公开(公告)号：US20140270784A1

公开(公告)日：2014-09-18

申请号：US13831519

申请日：2013-03-14

Applicant: ORACLE INTERNATIONAL CORPORATION

Inventor： Hiren D. Thacker ,  Xuezhe Zheng ,  Ashok V. Krishnamoorthy ,  Gary L. Gilbert

IPC: G02B6/42 ,  H04B10/27

CPC classification number: G02B6/4284 ,  G02B6/4279 ,  G02B6/43 ,  H04B10/27 ,  H04B10/801

Abstract: An interconnect module for communicating electrical signals and optical signals is described. In particular, an integrated circuit in the interconnect module receives and transmits the electrical signals with other components in a system that includes the interconnect module via an electrical connector. In addition, the integrated circuit receives and transmits electrical signals to a hybrid silicon-photonic bridge chip that performs electrical-to-optical and optical-to-electrical conversion. In turn, this bridge chip receives and transmits optical signals via an optical fiber. The interconnect module can be remateably connected to a backplane in the system, and can be arranged in a stacked configuration with other instances of the interconnect module. In these ways, the interconnect module facilitates dense, modular or scalable, and compact electrical and optical communication in the system.

Abstract translation: 描述了用于传送电信号和光信号的互连模块。 特别地，互连模块中的集成电路经由电连接器接收并传输包括互连模块的系统中的其它部件的电信号。 此外，集成电路接收并发送电信号到执行电 - 光和光 - 电转换的混合硅 - 光子桥芯片。 反过来，该桥芯片经由光纤接收和发送光信号。 互连模块可以可重新连接到系统中的背板，并且可以以互连模块的其他实例布置成堆叠配置。 以这些方式，互连模块便于在系统中进行密集，模块化或可缩放的电气和光通信。

公开(公告)号：US08998509B2

公开(公告)日：2015-04-07

申请号：US13831519

申请日：2013-03-14

Applicant: Oracle International Corporation

Inventor： Hiren D. Thacker ,  Xuezhe Zheng ,  Ashok V. Krishnamoorthy ,  Gary L. Gilbert

IPC: G02B6/36 ,  G02B6/42 ,  H04B10/27 ,  G02B6/43

CPC classification number: G02B6/4284 ,  G02B6/4279 ,  G02B6/43 ,  H04B10/27 ,  H04B10/801

Abstract: An interconnect module for communicating electrical signals and optical signals is described. In particular, an integrated circuit in the interconnect module receives and transmits the electrical signals with other components in a system that includes the interconnect module via an electrical connector. In addition, the integrated circuit receives and transmits electrical signals to a hybrid silicon-photonic bridge chip that performs electrical-to-optical and optical-to-electrical conversion. In turn, this bridge chip receives and transmits optical signals via an optical fiber. The interconnect module can be remateably connected to a backplane in the system, and can be arranged in a stacked configuration with other instances of the interconnect module. In these ways, the interconnect module facilitates dense, modular or scalable, and compact electrical and optical communication in the system.

Abstract translation: 描述了用于传送电信号和光信号的互连模块。 特别地，互连模块中的集成电路经由电连接器接收并传输包括互连模块的系统中的其它部件的电信号。 此外，集成电路接收并发送电信号到执行电 - 光和光 - 电转换的混合硅 - 光子桥芯片。 反过来，该桥芯片通过光纤接收和发送光信号。 互连模块可以可重新连接到系统中的背板，并且可以以互连模块的其他实例布置成堆叠配置。 以这些方式，互连模块便于在系统中进行密集，模块化或可缩放的电气和光通信。