：2015-06-11

申请号：US14624702

申请日：2015-02-18

Applicant: NITTO DENKO CORPORATION

Inventor： Naohide TAKAMOTO ,  Goji SHIGA ,  Fumiteru ASAI

IPC: H01L21/683 ,  C09J7/02 ,  B32B38/10 ,  B32B37/12 ,  B32B38/00

CPC classification number: H01L21/6836 ,  B32B37/1284 ,  B32B38/0004 ,  B32B38/10 ,  B32B2405/00 ,  B32B2457/14 ,  C09J7/20 ,  C09J165/00 ,  C09J2201/606 ,  C09J2203/326 ,  C09J2461/00 ,  C09J2463/00 ,  H01L21/561 ,  H01L21/563 ,  H01L21/6835 ,  H01L23/293 ,  H01L23/3114 ,  H01L23/3164 ,  H01L23/544 ,  H01L24/13 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L2221/68336 ,  H01L2221/68377 ,  H01L2221/68381 ,  H01L2221/68386 ,  H01L2223/54406 ,  H01L2223/5442 ,  H01L2223/5448 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16245 ,  H01L2224/27003 ,  H01L2224/27436 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/29386 ,  H01L2224/73204 ,  H01L2224/81095 ,  H01L2224/81191 ,  H01L2224/81815 ,  H01L2224/8191 ,  H01L2224/83191 ,  H01L2224/8385 ,  H01L2224/92 ,  H01L2224/92125 ,  H01L2924/0001 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01056 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/12042 ,  H01L2924/15787 ,  H01L2924/15788 ,  Y10T156/1052 ,  Y10T156/1064 ,  Y10T156/1075 ,  Y10T156/1077 ,  Y10T156/1082 ,  Y10T156/1093 ,  Y10T428/1471 ,  Y10T428/1476 ,  Y10T428/1495 ,  Y10T428/15 ,  Y10T428/21 ,  H01L21/78 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00014 ,  H01L2924/01083 ,  H01L2224/13099

Abstract: The present invention relates to a film for semiconductor device production, which includes: a separator; and a plurality of adhesive layer-attached dicing tapes each including a dicing tape and an adhesive layer laminated on the dicing tape, which are laminated on the separator at a predetermined interval in such a manner that the adhesive layer attaches to the separator, in which the separator has a cut formed along the outer periphery of the dicing tape, and the depth of the cut is at most ⅔ of the thickness of the separator.

Abstract translation: 本发明涉及一种用于半导体器件生产的膜，其包括：隔板; 以及多个粘附层附着的切割带，每个粘合剂层附着的切割带包括层合在切割带上的切割带和粘合剂层，它们以预定的间隔层压在隔板上，使得粘合剂层附着到隔板上，其中 分离器具有沿着切割带的外周形成的切口，并且切割深度为隔板的厚度的至多。。