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公开(公告)号:US10071880B2
公开(公告)日:2018-09-11
申请号:US14768526
申请日:2013-02-21
Applicant: OTIS ELEVATOR COMPANY
Inventor: Andreas Tutat , Ibrahim Ia Atalmis , Herbert Horbrügger , Marvin Dehmlow
CPC classification number: B66B1/302 , B66B1/306 , B66B1/308 , B66B11/002 , H01H71/10 , H05K1/0206 , H05K1/0265 , H05K2201/10166 , H05K2201/10416 , Y02B50/127
Abstract: A drive unit for an elevator system, the drive unit including a multilayer, power circuit board; a first DC link formed in a layer of the power circuit board; a second DC link formed in a layer of the power circuit board; a first switch having a first terminal, the first switch mounted to a surface of the power circuit board; a first via electrically coupling the first terminal to the first DC link; a second switch having a second terminal, the second switch mounted to the surface of the power circuit board; and a second via electrically coupling the second terminal to the second DC link; the first via conducting heat from the first switch to the first DC link; the second via conducting heat from the second switch to the second DC link.
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公开(公告)号:US20160039633A1
公开(公告)日:2016-02-11
申请号:US14768526
申请日:2013-02-21
Applicant: OTIS ELEVATOR COMPANY
Inventor: Andreas Tutat , Ibrahim IA Atalmis , Herbert Horbrügger , Marvin Dehmlow
CPC classification number: B66B1/302 , B66B1/306 , B66B1/308 , B66B11/002 , H01H71/10 , H05K1/0206 , H05K1/0265 , H05K2201/10166 , H05K2201/10416 , Y02B50/127
Abstract: A drive unit for an elevator system, the drive unit including a multilayer, power circuit board; a first DC link formed in a layer of the power circuit board; a second DC link formed in a layer of the power circuit board; a first switch having a first terminal, the first switch mounted to a surface of the power circuit board; a first via electrically coupling the first terminal to the first DC link; a second switch having a second terminal, the second switch mounted to the surface of the power circuit board; and a second via electrically coupling the second terminal to the second DC link; the first via conducting heat from the first switch to the first DC link; the second via conducting heat from the second switch to the second DC link.
Abstract translation: 一种用于电梯系统的驱动单元,所述驱动单元包括多层电力电路板; 形成在所述电源电路板的层中的第一DC链路; 形成在所述电源电路板的层中的第二DC链路; 具有第一端子的第一开关,所述第一开关安装到所述电源电路板的表面; 第一通路,电连接第一端子到第一DC连接器; 具有第二端子的第二开关,所述第二开关安装到所述电源电路板的表面; 以及第二通孔,其将所述第二端子电耦合到所述第二DC链路; 所述第一通过从所述第一开关传导至所述第一DC链路的热量; 第二通过从第二开关传导到第二DC链路的热量。
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