公开(公告)号：US11437550B2

公开(公告)日：2022-09-06

申请号：US16968901

申请日：2019-02-11

Applicant: OSRAM OLED GmbH

Inventor： Isabel Otto ,  Holger Klassen ,  Berthold Hahn

IPC: H01L23/544 ,  H01L33/50 ,  H01L33/00

Abstract: An optoelectronic component that emits electromagnetic radiation from a radiation exit surface of the optoelectronic component includes a radiation-emitting semiconductor chip that produces electromagnetic radiation, and a marker element applied to the radiation exit surface of the optoelectronic component, the marker element including a dye substance that can be removed from the radiation exit surface using a solvent and/or is permeable to the electromagnetic radiation of the optoelectronic component, wherein the dye substance includes a resin into which fluorescent particles are introduced that convert electromagnetic radiation of a first wavelength range into electromagnetic radiation of a second wavelength range, the first wavelength range and the second wavelength range being within the ultraviolet spectral range.

公开(公告)号：US20210183800A1

公开(公告)日：2021-06-17

申请号：US17057036

申请日：2019-06-03

Applicant: OSRAM OLED GmbH

Inventor： Klaus Müller ,  Holger Klassen ,  Matthias Hofmann

IPC: H01L23/00

Abstract: In an embodiment a method for producing a semiconductor component comprising at least one semiconductor chip mounted on a surface, wherein the semiconductor chip is fixed on the surface by applying a solder compound to an assembling surface of the semiconductor chip, applying a metallic adhesive layer to a side of the solder compound facing away from the assembling surface, preheating the surface to a first temperature T1, bringing the metallic adhesive layer into mechanical contact in a solid state with the preheated surface, the metallic adhesive layer at least partially melting while it is brought into mechanical contact with the preheated surface, and subsequently cooling the surface to room temperature, the semiconductor chip being at least partially metallurgically bonded to the surface, and wherein the semiconductor chip is subsequently soldered to the surface to form a resulting solder connection.

公开(公告)号：US11450794B2

公开(公告)日：2022-09-20

申请号：US16639722

申请日：2018-07-23

Applicant: OSRAM OLED GmbH

Inventor： Paola Altieri-Weimar ,  Ingo Neudecker ,  Michael Zitzlsperger ,  Stefan Groetsch ,  Holger Klassen

IPC: H01L33/62 ,  H01L33/00 ,  H01L33/38

Abstract: A carrier and a component are disclosed. In an embodiment a component includes a semiconductor chip including a substrate and a semiconductor body arranged thereon and a metallic carrier having a coefficient of thermal expansion which is at least 1.5 times greater than a coefficient of thermal expansion of the substrate or of the semiconductor chip, wherein the semiconductor chip is attached to a mounting surface of the metallic carrier by a connection layer such that the connection layer is located between the semiconductor chip and a buffer layer and adjoins a rear side of the semiconductor chip, wherein the buffer layer has a yield stress which is at least 10 MPa and at most 300 MPa, and wherein the substrate of the semiconductor chip and the metallic carrier of the component have a higher yield stress than the buffer layer.

公开(公告)号：US20200235271A1

公开(公告)日：2020-07-23

申请号：US16639722

申请日：2018-07-23

Applicant: OSRAM OLED GmbH

Inventor： Paola Altieri-Weimar ,  Ingo Neudecker ,  Michael Zitzlsperger ,  Stefan Groetsch ,  Holger Klassen

IPC: H01L33/62 ,  H01L33/38 ,  H01L33/00

Abstract: A carrier and a component are disclosed. In an embodiment a component includes a semiconductor chip including a substrate and a semiconductor body arranged thereon and a metallic carrier having a coefficient of thermal expansion which is at least 1.5 times greater than a coefficient of thermal expansion of the substrate or of the semiconductor chip, wherein the semiconductor chip is attached to a mounting surface of the metallic carrier by a connection layer such that the connection layer is located between the semiconductor chip and a buffer layer and adjoins a rear side of the semiconductor chip, wherein the buffer layer has a yield stress which is at least 10 MPa and at most 300 MPa, and wherein the substrate of the semiconductor chip and the metallic carrier of the component have a higher yield stress than the buffer layer.

公开(公告)号：US11521946B2

公开(公告)日：2022-12-06

申请号：US17057036

申请日：2019-06-03

Applicant: OSRAM OLED GmbH

Inventor： Klaus Müller ,  Holger Klassen ,  Matthias Hofmann

IPC: H01L23/00 ,  H01L33/62

Abstract: In an embodiment a method for producing a semiconductor component comprising at least one semiconductor chip mounted on a surface, wherein the semiconductor chip is fixed on the surface by applying a solder compound to an assembling surface of the semiconductor chip, applying a metallic adhesive layer to a side of the solder compound facing away from the assembling surface, preheating the surface to a first temperature T1, bringing the metallic adhesive layer into mechanical contact in a solid state with the preheated surface, the metallic adhesive layer at least partially melting while it is brought into mechanical contact with the preheated surface, and subsequently cooling the surface to room temperature, the semiconductor chip being at least partially metallurgically bonded to the surface, and wherein the semiconductor chip is subsequently soldered to the surface to form a resulting solder connection.

公开(公告)号：US20210050490A1

公开(公告)日：2021-02-18

申请号：US16968901

申请日：2019-02-11

Applicant: OSRAM OLED GmbH

Inventor： Isabel Otto ,  Holger Klassen ,  Berthold Hahn

IPC: H01L33/50 ,  H01L33/00

Abstract: An optoelectronic component that emits electromagnetic radiation from a radiation exit surface of the optoelectronic component includes a radiation-emitting semiconductor chip that produces electromagnetic radiation, and a marker element applied to the radiation exit surface of the optoelectronic component, the marker element including a dye substance that can be removed from the radiation exit surface using a solvent and/or is permeable to the electromagnetic radiation of the optoelectronic component, wherein the dye substance includes a resin into which fluorescent particles are introduced that convert electromagnetic radiation of a first wavelength range into electromagnetic radiation of a second wavelength range, the first wavelength range and the second wavelength range being within the ultraviolet spectral range.