公开(公告)号：US10811582B2

公开(公告)日：2020-10-20

申请号：US15737738

申请日：2016-06-15

Applicant: OSRAM OLED GmbH

Inventor： Andreas Loeffler ,  Thomas Hager ,  Christoph Walter ,  Alfred Lell

IPC: H01L33/64 ,  H01L25/16 ,  H01L31/02 ,  H01L31/024 ,  H01L31/167 ,  H01L33/48 ,  H01L33/62 ,  H01S5/022 ,  H01S5/024 ,  H01L31/0232 ,  H01L33/58 ,  H01S5/00

Abstract: An arrangement is disclosed. In an embodiment the arrangement includes at least one semiconductor component and a heat sink, wherein the semiconductor component is arranged on the heat sink, wherein the heat sink is configured to dissipate heat from the semiconductor component, wherein the heat sink comprises a thermally conductive material, and wherein the material comprises at least aluminum and silicon.