公开(公告)号：US12300674B2

公开(公告)日：2025-05-13

申请号：US17615446

申请日：2020-10-29

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Michael Brandl ,  Andreas Dobner ,  Matthias Goldbach ,  Sebastian Wittmann ,  Uli Hiller ,  Markus Klein ,  Thomas Schwarz ,  Andreas Waldschik ,  Michael Wittmann ,  Matthias Bruckschloegl ,  Stefan Groetsch ,  Rainer Huber ,  Peter Brick ,  Ludwig Hofbauer

IPC: H01L25/075 ,  B60K35/00 ,  H01L33/60 ,  H10H20/80 ,  H10H20/856

Abstract: An optoelectronic device, in particular an at least semi-transparent pane for example for a vehicle, comprises: a cover layer, a carrier layer, an intermediate layer between the cover layer and the carrier layer, wherein at least one and preferably a plurality of optoelectronic light sources, in particular μLEDS, is arranged on at least one surface of the intermediate layer and/or is at least partially embedded in the intermediate layer, wherein the intermediate layer is adapted such that light emitted by the optoelectronic light sources at least partially spreads in and along the intermediate layer and exits the intermediate layer within and/or at a pre-set distance to the respective optoelectronic light source in a direction through the cover layer and/or through the carrier layer.

公开(公告)号：US12291096B2

公开(公告)日：2025-05-06

申请号：US17615396

申请日：2020-10-29

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Matthias Goldbach ,  Stefan Groetsch ,  Ludwig Hofbauer ,  Sebastian Wittmann ,  Robert Regensburger ,  Thomas Schwarz ,  Michael Brandl ,  Andreas Dobner ,  Sebastian Stigler

IPC: H01B3/30 ,  B60K35/00 ,  B60K35/60 ,  H01B7/00 ,  H01B13/10 ,  H10H20/857 ,  H10H20/01

Abstract: An optoelectronic device comprises a plurality of layer segments, in particular intermediate layer segments, arranged between a cover layer and a carrier layer. At least one optoelectronic component is arranged on at least one of the plurality of layer segments and a first and a second layer segment of the plurality of the layer segments are overlapping each other along a first direction each forming a respective boundary region. The first layer segment comprises at least one first contact pad and the second layer segment comprises at least one second contact pad, wherein the at least one first and second contact pad are arranged in the respective boundary region facing each other and being mechanically and electrically connected. The at least one first and second contact pad each comprises a plurality of nanowires which are at least partially made of conductive material such as for example copper, gold, or nickel.

公开(公告)号：US20220336697A1

公开(公告)日：2022-10-20

申请号：US17633081

申请日：2020-07-28

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Andreas Dobner ,  Matthias Goldbach ,  Georg Bogner

IPC: H01L33/00 ,  H01L31/02 ,  H01L31/18 ,  H01L33/32 ,  H01L33/62

Abstract: In an embodiment a method for singulating components from a component composite includes providing the component composite comprising a structured substrate including component carrier bodies and connecting portions arranged between the component carrier bodies, and a base material, in which the connecting portions of the structured substrate are at least partially embedded, removing the base material in separating regions of the component composite, which include the connecting portions and singulating the component composite at the separating regions to form the components.

公开(公告)号：US20180287018A1

公开(公告)日：2018-10-04

申请号：US15764938

申请日：2016-09-29

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Matthias Goldbach ,  Andreas Gruendl

IPC: H01L33/50

Abstract: An optoelectronic component includes a layer configured to generate an electromagnetic radiation including a first wavelength; a second layer including a conversion material and a scattering material, wherein the conversion material is configured to shift the first wavelength of the electromagnetic radiation to a second wavelength, and the scattering material is configured to scatter the first wavelength to a greater extent than the second wavelength.

公开(公告)号：US09620694B2

公开(公告)日：2017-04-11

申请号：US15102904

申请日：2014-12-10

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Michael Zitzlsperger ,  Matthias Goldbach

IPC: H01L33/62 ,  H01L33/48 ,  H01L33/54

CPC classification number: H01L33/62 ,  H01L33/486 ,  H01L33/54 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48471 ,  H01L2224/48479 ,  H01L2924/00014 ,  H01L2933/0033 ,  H01L2933/005 ,  H01L2933/0066 ,  H01L2224/4554

Abstract: An optoelectronic component includes a leadframe, a molded body connected to the leadframe, and an optoelectronic semiconductor chip arranged on the leadframe, wherein the leadframe includes an alignment opening, and wherein the molded body includes a recess via which the leadframe is exposed in the area of the alignment opening.

公开(公告)号：US12288830B2

公开(公告)日：2025-04-29

申请号：US17633081

申请日：2020-07-28

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Andreas Dobner ,  Matthias Goldbach ,  Georg Bogner

IPC: H01L33/00 ,  H01L31/02 ,  H01L31/18 ,  H01L33/32 ,  H01L33/62 ,  H01L25/04 ,  H01L25/075 ,  H01L25/16

Abstract: In an embodiment a method for singulating components from a component composite includes providing the component composite comprising a structured substrate including component carrier bodies and connecting portions arranged between the component carrier bodies, and a base material, in which the connecting portions of the structured substrate are at least partially embedded, removing the base material in separating regions of the component composite, which include the connecting portions and singulating the component composite at the separating regions to form the components.

公开(公告)号：US09985178B2

公开(公告)日：2018-05-29

申请号：US15027971

申请日：2014-10-06

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Matthias Goldbach

IPC: H01L33/20 ,  H01L33/00 ,  H01L33/16 ,  H01L33/30 ,  H01L33/38

CPC classification number: H01L33/20 ,  H01L33/0066 ,  H01L33/0095 ,  H01L33/16 ,  H01L33/30 ,  H01L33/38 ,  H01L33/385

Abstract: The invention concerns a semiconductor chip (100) with a semiconductor body (2) having a semiconductor layer sequence, and with a substrate body (4) and at least one upper side contact (8). In projection the semiconductor chip (100) has a shape which deviates from a rectangular shape. The invention also concerns a method of separating a composite into a plurality of semiconductor chips (100) along a separation pattern (15) with the steps enabling a plurality of semiconductor chips according to the invention to be produced.

公开(公告)号：US20250096206A1

公开(公告)日：2025-03-20

申请号：US18970720

申请日：2024-12-05

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Michael BRANDL ,  Andreas Dobner ,  Matthias Goldbach ,  Sebastian Wittmann ,  Uli Hiller ,  Markus Klein ,  Thomas Schwarz ,  Andreas Waldschik ,  Michael Wittmann ,  Matthias Bruckschloegl ,  Stefan Groetsch ,  Rainer Huber ,  Peter Brick ,  Ludwig Hofbauer

IPC: H01L25/075 ,  B60K35/00 ,  H01L33/60

Abstract: An optoelectronic device, in particular an at least partially transparent pane for example of a vehicle, comprises a first layer, in particular an intermediate layer arranged between a cover layer and a carrier layer, at least one electronic or optoelectronic component, which is at least partially or completely embedded in the first layer and at least one structured conductor layer. A first portion of the conductor layer is arranged on an upper surface of the first layer and a second portion of the conductor layer is arranged on a top surface of the electronic or optoelectronic component and is in contact with an electric contact of the electronic or optoelectronic component. The electric contact, in particular a contact pad, is arranged on the top surface.

公开(公告)号：US12040317B2

公开(公告)日：2024-07-16

申请号：US17541761

申请日：2021-12-03

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Michael Brandl ,  Andreas Dobner ,  Matthias Goldbach ,  Sebastian Wittmann ,  Uli Hiller ,  Markus Klein ,  Thomas Schwarz ,  Andreas Waldschik ,  Michael Wittmann ,  Matthias Bruckschloegl ,  Stefan Groetsch ,  Rainer Huber ,  Peter Brick ,  Ludwig Hofbauer

IPC: H04W72/20 ,  H01L25/075 ,  H01L33/46 ,  H01L33/62 ,  H01L33/64 ,  H04W72/51 ,  B60J3/00 ,  B60K35/00 ,  B60K35/60 ,  B62J50/22

CPC classification number: H01L25/0756 ,  H01L33/46 ,  H01L33/62 ,  H01L33/641 ,  H04W72/20 ,  H04W72/51 ,  B60J3/00 ,  B60K35/00 ,  B60K35/60 ,  B60K2370/785 ,  B62J50/22

Abstract: An optoelectronic device comprises a plurality of optoelectronic light sources being arranged on a first layer, in particular an intermediate layer being arranged between a cover layer and a carrier layer. The first layer comprises or consists of an at least partially transparent material and each optoelectronic light source of the plurality of optoelectronic light sources comprises an individual light converter for converting light emitted by the associated light source into converted light. The light converter of each optoelectronic light source is arranged on the first layer and/or the associated optoelectronic light source.

公开(公告)号：US12027656B2

公开(公告)日：2024-07-02

申请号：US17431073

申请日：2020-02-17

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Michael Zitzlsperger ,  Matthias Goldbach ,  Benjamin Höflinger

IPC: H01L27/15 ,  H01L23/495 ,  H01L25/075 ,  H01L33/00 ,  H01L33/48 ,  H01L33/60 ,  H01L33/62

CPC classification number: H01L33/62 ,  H01L23/495 ,  H01L25/0753 ,  H01L33/005 ,  H01L33/486 ,  H01L33/60 ,  H01L2933/0058 ,  H01L2933/0066

Abstract: In one embodiment, the optoelectronic semiconductor device comprises at least two metallic lead frame parts and a circuit chip on the lead frame parts. An electrically insulating and opaque matrix material mechanically connects the lead frame parts. The circuit chip is embedded in the matrix material, so that a carrier is formed by the matrix material together with the lead frame parts and the circuit chip. An optoelectronic semiconductor chip is provided on a carrier upper side. Furthermore, the semiconductor device comprises at least one optical component on the carrier upper side.