公开(公告)号：US20170080513A1

公开(公告)日：2017-03-23

申请号：US15126642

申请日：2015-04-15

Applicant: NSK LTD.

Inventor： Takashi SUNAGA ,  Noboru KANEKO ,  Osamu MIYOSHI ,  Ryoichi SUZUKI

IPC: B23K11/14 ,  B62D5/04 ,  B23K11/25

CPC classification number: B23K11/14 ,  B23K11/00 ,  B23K11/24 ,  B23K11/25 ,  B23K2101/006 ,  B62D5/0403

Abstract: A resistance welding device is provided with a moving distance measuring section for measuring distances between conductors to be joined before and after joining and evaluating joining quality based on the distances, and a projection including a base and a projecting surface is provided to the conductor to be connected in order to easily secure a distance between the conductors after the joining.

公开(公告)号：US20160181221A1

公开(公告)日：2016-06-23

申请号：US14910355

申请日：2014-10-06

Applicant: NSK LTD.

Inventor： Takashi SUNAGA ,  Noboru KANEKO ,  Osamu MIYOSHI ,  Ryoichi SUZUKI

IPC: H01L23/00 ,  H01L23/498 ,  H01L23/492 ,  H01L29/78 ,  H01L29/739

CPC classification number: H01L24/41 ,  H01L23/3735 ,  H01L23/492 ,  H01L23/49811 ,  H01L23/49838 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/35 ,  H01L24/37 ,  H01L24/40 ,  H01L24/83 ,  H01L24/84 ,  H01L24/92 ,  H01L25/07 ,  H01L25/072 ,  H01L25/18 ,  H01L29/7393 ,  H01L29/78 ,  H01L2224/05553 ,  H01L2224/0603 ,  H01L2224/2732 ,  H01L2224/29101 ,  H01L2224/32227 ,  H01L2224/32238 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2224/352 ,  H01L2224/35847 ,  H01L2224/3701 ,  H01L2224/37011 ,  H01L2224/37013 ,  H01L2224/37124 ,  H01L2224/37139 ,  H01L2224/37144 ,  H01L2224/37147 ,  H01L2224/37611 ,  H01L2224/4001 ,  H01L2224/40095 ,  H01L2224/40227 ,  H01L2224/40475 ,  H01L2224/40499 ,  H01L2224/4099 ,  H01L2224/4112 ,  H01L2224/73263 ,  H01L2224/83192 ,  H01L2224/8321 ,  H01L2224/83424 ,  H01L2224/83447 ,  H01L2224/83801 ,  H01L2224/83815 ,  H01L2224/84138 ,  H01L2224/8421 ,  H01L2224/84424 ,  H01L2224/84447 ,  H01L2224/84801 ,  H01L2224/84815 ,  H01L2224/9221 ,  H01L2924/00015 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/15724 ,  H01L2924/19105 ,  H01L2924/35121 ,  H01L2924/365 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2224/291 ,  H01L2924/014 ,  H01L2924/00012 ,  H01L2924/01047 ,  H01L2224/29294 ,  H01L2224/293 ,  H01L2224/48 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2224/84 ,  H01L2924/01029 ,  H01L2924/013 ,  H01L2924/00013

Abstract: To provide a semiconductor module that has high reliability of electric connection by a solder and is inexpensive. A joint surface of an electrode jointing portion that is opposed to a surface to be jointed of a gate electrode of a bare-chip FET and a joint surface of a substrate jointing portion that is opposed to a surface to be jointed of another wiring pattern include an outgas releasing mechanism that makes outgas generated from a molten solder during solder jointing of a metal plate connector be released from solders interposed between the joint surfaces and the surfaces to be jointed.

Abstract translation: 提供通过焊料具有高可靠性的电连接并且便宜的半导体模块。 电极接合部的与裸芯片FET的栅电极接合的面相对的基板接合部的接合面与与其他布线图案的被接合面相对的基板接合部的接合面包含 在金属板连接器的焊接期间使从熔融焊料产生的废气从放置在接合面和待接合面之间的焊料脱离的脱气释放机构。

公开(公告)号：US20180019529A1

公开(公告)日：2018-01-18

申请号：US15545042

申请日：2016-02-05

Applicant: NSK Ltd.

Inventor： Masakazu MORIMOTO ,  Tadayoshi OSAKABE ,  Osamu MIYOSHI

IPC: H01R12/58 ,  H01R43/20 ,  H01R9/22

CPC classification number: H01R12/585 ,  H01R9/223 ,  H01R13/41 ,  H01R13/52 ,  H01R43/20

Abstract: A connector housing includes a hole having a minimum size that a lead section of a connector terminal to penetrate, and a guide wall which is formed along an outer peripheral of the hole, and is protruded in a direction which a lead section protrudes from the connector housing to a bending section of the lead section, wherein, by which inner walls of the guide wall is mutually and directly in contact with side surfaces of the lead section over a height near a top end side of the lead section in a bending section of the lead section from an outer peripheral of the hole, a sealing structure is formed from the bending section of the lead section to an interior of the connector housing.

公开(公告)号：US20150342074A1

公开(公告)日：2015-11-26

申请号：US14435682

申请日：2013-10-25

Applicant: NSK LTD.

Inventor： Takashi SUNAGA ,  Noboru KANEKO ,  Osamu MIYOSHI

IPC: H05K7/02

CPC classification number: H05K7/02 ,  H01L23/142 ,  H01L23/3735 ,  H01L23/49811 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/35 ,  H01L24/37 ,  H01L24/40 ,  H01L24/41 ,  H01L24/73 ,  H01L24/83 ,  H01L24/84 ,  H01L24/92 ,  H01L25/07 ,  H01L25/072 ,  H01L25/18 ,  H01L2224/291 ,  H01L2224/29294 ,  H01L2224/293 ,  H01L2224/32227 ,  H01L2224/32238 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2224/352 ,  H01L2224/35847 ,  H01L2224/3701 ,  H01L2224/37013 ,  H01L2224/37124 ,  H01L2224/37139 ,  H01L2224/37144 ,  H01L2224/37147 ,  H01L2224/40095 ,  H01L2224/40227 ,  H01L2224/40475 ,  H01L2224/40499 ,  H01L2224/4103 ,  H01L2224/4112 ,  H01L2224/48 ,  H01L2224/73263 ,  H01L2224/77272 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/8321 ,  H01L2224/83424 ,  H01L2224/83447 ,  H01L2224/83801 ,  H01L2224/83815 ,  H01L2224/84424 ,  H01L2224/84447 ,  H01L2224/84801 ,  H01L2224/84815 ,  H01L2224/85 ,  H01L2224/9221 ,  H01L2924/014 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/19105 ,  H01L2924/3011 ,  H01L2924/351 ,  H05K1/181 ,  H05K2201/10166 ,  H05K2201/1031 ,  H05K2201/10409 ,  Y02P70/611 ,  H01L2924/00015 ,  H01L2924/00014 ,  H01L2224/83 ,  H01L2224/84 ,  H01L2224/33 ,  H01L2924/00012 ,  H01L2924/00

Abstract: To provide a semiconductor module capable of shortening of the manufacturing tact time, reducing the manufacturing costs, and improving assembility. A semiconductor module (30) includes substrate (31) made of metal, an insulating layer (32) formed on the substrate (31), a plurality of wiring patterns (33a to 33d) formed on the insulating layer (32), a bare-chip transistor (35) mounted on a wiring pattern (33a) via a solder (34a); and a metal plate connector (36a, 36b) jointing an electrode (S, G) of the bare-chip transistor (35) and a wiring pattern (33b, 33c) via a solder (34b, 34c). The metal plate connector (36a, 36b) has a bridge shape, and has a flat surface and a center of gravity at a middle portion of the component.

Abstract translation: 提供能够缩短制造节拍时间，降低制造成本，提高组装性的半导体模块。 半导体模块（30）包括由金属制成的基板（31），形成在基板（31）上的绝缘层（32），形成在绝缘层（32）上的多个布线图案（33a〜33d） 通过焊料（34a）安装在布线图案（33a）上的芯片晶体管（35）; 以及通过焊料（34b，34c）将裸芯片晶体管（35）的电极（S，G）和布线图案（33b，33c）接合的金属板连接器（36a，36b）。 金属板连接器（36a，36b）具有桥接形状，并且在部件的中间部分具有平坦表面和重心。