公开(公告)号：US20210066804A1

公开(公告)日：2021-03-04

申请号：US17005978

申请日：2020-08-28

Applicant: PERASO TECHNOLOGIES INC.

Inventor： Mahmoud NIROO JAZI ,  Marc SUPINSKI ,  Mihai TAZLAUANU

IPC: H01Q9/04 ,  H01Q19/00

Abstract: A wireless communications module includes: a primary board including (i) a first surface bearing a radio controller, and defining a set of control contacts for connection to respective ports of the radio controller, and (ii) a second surface opposite the first surface; an antenna array integrated with the primary board, the antenna array including a plurality of unit cells each having: an inverted-L antenna having a planar element adjacent to the second surface of the primary board, and an orthogonal element extending from the planar element to a feed layer within the primary board; and a passive patch element between the planar element and the feed layer.