Abstract:
A multilayer substrate includes a plurality of stacked thermoplastic resin layers each including an in-plane conductive pattern provided on one principal surface thereof and an interlayer conductive portion arranged to penetrate through the thermoplastic resin layer in a thickness direction. The plurality of thermoplastic resin layers include a first thermoplastic resin layer and a second thermoplastic resin layer, a stacking direction of which is inverted with respect to a stacking direction of the first thermoplastic resin layer. The second thermoplastic resin layer is thicker than the first thermoplastic resin layer. One end in the thickness direction of the interlayer conductive portion provided in the second thermoplastic resin layer is connected with the interlayer conductive portion of the thermoplastic resin layer adjacent to the second thermoplastic resin layer in the thickness direction such that the in-plane conductive pattern is not interposed therebetween.
Abstract:
An image processing apparatus includes a reader configured to read an original to generate original image data; a first color corrector configured to generate CMYK-image information for outputting the original in color from the original image data; a second color corrector configured to generate K-image information for outputting the original in monochrome from the original image data; a determiner configured to determine whether the original is color or monochrome, using the original image data; and an output unit configured to output the CMYK-image information or the K-image information based on a result of determination by the determiner.
Abstract:
An image processing apparatus includes an image data input unit reading an input image and acquiring input image data on a per line basis; an effective image data generation unit generating effective image data based on the input image data acquired by the image data input unit; an address generation unit generating addresses of transmission destinations of the input image data; an image data transmission unit transmitting the input image data to the transmission destinations designated by the addresses generated by the address generation unit; and an adjustment unit adjusting an operation of the image data transmission unit in a manner so that margin data can be transmitted in periods other than periods when effective image data are transmitted.
Abstract:
A module with a built-in component is produced by disposing a cavity on a mounting surface side of a ceramic multilayer substrate, storing a circuit component therein and, thereafter, performing resin molding. A second resin portion is disposed on the mounting surface side of the ceramic multilayer substrate so as to continuously cover a frame-shaped portion and a first resin portion molded. External terminal electrodes are disposed on an outer surface of the second resin portion.
Abstract:
According to an embodiment, an image processing apparatus includes a read image processor, a write image processor, an image path selector, and a communication controller. The read image processor is configured to execute an image processing module corresponding to read of image data. The write image processor is configured to execute an image processing module corresponding to write of image data. The image path selector is configured to select a path for transmitting image data output from the image processing modules corresponding to read and write of image data to an external apparatus, and select a path for inputting image data processed by the external apparatus to an image processing module in a subsequent stage. The communication controller is configured to control transmission and reception of image data to and from the external apparatus.
Abstract:
An electronic component module includes a substrate including a first electrode pattern and a first resist pattern on a first main surface thereof, a first electronic component mounted on the first main surface via the first electrode pattern, and a component-embedding resin layer provided on the first main surface so as to embed the first electronic component therein, and including, in an inside portion or a lateral portion thereof, an interlayer connection conductor connecting the first electrode pattern and an external connection electrode pattern disposed on a surface of the component-embedding resin layer to each other. The first electrode pattern and the first resist pattern are arranged so that the first resist pattern is disposed on top of a circumferential portion of the first electrode pattern.
Abstract:
A packaging material includes an electromagnetic coupling module for an RFID system, in which a radio IC chip is protected from external shock and environmental change without affecting the planarity of the packaging material, the assembly including an electromagnetic coupling module is facilitated, and the radiation characteristics are satisfactory. A packaging material includes a liner and a wave-shaped core material, wherein an electromagnetic coupling module is arranged inside of the packaging material. The electromagnetic coupling module includes a radio IC chip and a feeder circuit board, on which the radio IC chip is mounted, the feeder circuit board including a resonant circuit that includes an inductance element. The packaging material is made of a dielectric, wherein the dielectric and the electromagnetic coupling module are electromagnetically coupled to transmit/receive high frequency signals.
Abstract:
A steam turbine includes two or more rotating blades and a diaphragm outer ring. Each of the rotating blades includes a tip cover, moisture-trapping grooves, a droplet ejection hole, and a drain guide groove. The tip cover is provided to a tip of each of the rotating blades and is connected in contact with another tip cover adjacent to the tip cover. The moisture-trapping grooves are formed in a longitudinal direction of each of the rotating blades. The droplet ejection hole is to connect an outside of the tip cover on a side of the diaphragm outer ring with an inside of the tip cover. The drain guide groove is to connect ends of the moisture-trapping grooves on the side of the tip cover with the droplet ejection hole. The diaphragm outer ring includes a drain pocket which faces the droplet ejection hole.
Abstract:
A via hole forming method and a multilayered board manufacturing method improve manufacturing yield by reducing the required processes. The via hole forming method includes a first step of forming a toner image by attaching toner particles, containing a conductive material and having a protruding portion, onto the surface of a first photosensitive member so that the protruding portion is directed to the outside; and a second step of opposing the surface of the first photosensitive member to one principal surface of a green sheet containing an insulating material and transferring the toner image to the one principal surface of the green sheet so that the protruding portions of the toner particles protrude into the green sheet so as to reach the other principal surface of the green sheet and the toner particles are buried in the green sheet. The via holes are formed using an electrophotographic printing method.
Abstract:
A multilayer substrate having a built-in chip-type electronic component includes a ceramic laminate having a plurality of ceramic layers, a chip-type electronic component disposed in the ceramic laminate and having an external terminal electrode, and a via conductor disposed in the ceramic layers in the lamination direction. The external terminal electrode of the chip-type electronic component is connected to the via conductor, and a connection step is provided in at least one of the upper and lower end surfaces of the via conductor.