公开(公告)号：US20180185654A1

公开(公告)日：2018-07-05

申请号：US15739982

申请日：2016-06-29

Applicant: OSONG MEDICAL INNOVATION FOUNDATION

Inventor： Jin-Won KIM ,  Jin-Hee MOON ,  In-Ho SONG ,  Sung-Keun YOO ,  Seung-A LEE ,  Ha-Chul JUNG ,  Dong-Jun MOON ,  Jin-Woo AHN ,  Sang-Hun LEE

IPC: A61N1/375 ,  H01G4/35

CPC classification number: A61N1/3754 ,  A61N1/375 ,  B23K20/02 ,  B23K26/38 ,  H01G4/35 ,  H01R2201/12

Abstract: A method of manufacturing a feedthrough having an enhanced hermetic sealing and used for a human implantable medical device such as a deep brain stimulator, a implantable AED, a implantable spinal cord stimulator and so on. Thus, more enhanced reproducibility and productivity in the diffusion welding and the laser hole machining may be guaranteed in the present method of manufacturing the feedthrough, compared to the conventional method using the ceramic metallizing and the brazing.

公开(公告)号：US20210193452A1

公开(公告)日：2021-06-24

申请号：US16756100

申请日：2018-08-07

Applicant: OSONG MEDICAL INNOVATION FOUNDATION

Inventor： Ha-Chul JUNG ,  Young-Jin KIM ,  Jin-Woo AHN ,  Seung-A LEE ,  Ha Na PARK

IPC: H01L21/027 ,  H01L21/324 ,  H01L21/768

Abstract: In a thin film electrode separation method using thermal expansion coefficient, a first solution is coated on a substrate. The first solution coated on the substrate is hardened. The substrate is left in a predetermined time, to form a first thin film having a first thermal expansion coefficient on the substrate. A photoresist is coated on the substrate having the thin film formed thereon. The photoresist coated on the substrate is hardened, to form a photoresist film having a second thermal expansion coefficient. A metal and a passivation layer are formed on the photoresist film. The photoresist film is detached from the first thin film, using difference of a thermal expansion coefficient between the photoresist film and the first thin film.

公开(公告)号：US20180221635A1

公开(公告)日：2018-08-09

申请号：US15748184

申请日：2016-07-29

Applicant: OSONG MEDICAL INNOVATION FOUNDATION

Inventor： Jin-Hee MOON ,  In-Ho SONG ,  Jin-Won KIM ,  Seung-A LEE ,  Ha-Chul JUNG ,  Jin-Won AHN ,  Sang-Hun LEE ,  A-Hee KIM

IPC: A61M37/00 ,  A61M31/00 ,  A61N1/05 ,  B81B1/00 ,  B81C1/00

CPC classification number: A61M37/00 ,  A61M31/002 ,  A61M2037/0007 ,  A61M2037/0023 ,  A61M2037/003 ,  A61M2205/04 ,  A61M2205/054 ,  A61M2207/00 ,  A61N1/05 ,  B81B1/00 ,  B81B1/008 ,  B81B3/00 ,  B81B7/02 ,  B81B2201/055 ,  B81B2203/0338 ,  B81C1/00 ,  B81C1/00111 ,  B81C3/00

Abstract: In an implantable hybrid lead and a method of manufacturing the implantable hybrid lead, the implantable hybrid lead includes a conduit, a line electrode and a plurality of electrode terminals. The conduit has a fine channel through which a medicine is injected. The line electrode is inserted to and is combined with an outside of the conduit, and applies electrical simulation to a selected portion of a living body. A plurality of electrode terminals is disposed at an end of the conduit by a predetermined distance.