公开(公告)号：US20140073088A1

公开(公告)日：2014-03-13

申请号：US13981871

申请日：2012-10-19

Applicant: PANASONIC CORPORATION

Inventor： Tadashi Maeda ,  Hiroki Maruo ,  Tsubasa Saeki

IPC: H01L23/00

CPC classification number: H01L24/81 ,  B23K1/0008 ,  B23K1/008 ,  B23K1/203 ,  B23K3/0669 ,  B23K2101/42 ,  H01L2924/351 ,  H05K3/305 ,  H05K3/3436 ,  H05K3/3442 ,  H05K13/0465 ,  H05K13/0469 ,  H05K2203/0126 ,  Y02P70/613 ,  Y10T29/49169 ,  H01L2924/00

Abstract: Disclosed is an electronic component mounting line on which a substrate undergoes solder paste printing, electronic component placements, and then reflow, while being moved from upstream to downstream. The line includes: a substrate feeding machine; a printing machine for applying solder paste to a first placement area of the substrate; a first electronic component placement machine for placing a first electronic component on the first placement area; a second electronic component placement machine for dispensing a thermosetting resin onto a reinforcement position on a peripheral edge portion of a second placement area of the substrate, and for placing on the area the second electronic component having solder bumps; and a reflow machine for bonding the electronic components to the substrate, by heating and cooling the resultant. The second electronic component is placed after the resin is dispensed, such that a peripheral edge portion thereof comes in contact with the resin.

Abstract translation: 公开了一种电子部件安装线，其中衬底经过焊膏打印，电子部件放置，然后从上游向下游移动，然后回流。 该线包括：基材喂料机; 用于将焊膏施加到基板的第一放置区域的印刷机; 第一电子元件贴装机，用于将第一电子元件放置在所述第一放置区域上; 第二电子元件贴装机，用于将热固性树脂分配到所述基板的第二放置区域的周边边缘部分上的加强位置上，并且用于在所述区域上放置所述第二电子部件具有焊料凸块; 以及用于将电子部件接合到基板的回流机，通过加热和冷却所得物。 第二电子部件放置在分配树脂之后，使得其周边部分与树脂接触。

公开(公告)号：US09839143B2

公开(公告)日：2017-12-05

申请号：US14388734

申请日：2013-03-15

Applicant: PANASONIC CORPORATION

Inventor： Koji Motomura ,  Hideki Eifuku ,  Hiroki Maruo ,  Tadahiko Sakai

IPC: H01R12/62 ,  H05K3/36 ,  H05K3/34 ,  H05K1/14 ,  H05K3/32

CPC classification number: H05K3/363 ,  H05K1/147 ,  H05K3/323 ,  H05K3/3494 ,  H05K3/361 ,  H05K2203/0195 ,  H05K2203/0425 ,  H05K2203/163 ,  Y10T29/49126 ,  Y10T29/53174

Abstract: Disclosed is a system for mounting a flexible first substrate having a first connection region provided with a first electrode group, on a second substrate having a second connection region provided with a second electrode group. The system includes: a stage configured to support the second substrate; a unit for supplying a bonding material including conductive particles and a thermosetting resin, to at least one of the first and second electrode groups; a unit for placing the first substrate on the second substrate via the bonding material and a unit for successively performing a joining process by pressing a first electrode toward a second electrode and curing the thermosetting resin, using a heating tool, while moving the tool to a processing position of another first electrode not yet subjected to the joining process.

公开(公告)号：US09237686B2

公开(公告)日：2016-01-12

申请号：US14119148

申请日：2013-02-26

Applicant: PANASONIC CORPORATION

Inventor： Koji Motomura ,  Arata Kishi ,  Hiroki Maruo ,  Yasuhiro Suzuki ,  Hironori Munakata

IPC: H05K13/04 ,  H05K3/34 ,  H01L23/00 ,  H01L21/48

CPC classification number: H05K13/0465 ,  H01L21/4867 ,  H01L24/29 ,  H01L24/32 ,  H01L24/81 ,  H01L24/83 ,  H01L24/98 ,  H01L2224/0401 ,  H01L2224/05548 ,  H01L2224/0556 ,  H01L2224/06181 ,  H01L2224/06187 ,  H01L2224/16235 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73257 ,  H01L2224/81192 ,  H01L2224/8159 ,  H01L2224/816 ,  H01L2224/81815 ,  H01L2224/81862 ,  H01L2224/81885 ,  H01L2224/83886 ,  H01L2924/01322 ,  H05K3/3442 ,  H05K3/3452 ,  H05K3/3463 ,  H05K2201/099 ,  H05K2201/10977 ,  Y02P70/613 ,  H01L2924/00014 ,  H01L2924/0665 ,  H01L2924/014 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A wiring board on which an electronic component is to be mounted includes a resist having an opening exposing a joint face which is part of the surface of a wiring layer and to which a terminal of the electronic component is to be joined. In the placing step, the electronic component is placed on the wiring board such that the terminal covers the opening entirely and contacts the solder paste applied onto the joint face. Next, the solder paste applied onto the joint face is heated to melt solder and soften thermosetting resin. This allows the solder to gather in a first space within the opening closed with the wiring layer and the electronic component, while allowing the thermosetting resin to gather in a second space formed between a top side of the resist and a lateral side of the electronic component.

Abstract translation: 要安装电子部件的布线板包括具有露出作为布线层的表面的一部分的接合面的开口的抗蚀剂，并且电子部件的端子要被接合。 在放置步骤中，将电子部件放置在布线板上，使得端子完全覆盖开口并且接触施加到接合面上的焊膏。 接下来，将涂覆在接合面上的焊膏加热熔化焊料并软化热固性树脂。 这允许焊料在布线层和电子部件闭合的开口内的第一空间中聚集，同时允许热固性树脂聚集在形成在抗蚀剂的顶侧和电子部件的侧面之间的第二空间中 。

公开(公告)号：US20140158751A1

公开(公告)日：2014-06-12

申请号：US14119148

申请日：2013-02-26

Applicant: PANASONIC CORPORATION

Inventor： Koji Motomura ,  Arata Kishi ,  Hiroki Maruo ,  Yasuhiro Suzuki ,  Hironori Munakata

IPC: H05K13/04

CPC classification number: H05K13/0465 ,  H01L21/4867 ,  H01L24/29 ,  H01L24/32 ,  H01L24/81 ,  H01L24/83 ,  H01L24/98 ,  H01L2224/0401 ,  H01L2224/05548 ,  H01L2224/0556 ,  H01L2224/06181 ,  H01L2224/06187 ,  H01L2224/16235 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73257 ,  H01L2224/81192 ,  H01L2224/8159 ,  H01L2224/816 ,  H01L2224/81815 ,  H01L2224/81862 ,  H01L2224/81885 ,  H01L2224/83886 ,  H01L2924/01322 ,  H05K3/3442 ,  H05K3/3452 ,  H05K3/3463 ,  H05K2201/099 ,  H05K2201/10977 ,  Y02P70/613 ,  H01L2924/00014 ,  H01L2924/0665 ,  H01L2924/014 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A wiring board on which an electronic component is to be mounted includes a resist having an opening exposing a joint face which is part of the surface of a wiring layer and to which a terminal of the electronic component is to be joined. In the placing step, the electronic component is placed on the wiring board such that the terminal covers the opening entirely and contacts the solder paste applied onto the joint face. Next, the solder paste applied onto the joint face is heated to melt solder and soften thermosetting resin. This allows the solder to gather in a first space within the opening closed with the wiring layer and the electronic component, while allowing the thermosetting resin to gather in a second space formed between a top side of the resist and a lateral side of the electronic component.

Abstract translation: 要安装电子部件的布线板包括具有露出作为布线层的表面的一部分的接合面的开口的抗蚀剂，并且电子部件的端子要被接合。 在放置步骤中，将电子部件放置在布线板上，使得端子完全覆盖开口并且接触施加到接合面上的焊膏。 接下来，将涂覆在接合面上的焊膏加热熔化焊料并软化热固性树脂。 这允许焊料在布线层和电子部件闭合的开口内的第一空间中聚集，同时允许热固性树脂聚集在形成在抗蚀剂的顶侧和电子部件的侧面之间的第二空间中 。

公开(公告)号：US09125329B2

公开(公告)日：2015-09-01

申请号：US13978860

申请日：2012-10-19

Applicant: PANASONIC CORPORATION

Inventor： Tadashi Maeda ,  Hiroki Maruo ,  Tsubasa Saeki

IPC: H05K3/30 ,  H05K13/04 ,  H05K3/34

CPC classification number: H05K3/30 ,  H01L2224/16225 ,  H01L2924/19105 ,  H05K3/3436 ,  H05K13/0465 ,  H05K13/0469 ,  H05K2201/09909 ,  H05K2201/10636 ,  H05K2201/10674 ,  H05K2203/0126 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/4913 ,  Y10T29/53174

Abstract: Disclosed is an electronic component mounting line on which a substrate undergoes solder paste printing, electronic component placements, and then reflow, while being moved from upstream to downstream. The line includes: a substrate feeding machine for feeding the substrate; a screen printing machine for applying solder paste to the substrate; a first electronic component placement machine for placing a first electronic component on the substrate; a resin dispensing machine for dispensing a thermosetting resin onto at least one reinforcement position arranged on the substrate; a second electronic component placement machine for placing a second electronic component on the substrate, such that its peripheral edge portion comes in contact with the thermosetting resin; and a reflow machine for bonding the first and second electronic components to the substrate, by heating and cooling the resultant. The second electronic component placement machine is arranged adjacent to and downstream of the resin dispensing machine.

Abstract translation: 公开了一种电子部件安装线，其中衬底经过焊膏打印，电子部件放置，然后从上游向下游移动，然后回流。 该线包括：用于馈送衬底的衬底馈送机; 丝网印刷机，用于将焊膏涂布到基板上; 用于将第一电子部件放置在所述基板上的第一电子部件贴装机; 用于将热固性树脂分配到布置在所述基板上的至少一个加强位置的树脂分配机; 第二电子部件贴装机，用于将第二电子部件放置在基板上，使得其周边部分与热固性树脂接触; 以及用于通过加热和冷却所述第一和第二电子部件到所述基板来接合的回流机。 第二电子元件贴装机设置在树脂分配机附近和下游。

公开(公告)号：US09439335B2

公开(公告)日：2016-09-06

申请号：US13980817

申请日：2012-10-19

Applicant: PANASONIC CORPORATION

Inventor： Tadashi Maeda ,  Hiroki Maruo ,  Tsubasa Saeki

IPC: H05K3/34 ,  H05K13/04

CPC classification number: H05K13/0465 ,  H01L2224/16225 ,  H01L2924/19105 ,  H05K3/3436 ,  H05K13/0469 ,  H05K2201/09909 ,  H05K2203/0126 ,  Y02P70/613 ,  Y10T29/49144 ,  Y10T29/53178

Abstract: Disclosed is an electronic component mounting line on which a substrate undergoes solder paste printing, electronic component placements, and then reflow, while being moved from upstream to downstream. The line includes: a substrate feeding machine; a screen printing machine for applying solder paste to the substrate; a resin dispensing machine arranged downstream of the screen printing machine, for dispensing a thermosetting resin onto at least one reinforcement position on the substrate; a second electronic component placement machine arranged adjacent to and downstream of the resin dispensing machine, for placing a second electronic component on the substrate, such that its peripheral edge portion comes in contact with the resin; a first electronic component placement machine arranged downstream of the second electronic component placement machine, for placing a first electronic component on the substrate; and a reflow machine for bonding the electronic components to the substrate, by heating and cooling the resultant.

Abstract translation: 公开了一种电子部件安装线，其中衬底经过焊膏打印，电子部件放置，然后从上游向下游移动，然后回流。 该线包括：基材喂料机; 丝网印刷机，用于将焊膏涂布到基板上; 布置在丝网印刷机的下游的树脂分配机，用于将热固性树脂分配到基板上的至少一个加强位置上; 布置在所述树脂分配机附近和下游的第二电子部件放置机构，用于将第二电子部件放置在所述基板上，使得其周边部分与所述树脂接触; 布置在所述第二电子部件放置机的下游的第一电子部件放置机构，用于将第一电子部件放置在所述基板上; 以及用于将电子部件接合到基板的回流机，通过加热和冷却所得物。

公开(公告)号：US08673685B1

公开(公告)日：2014-03-18

申请号：US13981871

申请日：2012-10-19

Applicant: Panasonic Corporation

Inventor： Tadashi Maeda ,  Hiroki Maruo ,  Tsubasa Saeki

IPC: H01L21/44 ,  H01R43/00

CPC classification number: H01L24/81 ,  B23K1/0008 ,  B23K1/008 ,  B23K1/203 ,  B23K3/0669 ,  B23K2101/42 ,  H01L2924/351 ,  H05K3/305 ,  H05K3/3436 ,  H05K3/3442 ,  H05K13/0465 ,  H05K13/0469 ,  H05K2203/0126 ,  Y02P70/613 ,  Y10T29/49169 ,  H01L2924/00

Abstract: Disclosed is an electronic component mounting line on which a substrate undergoes solder paste printing, electronic component placements, and then reflow, while being moved from upstream to downstream. The line includes: a substrate feeding machine; a printing machine for applying solder paste to a first placement area of the substrate; a first electronic component placement machine for placing a first electronic component on the first placement area; a second electronic component placement machine for dispensing a thermosetting resin onto a reinforcement position on a peripheral edge portion of a second placement area of the substrate, and for placing on the area the second electronic component having solder bumps; and a reflow machine for bonding the electronic components to the substrate, by heating and cooling the resultant. The second electronic component is placed after the resin is dispensed, such that a peripheral edge portion thereof comes in contact with the resin.

Abstract translation: 公开了一种电子部件安装线，其中衬底经过焊膏打印，电子部件放置，然后从上游向下游移动，然后回流。 该线包括：基材喂料机; 用于将焊膏施加到基板的第一放置区域的印刷机; 第一电子元件贴装机，用于将第一电子元件放置在所述第一放置区域上; 第二电子元件贴装机，用于将热固性树脂分配到所述基板的第二放置区域的周边边缘部分上的加强位置上，并且用于在所述区域上放置所述第二电子部件具有焊料凸块; 以及用于将电子部件接合到基板的回流机，通过加热和冷却所得物。 第二电子部件放置在分配树脂之后，使得其周边部分与树脂接触。

公开(公告)号：US20150047185A1

公开(公告)日：2015-02-19

申请号：US14388734

申请日：2013-03-15

Applicant: PANASONIC CORPORATION

Inventor： Koji Motomura ,  Hideki Eifuku ,  Hiroki Maruo ,  Tadahiko Sakai

IPC: H05K3/36 ,  H05K3/34 ,  H05K1/14

CPC classification number: H05K3/363 ,  H05K1/147 ,  H05K3/323 ,  H05K3/3494 ,  H05K3/361 ,  H05K2203/0195 ,  H05K2203/0425 ,  H05K2203/163 ,  Y10T29/49126 ,  Y10T29/53174

Abstract: Disclosed is a system for mounting a flexible first substrate having a first connection region provided with a first electrode group, on a second substrate having a second connection region provided with a second electrode group. The system includes: a stage configured to support the second substrate; a unit for supplying a bonding material including conductive particles and a thermosetting resin, to at least one of the first and second electrode groups; a unit for placing the first substrate on the second substrate via the bonding material and a unit for successively performing a joining process by pressing a first electrode toward a second electrode and curing the thermosetting resin, using a heating tool, while moving the tool to a processing position of another first electrode not yet subjected to the joining process.

Abstract translation: 公开了一种用于安装具有设置有第一电极组的第一连接区域的柔性第一衬底的系统，在具有设置有第二电极组的第二连接区域的第二衬底上。 该系统包括：被配置为支撑第二基板的台; 用于向第一和第二电极组中的至少一个提供包括导电颗粒和热固性树脂的接合材料的单元; 用于经由接合材料将第一基板放置在第二基板上的单元和用于通过使第一电极朝向第二电极按压而连续进行接合处理的单元，并且使用加热工具固化热固性树脂，同时将工具移动到 未进行接合处理的另一第一电极的处理位置。

公开(公告)号：US20140208587A1

公开(公告)日：2014-07-31

申请号：US13978860

申请日：2012-10-19

Applicant: Panasonic Corporation

Inventor： Tadashi Maeda ,  Hiroki Maruo ,  Tsubasa Saeki

IPC: H05K3/30

CPC classification number: H05K3/30 ,  H01L2224/16225 ,  H01L2924/19105 ,  H05K3/3436 ,  H05K13/0465 ,  H05K13/0469 ,  H05K2201/09909 ,  H05K2201/10636 ,  H05K2201/10674 ,  H05K2203/0126 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/4913 ,  Y10T29/53174

Abstract: Disclosed is an electronic component mounting line on which a substrate undergoes solder paste printing, electronic component placements, and then reflow, while being moved from upstream to downstream. The line includes: a substrate feeding machine for feeding the substrate; a screen printing machine for applying solder paste to the substrate; a first electronic component placement machine for placing a first electronic component on the substrate; a resin dispensing machine for dispensing a thermosetting resin onto at least one reinforcement position arranged on the substrate; a second electronic component placement machine for placing a second electronic component on the substrate, such that its peripheral edge portion comes in contact with the thermosetting resin; and a reflow machine for bonding the first and second electronic components to the substrate, by heating and cooling the resultant. The second electronic component placement machine is arranged adjacent to and downstream of the resin dispensing machine.

Abstract translation: 公开了一种电子部件安装线，其中衬底经过焊膏打印，电子部件放置，然后从上游向下游移动，然后回流。 该线包括：用于馈送衬底的衬底馈送机; 丝网印刷机，用于将焊膏涂布到基板上; 用于将第一电子部件放置在所述基板上的第一电子部件贴装机; 用于将热固性树脂分配到布置在所述基板上的至少一个加强位置的树脂分配机; 第二电子部件贴装机，用于将第二电子部件放置在基板上，使得其周边部分与热固性树脂接触; 以及用于通过加热和冷却所述第一和第二电子部件到所述基板来接合的回流机。 第二电子元件贴装机设置在树脂分配机附近和下游。

公开(公告)号：US20140053398A1

公开(公告)日：2014-02-27

申请号：US13980817

申请日：2012-10-19

Applicant: PANASONIC CORPORATION

Inventor： Tadashi Maeda ,  Hiroki Maruo ,  Tsubasa Saeki

IPC: H05K13/04

CPC classification number: H05K13/0465 ,  H01L2224/16225 ,  H01L2924/19105 ,  H05K3/3436 ,  H05K13/0469 ,  H05K2201/09909 ,  H05K2203/0126 ,  Y02P70/613 ,  Y10T29/49144 ,  Y10T29/53178

Abstract: Disclosed is an electronic component mounting line on which a substrate undergoes solder paste printing, electronic component placements, and then reflow, while being moved from upstream to downstream. The line includes: a substrate feeding machine; a screen printing machine for applying solder paste to the substrate; a resin dispensing machine arranged downstream of the screen printing machine, for dispensing a thermosetting resin onto at least one reinforcement position on the substrate; a second electronic component placement machine arranged adjacent to and downstream of the resin dispensing machine, for placing a second electronic component on the substrate, such that its peripheral edge portion comes in contact with the resin; a first electronic component placement machine arranged downstream of the second electronic component placement machine, for placing a first electronic component on the substrate; and a reflow machine for bonding the electronic components to the substrate, by heating and cooling the resultant.

Abstract translation: 公开了一种电子部件安装线，其中衬底经过焊膏打印，电子部件放置，然后从上游向下游移动，然后回流。 该线包括：基材喂料机; 丝网印刷机，用于将焊膏涂布到基板上; 布置在丝网印刷机的下游的树脂分配机，用于将热固性树脂分配到基板上的至少一个加强位置上; 布置在所述树脂分配机附近和下游的第二电子部件放置机构，用于将第二电子部件放置在所述基板上，使得其周边部分与所述树脂接触; 布置在所述第二电子部件放置机的下游的第一电子部件放置机构，用于将第一电子部件放置在所述基板上; 以及用于将电子部件接合到基板的回流机，通过加热和冷却所得物。