Patent search ap:("OSAKA UNIVERSITY") AND inv:"Seungjun Noh" Page 1

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发明授权
Bonding member, method for producing bonding member and method for producing bonding structure 有权

公开(公告)号：US12134146B2

公开(公告)日：2024-11-05

申请号：US17812352

申请日：2022-07-13

Applicant: OSAKA UNIVERSITY

Inventor： Katsuaki Suganuma , Chuantong Chen , Toshiyuki Ishina , Seungjun Noh , Chanyang Choe

IPC: B23K35/00 , B23K35/30 , B32B15/01 , H01L23/00

Abstract: A bonding member (10) includes surface-processed silver surfaces (11a, 11b).

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