公开(公告)号：US20040162358A1

公开(公告)日：2004-08-19

申请号：US10780599

申请日：2004-02-19

Applicant: NITTO DENKO CORPORATION

Inventor： Takayuki Yamamoto ,  Katsuhiko Tachibana ,  Tomohiro Taruno ,  Mitsuhiro Kanada

IPC: C08J009/00

CPC classification number: C08J9/0061 ,  C08J9/0066 ,  C08J9/122 ,  C08J2203/08 ,  C08J2323/02 ,  C08J2421/00

Abstract: A composition for a polyolefin resin foam, which comprises a polymer component comprising a polyolefin resin, and at least one of a rubber and a thermoplastic olefin elastomer, and powdery particles, wherein said composition has a melt tension of at least 20 cN when measured in a range between a first temperature at a melting point of said composition and a second temperature that is 20 degrees Celsius higher than said first temperature.

Abstract translation: 一种用于聚烯烃树脂泡沫的组合物，其包含聚烯烃树脂的聚合物组分和橡胶和热塑性烯烃弹性体中的至少一种和粉末颗粒，其中所述组合物在熔体张力为至少20cN时测量 所述组合物的熔点的第一温度和比所述第一温度高20摄氏度的第二温度之间的范围。

公开(公告)号：US20020058720A1

公开(公告)日：2002-05-16

申请号：US09984416

申请日：2001-10-30

Applicant: NITTO DENKO CORPORATION

Inventor： Mitsuhiro Kanada ,  Takayuki Yamamoto ,  Amane Mochizuki ,  Takahiro Fukuoka

IPC: C08J009/00

CPC classification number: C08J9/28 ,  C08J2201/0464 ,  C08J2379/08 ,  H05K1/0346 ,  Y02P20/544

Abstract: A porous polyimide having a finely cellular structure and having a low dielectric constant and heat resistance. The porous polyimide can be produced by a process comprising adding a dispersible compound to a polyimide precursor to form a micro-domain structure in which the dispersible compound is dispersed in the polymer so as to have a size smaller than 10 nullm and then removing the dispersible compound by extraction with supercritical carbon dioxide to thereby make the precursor porous, wherein the interaction parameter nullAB between the polyimide precursor A and the dispersible compound B is larger than 3. This porous polyimide has an average cell diameter smaller than 5 nullm and a dielectric constant of 3 or lower.

Abstract translation: 具有微细结构并具有低介电常数和耐热性的多孔聚酰亚胺。 多孔聚酰亚胺可以通过包括向聚酰亚胺前体中加入可分散化合物以形成其中可分散化合物分散在聚合物中以使其尺寸小于10μm的微畴结构，然后除去可分散的 通过用超临界二氧化碳萃取，从而使前体多孔化，其中聚酰亚胺前体A和可分散化合物B之间的相互作用参数和AB均大于3.该多孔聚酰亚胺的平均泡孔直径小于5μm， 介电常数为3以下。

公开(公告)号：US20040162363A1

公开(公告)日：2004-08-19

申请号：US10736529

申请日：2003-12-17

Applicant: NITTO DENKO CORPORATION

Inventor： Amane Mochizuki ,  Takahiro Fukuoka ,  Mitsuhiro Kanada ,  Takayuki Yamamoto ,  Tomohiro Taruno

IPC: C08G073/10 ,  C08J003/28

CPC classification number: H05K1/056 ,  G03F7/037 ,  H05K1/024 ,  H05K1/0346 ,  H05K3/0023 ,  H05K3/28 ,  H05K3/4676 ,  H05K2201/0116 ,  H05K2201/0154 ,  Y10S522/903 ,  Y10S522/915 ,  Y10T428/31721

Abstract: The present photosensitive resin composition 2 comprises a polyamic acid resin 4, a photosensitive agent, a dispersible compound 3 dispersible in the polyamic acid resin 4, and a solvent. The porous resin is obtained by removing the solvent from the photosensitive resin composition 2 to form a composition in which the dispersible compound 3 is dispersed in the polyamic acid resin 4, removing the dispersible compound to make the composition porous, and curing the porous photosensitive resin composition. The porous resin enables forming a fine circuit pattern and has a low dielectric constant and, when used as an insulating layer of a circuit board, brings about improved high frequency characteristics.

Abstract translation: 本发明的感光性树脂组合物2包含聚酰胺酸树脂4，光敏剂，分散在聚酰胺酸树脂4中的分散性化合物3和溶剂。 多孔树脂通过从感光性树脂组合物2中除去溶剂而形成分散性化合物3分散在聚酰胺酸树脂4中的组合物，除去分散性化合物，使组合物多孔，并使多孔感光性树脂 组成。 多孔树脂能够形成精细电路图案并且具有低介电常数，并且当用作电路板的绝缘层时，会带来改善的高频特性。

公开(公告)号：US20020065390A1

公开(公告)日：2002-05-30

申请号：US09987050

申请日：2001-11-13

Applicant: NITTO DENKO CORPORATION

Inventor： Mitsuhiro Kanada ,  Takayuki Yamamoto ,  Amane Mochizuki ,  Takahiro Fukuoka

IPC: C08G002/00

CPC classification number: H05K1/0346 ,  C08J9/26 ,  C08J2201/032 ,  C08J2201/042 ,  C08J2203/08 ,  C08J2379/08 ,  Y02P20/544

Abstract: A method of efficiently removing a low molecular weight substance from a polyimide precursor or polyimide in which the low molecular weight substance is dispersed as micro-domains, without using a large amount of an organic solvent. The method of removing a low molecular weight substance comprises subjecting either a polymer composition having a micro-domain structure made up of a continuous phase comprising a polyimide precursor and, dispersed therein, a discontinuous phase comprising a low molecular weight substance or a polyimide composition obtained from the polymer composition by converting the polyimide precursor into a polyimide to extraction with a combination of supercritical carbon dioxide and a co-solvent to thereby remove the low molecular weight substance. The co-solvent is preferably an aprotic polar solvent, more preferably a nitrogen compound solvent or a sulfur compound solvent.

Abstract translation: 从低分子量物质作为微区域分散的聚酰亚胺前体或聚酰亚胺有效地除去低分子量物质的方法，而不使用大量的有机溶剂。 除去低分子量物质的方法包括使具有由包含聚酰亚胺前体的连续相构成的微区结构的聚合物组合物和分散在其中的包含低分子量物质的不连续相或获得的聚酰亚胺组合物 通过将聚酰亚胺前体转变为聚酰亚胺，通过超临界二氧化碳和共溶剂的组合提取，从而从聚合物组合物中除去低分子量物质。 共溶剂优选为非质子极性溶剂，更优选为氮化合物溶剂或硫化合物溶剂。