公开(公告)号：US20160268026A1

公开(公告)日：2016-09-15

申请号：US15031042

申请日：2014-09-04

Applicant: NITTO DENKO CORPORATION

Inventor： Akihito MATSUTOMI ,  Takashi HABU

IPC: H01F1/36

CPC classification number: H01F1/36 ,  H01F1/26 ,  H01F1/37 ,  H05K9/0075

Abstract: A soft magnetic resin composition contains flat soft magnetic particles, a resin component, and a rheology control agent.

Abstract translation: 软磁性树脂组合物含有扁平软磁性颗粒，树脂组分和流变控制剂。

公开(公告)号：US20160172086A1

公开(公告)日：2016-06-16

申请号：US14893179

申请日：2014-04-08

Applicant: NITTO DENKO CORPORATION

Inventor： Takashi HABU ,  Hirofumi EBE

IPC: H01F1/12 ,  C09J7/02

CPC classification number: H01F1/12 ,  C09J7/22 ,  C09J2203/326 ,  C09J2400/16 ,  C09J2400/20 ,  C09J2433/00 ,  G06F3/046 ,  H01F1/26 ,  H01F1/37 ,  H01F41/16 ,  H05K1/165 ,  H05K3/28 ,  H05K2201/0245 ,  H05K2201/086

Abstract: A soft magnetic resin composition contains soft magnetic particles shaped flat, a resin component, and polyether phosphate ester. The soft magnetic particles content is 60% by volume or more and the polyether phosphate ester content relative to 100 parts by mass of the soft magnetic particles is 0.1 to 5 parts by mass.

Abstract translation: 软磁性树脂组合物含有扁平的软磁性颗粒，树脂组分和聚醚磷酸酯。 软磁性粒子的含量为60体积％以上，相对于100质量份的软磁性粒子，聚醚磷酸酯的含量为0.1〜5质量份。

公开(公告)号：US20160247612A1

公开(公告)日：2016-08-25

申请号：US15026098

申请日：2014-09-18

Applicant: NITTO DENKO CORPORATION

Inventor： Hirofumi EBE ,  Takashi HABU ,  Akihito MATSUTOMI ,  Shotaro MASUDA

IPC: H01F1/01 ,  H01Q7/06

CPC classification number: H01F1/01 ,  B22F1/0055 ,  B22F1/0062 ,  B22F5/006 ,  C22C33/0285 ,  C22C2202/02 ,  H01F1/26 ,  H01Q7/06 ,  H05K1/16 ,  H05K3/281 ,  H05K2201/083 ,  H05K2201/10151

Abstract: A soft magnetic resin composition contains flat soft magnetic particles and a resin component, and the soft magnetic particles have a tap density of 1.1 g/cm3 or less.

Abstract translation: 软磁性树脂组合物含有平坦的软磁性粒子和树脂成分，软磁性体的振实密度为1.1g / cm 3以下。

公开(公告)号：US20170110231A1

公开(公告)日：2017-04-20

申请号：US15312464

申请日：2015-05-12

Applicant: NITTO DENKO CORPORATION

Inventor： Akihito MATSUTOMI ,  Nao KAMAKURA ,  Takashi HABU

IPC: H01F10/18 ,  H01F1/147

CPC classification number: H01F10/18 ,  H01F1/14733 ,  H01F1/14791 ,  H01F1/26 ,  H01F1/37 ,  H05K9/00

Abstract: The soft magnetic resin composition contains soft magnetic particles, epoxy resin, phenol resin, and acrylic resin. The soft magnetic particle content relative to the soft magnetic resin composition is 60 vol % or more. The soft magnetic resin composition after curing has a linear expansion coefficient of 22.0 ppm/° C. or less.

公开(公告)号：US20160211061A1

公开(公告)日：2016-07-21

申请号：US15025473

申请日：2014-09-18

Applicant: NITTO DENKO CORPORATION

Inventor： Shotaro MASUDA ,  Hirofumi EBE ,  Takashi HABU ,  Akihito MATSUTOMI

IPC: H01F1/28 ,  H01F3/08

CPC classification number: H01F1/28 ,  B22F1/0011 ,  B22F1/0055 ,  B22F2007/042 ,  C22C33/0257 ,  C22C2202/02 ,  H01F3/08 ,  H01F5/00 ,  H05K1/0373 ,  H05K3/285 ,  H05K2201/0245 ,  H05K2201/086

Abstract: Soft magnetic particle powder is soft magnetic particle powder composed of flat soft magnetic particles, and the soft magnetic particle powder has a particle size D10 and a particle size D50 measured with a laser diffraction particle size distribution analyzer satisfying formula below: D10/D50>0.30.

Abstract translation: 软磁性粒子粉末是由平软磁性粒子构成的软磁性粒子粉末，软磁性粒子粉末具有粒径D 10，粒径D 50，用激光衍射粒度分布分析仪测定，满足下式：D10 / D50> 0.30 。

公开(公告)号：US20160105969A1

公开(公告)日：2016-04-14

申请号：US14893834

申请日：2014-04-14

Applicant: NITTO DENKO CORPORATION

Inventor： Takashi HABU ,  Hirofumi EBE

IPC: H05K3/00

CPC classification number: H05K3/0058 ,  H05K1/165 ,  H05K2201/0116 ,  H05K2201/0245 ,  H05K2201/086 ,  H05K2203/068 ,  H05K2203/085

Abstract: A method for producing a soft magnetic film laminate circuit board having a soft magnetic film laminated on at least one side of a circuit board includes the steps of bringing a soft magnetic thermosetting film containing soft magnetic particles, having a porosity of 15% or more and 60% or less, and in a semi-cured state into contact with the one side of the circuit board and bringing the soft magnetic thermosetting film into a cured state by vacuum hot pressing.

Abstract translation: 一种具有层压在电路板的至少一面上的软磁性膜的软磁性膜叠层电路板的制造方法，其特征在于，包括使含有15％以上的孔隙率的软磁性粒子的软磁性热固性膜，以及 60％以下，并且在半固化状态下与电路板的一侧接触，并且通过真空热压使软磁性热固性膜进入固化状态。

公开(公告)号：US20160083626A1

公开(公告)日：2016-03-24

申请号：US14779845

申请日：2014-01-23

Applicant: NITTO DENKO CORPORATION

Inventor： Hirofumi EBE ,  Takashi HABU

IPC: C09J7/02 ,  C09J133/00 ,  C09J163/00 ,  C09J165/02 ,  H05K1/03 ,  G01D5/20

CPC classification number: H05K1/0313 ,  B32B7/12 ,  B32B27/00 ,  B32B27/08 ,  B32B27/18 ,  B32B27/308 ,  B32B27/38 ,  B32B2307/208 ,  B32B2405/00 ,  B32B2457/08 ,  C08K3/08 ,  C08K2201/01 ,  C09J7/245 ,  C09J7/25 ,  C09J7/35 ,  C09J9/00 ,  C09J133/00 ,  C09J163/00 ,  C09J165/02 ,  C09J2201/36 ,  C09J2203/326 ,  C09J2205/102 ,  C09J2433/00 ,  C09J2461/00 ,  C09J2463/00 ,  G01D5/20 ,  G06F3/046 ,  G06F2203/04103 ,  H01F1/26 ,  H01F1/37 ,  H05K1/0373 ,  H05K3/281 ,  H05K2201/0195 ,  H05K2201/086

Abstract: A soft magnetic thermosetting adhesive film includes a magnetic layer and a surface layer laminated on one side of the magnetic layer. The magnetic layer is formed from a magnetic composition containing acrylic resin, epoxy resin, phenol resin, and soft magnetic particles. The surface layer is formed from a surface layer composition containing acrylic resin, epoxy resin, and phenol resin and not substantially containing soft magnetic particles.

Abstract translation: 软磁性热固性粘合膜包括层叠在磁性层一侧的磁性层和表面层。 磁性层由含有丙烯酸树脂，环氧树脂，酚醛树脂和软磁性颗粒的磁性组合物形成。 表面层由含有丙烯酸树脂，环氧树脂和酚醛树脂的表面层组合物形成，基本上不含软磁性颗粒。