公开(公告)号：US20170260622A1

公开(公告)日：2017-09-14

申请号：US15504997

申请日：2015-08-10

Applicant: PLANSEE SE

Inventor： HARALD KOESTENBAUER ,  JUDITH KOESTENBAUER ,  GERHARD LEICHTFRIED ,  JOERG WINKLER ,  MOO SUNG HWANG ,  MARTIN KATHREIN ,  ELISABETH EIDENBERGER

IPC: C23C14/34 ,  C22C27/04 ,  H01B1/02 ,  C22C1/04

CPC classification number: C23C14/3414 ,  C22C1/045 ,  C22C27/04 ,  C23C24/04 ,  H01B1/023 ,  H01L23/53223 ,  H01L23/53238 ,  H01L23/53252

Abstract: A metallization for a thin-film component includes at least one layer composed of an Mo-based alloy containing Al and Ti and usual impurities. A process for producing a metallization includes providing at least one sputtering target, depositing at least one layer of an Mo-based alloy containing Al and Ti and usual impurities, and structuring the metallization by using at least one photolithographic process and at least one subsequent etching step. A sputtering target is composed of an Mo-based alloy containing Al and Ti and usual impurities. A process for producing a sputtering target composed of an Mo-based alloy includes providing a powder mixture containing Mo and also Al and Ti and cold gas spraying (CGS) of the powder mixture onto a suitable support material.

公开(公告)号：US20180144913A1

公开(公告)日：2018-05-24

申请号：US15571600

申请日：2016-04-28

Applicant: PLANSEE SE

Inventor： ANDRE DRONHOFER ,  CHRISTIAN LINKE ,  ELISABETH EIDENBERGER

IPC: H01J37/34

CPC classification number: H01J37/3435 ,  H01J37/3408 ,  H01J37/3429 ,  H01J37/3488

Abstract: A target for a cathode sputtering system has a tubular target body made of a sputtering material and at least one connector piece, which is connected to the target body and projects from the target body, for attaching the target body to the cathode sputtering system. The target body is connected to the at least one connector piece in a vacuum-tight manner and the two are rotationally fixed relative to one another. At least one damper element is provided between the at least one connector piece and the target body.