公开(公告)号：US20230092161A1

公开(公告)日：2023-03-23

申请号：US17933584

申请日：2022-09-20

Applicant: PERASO TECHNOLOGIES INC.

Inventor： Atabak RASHIDIAN ,  Nima BAYAT-MAKOU ,  Marc SUPINSKI ,  Mihai TAZLAUANU

IPC: H01Q1/22 ,  H01Q1/24 ,  H01Q21/24 ,  H01Q21/28

Abstract: An antenna assembly configured to operate in a millimeter wave frequency of 30 GHz to 300 GHz, the antenna assembly being formed from a multi-layer printed circuit board having a plurality of eight square radiating rings positioned at generally equidistant locations within and surrounded by a rectangular grounded external ring which is positioned at the perimeter of the assembly. The antenna assembly also includes a plurality of feed network layers with a radio frequency chip and a baseband chip mounted onto the top of the plurality of feed network layers for controlling the operation of the eight square radiating rings.

公开(公告)号：US20210066804A1

公开(公告)日：2021-03-04

申请号：US17005978

申请日：2020-08-28

Applicant: PERASO TECHNOLOGIES INC.

Inventor： Mahmoud NIROO JAZI ,  Marc SUPINSKI ,  Mihai TAZLAUANU

IPC: H01Q9/04 ,  H01Q19/00

Abstract: A wireless communications module includes: a primary board including (i) a first surface bearing a radio controller, and defining a set of control contacts for connection to respective ports of the radio controller, and (ii) a second surface opposite the first surface; an antenna array integrated with the primary board, the antenna array including a plurality of unit cells each having: an inverted-L antenna having a planar element adjacent to the second surface of the primary board, and an orthogonal element extending from the planar element to a feed layer within the primary board; and a passive patch element between the planar element and the feed layer.

公开(公告)号：US20210013582A1

公开(公告)日：2021-01-14

申请号：US16925831

申请日：2020-07-10

Applicant: PERASO TECHNOLOGIES INC.

Inventor： Atabak RASHIDIAN ,  Mihai TAZLAUANU ,  Marc SUPINSKI

IPC: H01Q1/16 ,  H01Q23/00 ,  H01Q1/22

Abstract: A radio frequency module includes: a primary board including: an upper surface carrying a radio controller; and a lower surface carrying antenna control elements; a spacer affixed to the lower surface and having a predefined height extending away from the lower surface; and a secondary board affixed to the spacer, separated from the lower surface by an air gap having the predetermined height; the secondary board supporting a phased array of antenna elements.

公开(公告)号：US20170223831A1

公开(公告)日：2017-08-03

申请号：US15010465

申请日：2016-01-29

Applicant: Peraso Technologies Inc.

Inventor： Marc SUPINSKI

IPC: H05K1/18 ,  H04B17/12 ,  G01R29/10 ,  H01Q1/38 ,  H01Q1/50

CPC classification number: H05K1/18 ,  G01R29/10 ,  H01Q1/12 ,  H01Q1/38 ,  H01Q1/50 ,  H04B17/12 ,  H04B17/17 ,  H05K1/141 ,  H05K2201/049 ,  H05K2201/10098

Abstract: A wireless communication assembly includes a first support member carrying a baseband processor and a radio processor, and defining a first mounting surface including a first pair of electrical contacts. The first support member has a first pair of electrical connections between the radio processor and the first electrical contacts. The assembly also includes a second support member carrying an antenna and defining a second mounting surface including a second pair of electrical contacts. The second support member has a second pair of electrical connections between the antenna and the second electrical contacts. The second mounting surface is configured to engage the first mounting surface to rigidly couple the first and second support members and to bring the first pair of electrical contacts into contact with the second pair of electrical contacts for electrically connecting the radio processor and the antenna via the first and second pairs of electrical connections.