Process for bonding copper or iron to titanium or tantalum
    1.
    发明授权
    Process for bonding copper or iron to titanium or tantalum 失效
    将铜或铁连接到钛或钽的方法

    公开(公告)号:US3835007A

    公开(公告)日:1974-09-10

    申请号:US31485872

    申请日:1972-12-13

    Applicant: RHONE PROGIL

    CPC classification number: C23C28/023 C23C14/021

    Abstract: COPPER OR IRON ARE SECURELY BONDED TO TITANIUM OR TANTALUM SUBSTRATE METAL BY INITIALLY SUBJECTING THE SUBSTRATE METAL TO IONIC BOMBARDMENT IN WHICH THE SUBSTRATE METAL PERFORMS THE ROLE OF A CATHODE AND THEN TO CATHODE SPUTTERING IN WHICH THE SUBSTRATE METAL PERFORMS THE ROLE OF AN ANODE, AND THE COPPER OR IRON THE ROLE OF A CATHODE. THEREAFTER, THE BONDED COPPER OR IRON IS SUPPLEMENTED BY ADDITIONAL DEPOSITS BY CONVENTIONAL MEANS SUCH AS ELECTRODEPOSITION, ETC. SUPERIOR INDUSTRIAL PRODUCTS RESULTING FROM THE PROCESS ARE USEFUL AS ANODES IN ELECTROLYSIS CELLS AND AS HEAT EXCHANGERS.

    Apparatus and method for cathode sputtering on the two sides of a metallic support having large dimensions
    2.
    发明授权
    Apparatus and method for cathode sputtering on the two sides of a metallic support having large dimensions 失效
    具有大尺寸金属支持两面阴极溅射的装置和方法

    公开(公告)号:US3779885A

    公开(公告)日:1973-12-18

    申请号:US3779885D

    申请日:1971-06-15

    Applicant: PROGIL

    Inventor: LABEDAN P MASOTTI R

    CPC classification number: H01J37/34 C23C14/35 H01M4/8871

    Abstract: Apparatus and method for depositing thin layers by cathodic sputtering onto metallic supports wherein a rarefied gaseous enclosure is provided having an ionic bombardment stage and a cathodic sputtering stage with means for transferring the supports from the first stage to the second stage without cooling or admitting air, each stage acting simultaneously on both surfaces of the metal supports.

    Abstract translation: 用于通过阴极溅射将薄层沉积到金属载体上的装置和方法,其中提供具有离子轰击级的稀薄气体外壳和具有用于将载体从第一级转移到第二级而不冷却或允许空气的装置的阴极溅射台, 每个阶段同时作用在金属支撑体的两个表面上。

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