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1.发明申请公开(公告)号：US20190189862A1
公开(公告)日：2019-06-20
申请号：US16284217
申请日：2019-02-25
Applicant: Nikkiso Co., Ltd
Inventor： Hiroyasu ICHINOKURA , Hisanori ISHIGURO , Kenta URA
IPC: H01L33/48
CPC classification number: H01L33/486 , H01L23/02 , H01L33/52 , H01L2224/16225 , H01L2924/16195 , H01L2933/0033
Abstract: An optical semiconductor apparatus includes: a package substrate that includes a recess that opens on a top surface of the package substrate; a light emitting device housed in the recess; a window member provided to cover an opening of the recess; and a sealing structure that seals a space between the package substrate and the window member. The sealing structure includes a first metal layer provided in a shape of a frame on the top surface of the package substrate, a second metal layer provided in a shape of a frame on an inner surface of the window member, and a metal bonding part provided between the first metal layer and the second metal layer. An entirety of one of the first and second metal layers is positioned in a region where the other of the first and second metal layers is provided.
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公开(公告)号：US20190234798A1
公开(公告)日：2019-08-01
申请号：US16378935
申请日：2019-04-09
Applicant: Nikkiso Co., Ltd.
Inventor： Shoichi NIIZEKI , Hiroyasu ICHINOKURA
CPC classification number: G01J3/0286 , G01J3/0218 , G01R31/26 , G01R31/2635 , G01R31/2642 , H01L33/0095
Abstract: A test device includes: a support that supports a light emitting device subject to a test; a light waveguide that guides light output from the light emitting device supported by the support; a light diffuser plate that diffuses light output from the light waveguide; and a light receiving device that receives light diffused by the light diffuser plate. The test device may further include a constant-temperature device that houses the support and the light emitting device supported by the support and control a temperature of the light emitting device. The light receiving device may be provided outside the constant-temperature device, and the light waveguide may guide light from inside the constant-temperature device to a space outside the constant-temperature device.
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公开(公告)号：US20220359800A1
公开(公告)日：2022-11-10
申请号：US17872264
申请日：2022-07-25
Applicant: NIKKISO CO., LTD.
Inventor： Shuichiro YAMAMOTO , Hiroyasu ICHINOKURA
Abstract: A semiconductor light-emitting device includes a semiconductor light-emitting element that emits ultraviolet radiation at a wavelength of not more than 360 nm, a package substrate that houses the semiconductor light-emitting element, a thin film layer that is formed on the package substrate and has a predetermined thickness, and a sealing material made of a silicone resin which is provided on the thin film layer so as to have a lens shape and seals the semiconductor light-emitting element, in which the sealing material forms a contact angle of not less than 15° with the thin film layer.
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公开(公告)号：US20190288171A1
公开(公告)日：2019-09-19
申请号：US16434419
申请日：2019-06-07
Applicant: NIKKISO CO., LTD.
Inventor： Shoichi NIIZEKI , Hiroyasu ICHINOKURA
Abstract: An optical semiconductor apparatus includes: an optical semiconductor device including a translucent support substrate; a buffer layer on the support substrate, a seal ring in a frame shape provided in an outer region on the buffer layer, an active layer provided on an inner region of the buffer layer, and an electrode provided on the active layer. The optical semiconductor apparatus further including: a package substrate on which the optical semiconductor device is mounted; and a sealing part that seals a space between the seal ring and the package substrate.
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公开(公告)号：US20210249573A1
公开(公告)日：2021-08-12
申请号：US16973280
申请日：2019-06-06
Applicant: NIKKISO CO., LTD.
Inventor： Hiroyasu ICHINOKURA , Tadaaki MAEDA , Kazuyoshi SAKURAGI
Abstract: A semiconductor light-emitting device includes a semiconductor light-emitting element having a supporting substrate and a sealing member located above the supporting substrate, a mounting substrate on which the semiconductor light-emitting element is mounted in such a manner that the sealing member faces the mounting substrate, and a sealing part that integrally covers a part of the supporting substrate and a side surface of the sealing member and seals the semiconductor light-emitting element and the mounting substrate.
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Patent Agency Ranking
公开(公告)号：US20200328331A1
公开(公告)日：2020-10-15
申请号：US16845158
申请日：2020-04-10
Applicant: NIKKISO CO., LTD.
Inventor： Shuichiro YAMAMOTO , Hiroyasu ICHINOKURA
Abstract: A semiconductor light-emitting device includes a semiconductor light-emitting element that emits ultraviolet radiation at a wavelength of not more than 360 nm, a package substrate that houses the semiconductor light-emitting element, a thin film layer that is formed on the package substrate and has a predetermined thickness, and a sealing material made of a silicone resin which is provided on the thin film layer so as to have a lens shape and seals the semiconductor light-emitting element, in which the sealing material forms a contact angle of not less than 15° with the thin film layer.
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7.发明申请公开(公告)号：US20190189861A1
公开(公告)日：2019-06-20
申请号：US16284310
申请日：2019-02-25
Applicant: Nikkiso Co., Ltd
Inventor： Hiroyasu ICHINOKURA
CPC classification number: H01L33/483 , H01L23/02 , H01L33/52 , H01L33/62 , H01L2224/16225 , H01L2924/16195 , H01L2933/0033
Abstract: A light emitting apparatus includes: a package substrate; a light emitting device housed in a recess of the package substrate; a window member provided to cover an opening of the recess; and a sealing structure that seals a space between the package substrate and the window member. The window member includes a glass plate having an inner surface that faces the optical semiconductor device and a frame body provided on the inner surface of the glass plate. The sealing structure includes a first metal layer provided on a top surface of the package substrate, a second metal layer provided on a bottom surface and an inner circumferential surface of the frame body, and a metal bonding part provided between the first and second metal layers, at least a portion of the metal bonding part being provided on the inner circumferential surface.
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8.发明申请公开(公告)号：US20210257519A1
公开(公告)日：2021-08-19
申请号：US17177275
申请日：2021-02-17
Applicant: NIKKISO CO., LTD.
Inventor： Hiroyasu ICHINOKURA , Kazuyoshi SAKURAGI
Abstract: A semiconductor package substrate includes a semiconductor housing space including a mounting surface being provided on a bottom side and configured to mount a semiconductor light-emitting element, and a reflective wall being provided around the mounting surface and configured to reflect light emitted from the semiconductor light-emitting element to be mounted on the mounting surface; a mounting region being provided at a rim portion and configured to mount a lid member for covering the semiconductor light-emitting element; and a flow-suppressing portion separating the mounting region and the reflective wall spatially in such a manner that a joining member joining the lid member to the rim portion is suppressed from flowing from the mounting region into the semiconductor housing space.
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公开(公告)号：US20190237631A1
公开(公告)日：2019-08-01
申请号：US16257154
申请日：2019-01-25
Applicant: NIKKISO CO., LTD.
Inventor： Hiroyasu ICHINOKURA , Shoichi NIIZEKI
Abstract: A semiconductor light-emitting device includes a substrate on which a semiconductor light-emitting element is mounted, the substrate having a first coefficient of thermal expansion, a lid member that covers the semiconductor light-emitting element, the lid member having a second coefficient of thermal expansion smaller than the first coefficient of thermal expansion, and a joining member that joins the lid member to the substrate to seal the semiconductor light-emitting element. The joining member includes a eutectic alloy solder.
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10.发明申请公开(公告)号：US20190189870A1
公开(公告)日：2019-06-20
申请号：US16284266
申请日：2019-02-25
Applicant: Nikkiso Co., Ltd
Inventor： Hiroyasu ICHINOKURA , Shoichi NIIZEKI
CPC classification number: H01L33/56 , H01L23/02 , H01L33/40 , H01L33/52 , H01L33/60 , H01L2224/16225 , H01L2924/16195 , H01L2933/0033 , H01L2933/005
Abstract: A light emitting apparatus includes: a package substrate that includes a recess that opens on a top surface of the package substrate; a light emitting device housed in the recess; a window member provided to cover an opening of the recess; and a metal bonding part that seals a space between the package substrate and the window member. The package substrate includes a packaging surface on which the light emitting device is mounted and a metal electrode is provided, an isolation surface provided in a shape of a frame on an outer side of the packaging surface, and a light reflection surface sloping from the isolation surface toward the top surface, and a metal layer is provided on the light reflection surface with a clearance from the isolation surface.
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