公开(公告)号：US20150128413A1

公开(公告)日：2015-05-14

申请号：US14537197

申请日：2014-11-10

Applicant: NeuroNexus Technologies, Inc.

Inventor： RIO J. VETTER ,  Jamille Farraye Hetke ,  David S. Pellinen ,  Bencharong Suwarato ,  Kc Kong

IPC: A61N1/05 ,  H01R43/26

CPC classification number: A61N1/0529 ,  A61B5/04001 ,  A61B5/0478 ,  A61B5/6868 ,  A61B5/6882 ,  A61N1/0456 ,  A61N1/0472 ,  A61N1/0539 ,  H01R43/26 ,  Y10T29/49169

Abstract: A three-dimensional neural probe electrode array system is described. Planar probes are microfabricated and electrically connected to flexible micro-machined ribbon cables using a rivet bonding technique. The distal end of each cable is connected to a probe with the proximal end of the cable being customized for connection to a printed circuit board. Final assembly consists of combining multiple such assemblies into a single structure. Each of the two-dimensional neural probe arrays is positioned into a micro-machined platform that provides mechanical support and alignment for each array. Lastly, a micro-machined cap is placed on top of each neural electrode probe and cable assembly to protect them from damage during shipping and subsequent use. The cap provides a relatively planar surface for attachment of a computer controlled inserter for precise insertion into the tissue.