公开(公告)号：US20230054257A1

公开(公告)日：2023-02-23

申请号：US17768170

申请日：2020-10-15

Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

Inventor： Yuki INOUE ,  Tatsuya ARISAWA ,  Yuki KITAI

IPC: B32B15/20 ,  B32B15/082

Abstract: A copper-clad laminate includes an insulating layer that contains a cured product of a resin composition containing a polymer having a structural unit represented by the following Formula (1) in a molecule, and a metal foil that is laminated on the insulating layer, and in which a chromium element amount, on an exposed surface of the insulating layer exposed by an etching treatment of the copper-clad laminate is 7.5 at % or less with respect to a total element amount on the exposed surface, and ten-point average roughness of the exposed surface is 2.0 μm or less. In Formula (1), Z represents an arylene group, R1 to R3 each independently represent a hydrogen atom or an alkyl group, and R4 to R6 each independently represent a hydrogen atom or an alkyl group having 1 to 6 carbon atoms.

公开(公告)号：US20210079215A1

公开(公告)日：2021-03-18

申请号：US16629829

申请日：2018-06-22

Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

Inventor： Tatsuya ARISAWA ,  Fumito SUZUKI ,  Shunji ARAKI ,  Hirohisa GOTO ,  Yuki INOUE

IPC: C08L71/12 ,  C08K5/00 ,  C08K5/3492 ,  C08K5/544 ,  C08K3/36 ,  C08K5/5399 ,  C08J5/24 ,  C08J5/04 ,  C08J5/18 ,  B32B15/08

Abstract: Provided is a resin composition containing: a modified polyphenylene ether compound terminally modified with a substituent having an unsaturated carbon-carbon double bond; a cross-linking curing agent having an unsaturated carbon-carbon double bond in its molecule; a silane coupling agent having a phenylamino group in its molecule; and silica. A content of the silica is 60 to 250 parts by mass with respect to a total of 100 parts by mass of the modified polyphenylene ether compound and the cross-linking curing agent.

公开(公告)号：US20220015230A1

公开(公告)日：2022-01-13

申请号：US17281845

申请日：2019-09-27

Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

Inventor： Yuki INOUE ,  Tatsuya ARISAWA ,  Shun YAMAGUCHI

IPC: H05K1/05 ,  G01N23/2273 ,  H05K1/09 ,  H05K3/00

Abstract: A copper-clad laminate includes an insulating layer and a copper foil in contact with at least one surface of the insulating layer, in which the insulating layer contains a cured product of a resin composition containing a modified polyphenylene ether compound of which a terminal is modified with a substituent having a carbon-carbon unsaturated double bond, a chromium element amount on an exposed surface on which the insulating layer is exposed by an etching treatment of the copper-clad laminate with a copper chloride solution, measured by X-ray photoelectron spectroscopy is 7.5 at % or less with respect to a total element amount measured by X-ray photoelectron spectroscopy, and a surface roughness of the exposed surface is 2.0 μm or less in terms of ten-point average roughness.