公开(公告)号：US5109269A

公开(公告)日：1992-04-28

申请号：US726780

申请日：1991-07-08

Applicant: Ofer Holzman

Inventor： Ofer Holzman

IPC: H05K3/34 ,  H05K3/40 ,  H05K13/04

CPC classification number: H05K3/341 ,  H05K13/046 ,  H05K3/3426 ,  H05K2201/09663 ,  H05K2201/09781 ,  H05K2201/1028 ,  H05K2201/10659 ,  H05K2201/10689 ,  H05K2201/10931 ,  H05K2201/10962 ,  H05K2201/10969 ,  H05K2203/048 ,  H05K3/4015 ,  Y02P70/613 ,  Y10S269/903 ,  Y10T29/49144

Abstract: An SMT electronic component is mounted to a solder-bearing floatation plate by fusible or other heat-responsive releasable mounting means which suspend the component above the floatation plate. The bottom of the floatation plate is effectively substantially the mirror image of a component-positioning pad formed on the board surface adjacent the solder-bearing contact pads corresponding to the electrical contacts on the component. In the assembly process, the floatation plate is placed on the positioning pad. The solder on the bottom of the floatation plate has a melting point lower than the release temperature of the mounting means and the melting point of the solder on the contact pads. With the floatation plate on the component-positioning pad, on heating the solder on the floatation plate liquifies first, wetting the component-positioning pad and floating the floatation plate and component on a thin film of molten solder. Surface tension forces bring the floatation plate into registry with the component-positioning pad. On further heating, the solder on the contact pads liquifies, and the heat-responsive mounting means allows the component to fall freely onto the contact pads. Guide means are provided to prevent rotational and lateral displacement of the component during the fall. The disclosure includes alternative floatation plate constructions and component mounting arrangements.

Abstract translation: SMT电子部件通过可熔或其它热响应的可释放的安装装置安装到焊料浮动板上，该安装装置将浮动板上方的部件悬挂。 漂浮板的底部基本上是形成在板表面上的与形成在组件上的电触点对应的焊料支承接触垫相邻的部件定位焊盘的镜像。 在组装过程中，将浮选板放置在定位垫上。 浮选板底部的焊料的熔点低于安装装置的释放温度和接触焊盘上焊料的熔点。 通过浮动板在组件定位垫上，加热漂浮板上的焊料首先液化，润湿组件定位垫，并将浮选板和组件浮在熔融焊料薄膜上。 表面张力使浮板与元件定位垫对准。 在进一步加热时，接触焊盘上的焊料液化，并且热响应安装装置允许部件自由落入接触焊盘。 提供引导装置以防止部件在坠落期间的旋转和横向位移。 本公开包括替代的漂浮板结构和部件安装布置。