公开(公告)号：US12080836B2

公开(公告)日：2024-09-03

申请号：US17262605

申请日：2020-05-20

Applicant: PANELSEMI CORPORATION

Inventor： Chin-Tang Li

IPC: H01L33/62 ,  H01L25/075

CPC classification number: H01L33/62 ,  H01L25/0753 ,  H01L2933/0066

Abstract: An electronic device and a manufacturing method thereof are provided. The pattern circuit of each surface mount structure of the electronic device is disposed on the substrate; at least two through holes are respectively corresponding to at least two signal lines of the pattern circuit; and the two ends of at least one optoelectronic element are respectively electrically connected to at least two signal lines of the pattern circuit. Each connection pad group of the driving circuit board is corresponding to each surface mount structure, and at least two connection pads are respectively corresponding to the at least two through holes of the surface mount structure. At least two conductive members of each conductive member unit are disposed in the at least two through holes of the surface mount structure, respectively, and extending to the first surface and the second surface of the substrate. The conductive member disposed in each through hole electrically connects the signal lines of each surface mounting structure to the connection pads of each connection pad group of the driving circuit board.

公开(公告)号：US11923376B2

公开(公告)日：2024-03-05

申请号：US17522156

申请日：2021-11-09

Applicant: PanelSemi Corporation

Inventor： Chin-Tang Li

IPC: H01L27/12 ,  G09G3/20 ,  H01L23/528 ,  H05K1/11

CPC classification number: H01L27/124 ,  G09G3/20 ,  H01L23/528 ,  H05K1/118 ,  G09G2310/0264

Abstract: An electronic device includes a sustaining layer, multiple substrates, multiple photoelectric units, multiple signal layers, multiple driving structures, and a constraining structure. The substrates are arranged on a contact surface of the sustaining layer. A first end edge of at least one substrate approaches a first end edge of the sustaining layer, and a first side edge of one substrate is adjacent to a second side edge of another substrate. The photoelectric units are arranged on the first or/and second surfaces of the substrates. The signal layers are arranged on the substrates and electrically connected to the photoelectric units. The driving structures are electrically connected to the substrates and disposed close to the first or second end edge of the sustaining layer. The constraining structure constrains the first or second end edge of the sustaining layer, and at least one driving structure is accommodated in the constraining structure.

公开(公告)号：US12205938B2

公开(公告)日：2025-01-21

申请号：US18427303

申请日：2024-01-30

Applicant: PanelSemi Corporation

Inventor： Chin-Tang Li ,  Ting-Yen Lin ,  Chen-Hsun Yang

IPC: H01L25/16 ,  H01L25/075 ,  H01L33/62

Abstract: An electronic device includes a sustaining layer, multiple substrates, multiple photoelectric units, and multiple signal layers. The substrates are arranged on a contact surface of the sustaining layer. A first end edge of at least one substrate approaches a first end edge of the sustaining layer, and a first side edge of one substrate is adjacent to a second side edge of another substrate. The photoelectric units are arranged on the first or/and second surfaces of the substrates. The signal layers are arranged on the substrates and electrically connected to the photoelectric units.

公开(公告)号：US11678438B2

公开(公告)日：2023-06-13

申请号：US17562614

申请日：2021-12-27

Applicant: PANELSEMI CORPORATION

Inventor： Chin-Tang Li

IPC: H05K1/18 ,  H05K1/14 ,  H05K1/11

CPC classification number: H05K1/181 ,  H05K1/115 ,  H05K1/144 ,  H05K2201/041 ,  H05K2201/09609 ,  H05K2201/10121

Abstract: An electronic device includes a supporting board, an electrical board and electronic units. The supporting board includes a circuit layer. The electrical board has a board body, through holes through the board body, an electrical layer on the board body, and primary conductive elements respectively in the through holes. The board body has opposite first and second surfaces. The through holes communicate with the first surface and the second surface. The primary conductive elements electrically connect the electrical layer to the circuit layer. The electronic units are arranged on the first surface. Each electronic unit partially overlaps with one corresponding through hole in a projection direction of the electrical board. Each electronic unit has an electronic component and a secondary conductive element electrically connecting the electronic component to the electrical layer. The secondary conductive elements and the primary conductive elements are arranged in dislocation in the projection direction.

公开(公告)号：US12278314B2

公开(公告)日：2025-04-15

申请号：US17555727

申请日：2021-12-20

Applicant: PanelSemi Corporation

Inventor： Chin-Tang Li

IPC: H01L33/48 ,  H01L25/075 ,  H01L33/62

Abstract: A substrate structure includes a carrier board and a laminated structure. The carrier board has a board body, through holes and conductive portions. The board body has a first surface and a second surface. The through holes communicate the first and second surfaces. Each through hole has a first opening and a second opening. The conductive portions are arranged on the first surface, and the first opening is sealed by a corresponding conductive portion. The laminated structure includes a viscid layer and conductive elements. One surface of the viscid layer is in surface contact with the second surface. Each conductive element passes through and accommodates in the viscid layer, and corresponds to one through hole in a projection direction of the carrier board. One end of each conductive element is electrically connected to one conductive portion through the corresponding through hole.

公开(公告)号：US12136690B2

公开(公告)日：2024-11-05

申请号：US17349150

申请日：2021-06-16

Applicant: PanelSemi Corporation

Inventor： Chin-Tang Li

IPC: H01L33/60 ,  H01L25/16 ,  H01L33/58 ,  H01L33/62

Abstract: A light-emitting device comprises a transparent substrate, a reflection structure and a light-emitting unit. The transparent substrate is defined with a first surface and a second surface opposite to each other. The reflection structure is disposed on and contacts the second surface of the transparent substrate. The reflection structure includes a reflection layer and a circuit layer. The reflection structure is configured to define a light-transmitting window. The light-emitting unit is disposed corresponding to the light-transmitting window. The light-emitting unit is electrically connected to the circuit layer of the reflection structure, and one optical path of the light-emitting unit passes through the light-transmitting window.

公开(公告)号：US11462651B2

公开(公告)日：2022-10-04

申请号：US17067368

申请日：2020-10-09

Applicant: PanelSemi Corporation

Inventor： Chin-Tang Li

IPC: H01L29/04 ,  H01L29/10 ,  H01L31/00 ,  H01L31/0392 ,  H01L31/0224 ,  H01L27/32 ,  H01L31/0352

Abstract: An electronic device comprises plural first substrates, plural photoelectric structures, a third substrate, plural driving units, plural conductive layers and plural first conductive structures. The first substrates are arranged in coplanar in a first direction. The photoelectric structures are arranged in coplanar in the first direction and disposed on the first substrate. Each photoelectric structure has a second substrate, a signal layer and a photoelectric component. The photoelectric component is electrically connected to the signal line of the signal layer. One of the photoelectric structures straddles two adjacent first substrates. The third substrate is connected to the first substrate or the photoelectric structure. The driving units are distributed on the first substrate or the photoelectric structure, and the driving units correspondingly drive the photoelectric components of the photoelectric structures. The optoelectronic structures are electrically connected to the conductive layers via the first conductive structures, respectively.