公开(公告)号：US20200381601A1

公开(公告)日：2020-12-03

申请号：US16993791

申请日：2020-08-14

Applicant: OSRAM OLED GmbH

Inventor： Tony Albrecht ,  Tamas Lamfalusi ,  Christian Gatzhammer

IPC: H01L33/54 ,  H01L33/50 ,  H01L33/56 ,  H01L33/48 ,  H01L33/00

Abstract: An optoelectronic component includes an optoelectronic semiconductor chip including a connection surface; a first potting body; and a second potting body, wherein the first potting body covers all lateral side surfaces and the top surface of the semiconductor chip, the first potting body has a bottom surface flush with the connection surface, the second potting body has a bottom surface flush with the bottom surface, the second potting body completely covers all side surfaces of the first potting body facing away from the semiconductor chip, a top surface of the second potting body on the opposite of the connection surface is convexly curved, the first and second potting bodies have a contour in a lateral plane that is not similar, and the optoelectronic semiconductor chip has exclusively on its connection surface exposed electrical contact surfaces via which the semiconductor chip is electrically connectable and operable.

公开(公告)号：US11177421B2

公开(公告)日：2021-11-16

申请号：US16993791

申请日：2020-08-14

Applicant: OSRAM OLED GmbH

Inventor： Tony Albrecht ,  Tamas Lamfalusi ,  Christian Gatzhammer

IPC: H01L33/00 ,  H01L33/54 ,  H01L33/50 ,  H01L33/56 ,  H01L33/48

Abstract: An optoelectronic component includes an optoelectronic semiconductor chip including a connection surface; a first potting body; and a second potting body, wherein the first potting body covers all lateral side surfaces and the top surface of the semiconductor chip, the first potting body has a bottom surface flush with the connection surface, the second potting body has a bottom surface flush with the bottom surface, the second potting body completely covers all side surfaces of the first potting body facing away from the semiconductor chip, a top surface of the second potting body on the opposite of the connection surface is convexly curved, the first and second potting bodies have a contour in a lateral plane that is not similar, and the optoelectronic semiconductor chip has exclusively on its connection surface exposed electrical contact surfaces via which the semiconductor chip is electrically connectable and operable.

公开(公告)号：US10790421B2

公开(公告)日：2020-09-29

申请号：US16097769

申请日：2017-05-10

Applicant: OSRAM OLED GmbH

Inventor： Tony Albrecht ,  Tamas Lamfalusi ,  Christian Gatzhammer

IPC: H01L33/00 ,  H01L33/54 ,  H01L33/50 ,  H01L33/56 ,  H01L33/48

Abstract: An optoelectronic component includes an optoelectronic semiconductor chip including a first potting body; and a second potting body, wherein the first potting body covers all lateral side surfaces and a top surface of the semiconductor chip, the first potting body has a bottom surface flush with a connection surface of the semiconductor chip, the second potting body has a bottom surface flush with the bottom surface of the first potting body, the second potting body completely covers all side surfaces of the first potting body facing away from the semiconductor chip, a top surface of the second potting body on the opposite of the connection surface is convexly curved, and the optoelectronic semiconductor chip has exclusively on its connection surface exposed electrical contact surfaces via which the semiconductor chip is electrically connectable and operable.