公开(公告)号：US20140014824A1

公开(公告)日：2014-01-16

申请号：US13939484

申请日：2013-07-11

Applicant: PIXART IMAGING INC.

Inventor： Sen-Huang HUANG ,  Chi-chih SHEN ,  Yen-Min CHANG ,  Hui-Hsuan CHEN

IPC: G01J1/02

CPC classification number: G01J1/0271 ,  G01J1/0204 ,  G01J1/0407 ,  G01J1/0418 ,  G01J1/0448 ,  G01V8/10

Abstract: A packaged optical device includes a package frame having a compartment and an opening, a sensor chip bonded in the compartment, and a non-lens transparency layer embedded in the package frame at the opening and sealing up the opening. This package structure could prevent the sensor chip from adhesion of suspended particles or other contaminations, and simply the assembly process, thereby improving reliability and reducing cost of the packaged optical device.

Abstract translation: 封装的光学器件包括具有隔间和开口的封装框架，结合在隔室中的传感器芯片，以及在开口处嵌入封装框架中并封闭开口的非透镜透明层。 该封装结构可以防止传感器芯片粘附悬浮颗粒或其他污染物，并且简单地组装过程，从而提高可靠性并降低封装的光学器件的成本。

公开(公告)号：US20160161328A1

公开(公告)日：2016-06-09

申请号：US15047104

申请日：2016-02-18

Applicant: PIXART IMAGING INC.

Inventor： Chi-chih SHEN ,  Hui-Hsuan CHEN ,  Yen-Min CHANG

IPC: G01J1/02 ,  G01J1/04

CPC classification number: G01J1/0204 ,  G01J1/0271 ,  G01J1/0407 ,  G01J1/0418 ,  G01J1/0448 ,  G01S7/4813 ,  G01S7/4816 ,  G01S7/4918 ,  G01S17/026 ,  G01V8/10

Abstract: A packaged optical device includes a light source device emitting light to an object surface, a sensor chip receiving reflective light reflected from the object surface, and a non-lens transparency layer located in front of the sensor chip. The light and the reflective light have a first main optic axis and a second main optic axis, respectively, and the first main optic axis and the second main optic axis are configured to form the specular reflection configuration, thereby enhancing images received by the sensor chip. The non-lens transparency layer has a zone passed through by the second main optic axis, and transmittance of the zone is lower than that of other zones of the non-lens transparency layer, thereby preventing the sensor chip from being saturated.

Abstract translation: 封装的光学装置包括：将物体表面发光的光源装置，接受从物体表面反射的反射光的传感器芯片，以及位于传感器芯片前方的非透镜透明层。 光和反射光分别具有第一主光轴和第二主光轴，并且第一主光轴和第二主光轴被配置为形成镜面反射配置，从而增强由传感器芯片接收的图像 。 非透镜透明层具有通过第二主光轴穿过的区域，并且该区域的透射率低于非透镜透明层的其它区域的透射率，从而防止传感器芯片饱和。