LASER DIODE CHIP
    1.
    发明申请

    公开(公告)号:US20210305776A1

    公开(公告)日:2021-09-30

    申请号:US17263786

    申请日:2019-07-30

    Abstract: A laser diode chip is described, comprising: an n-type semiconductor region (3), a p-type semiconductor region (5), and an active layer (4) arranged between the n-type semiconductor region (3) and the p-type semiconductor region (5), an n-type contact (9) and a p-type contact (8), at least one heating element (14) arranged on a side of the laser diode chip facing the p-type semiconductor region (5), the heating element (14) functioning as a resistance heater, and at least one metallic seed layer (7, 11), wherein the heating element comprises a part (11) of the seed layer, and wherein the p-type contact (8) is arranged on a further part (7) of the seed layer (7, 11).

    LIGHT-EMITTING DEVICE
    2.
    发明申请

    公开(公告)号:US20200343686A1

    公开(公告)日:2020-10-29

    申请号:US16757056

    申请日:2018-10-16

    Inventor: Peter JANDER

    Abstract: A light-emitting device (100) is specified, which has a housing (1) with a mounting surface (12) and a housing recess (13), a semiconductor laser diode (2) being arranged in the housing recess, which is intended and embodied to emit laser light (20) in a direction parallel to the mounting surface (12) during operation, an optical element (4) being arranged downstream of the semiconductor laser diode in the beam path of the laser light, the semiconductor laser diode being mounted in the housing in such a way that the laser light has a maximum divergence in a plane parallel to the mounting surface, the optical element having a light-incoupling surface (41), exactly one reflector surface (42) and a light-outcoupling surface (43), the optical element being a one-piece housing cover which completely covers the housing recess in which the semiconductor laser diode is arranged, and the light-outcoupling surface being part of an outer surface of the optical element opposite the mounting surface.

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