Abstract:
COPPER OR IRON ARE SECURELY BONDED TO TITANIUM OR TANTALUM SUBSTRATE METAL BY INITIALLY SUBJECTING THE SUBSTRATE METAL TO IONIC BOMBARDMENT IN WHICH THE SUBSTRATE METAL PERFORMS THE ROLE OF A CATHODE AND THEN TO CATHODE SPUTTERING IN WHICH THE SUBSTRATE METAL PERFORMS THE ROLE OF AN ANODE, AND THE COPPER OR IRON THE ROLE OF A CATHODE. THEREAFTER, THE BONDED COPPER OR IRON IS SUPPLEMENTED BY ADDITIONAL DEPOSITS BY CONVENTIONAL MEANS SUCH AS ELECTRODEPOSITION, ETC. SUPERIOR INDUSTRIAL PRODUCTS RESULTING FROM THE PROCESS ARE USEFUL AS ANODES IN ELECTROLYSIS CELLS AND AS HEAT EXCHANGERS.
Abstract:
Apparatus and method for depositing thin layers by cathodic sputtering onto metallic supports wherein a rarefied gaseous enclosure is provided having an ionic bombardment stage and a cathodic sputtering stage with means for transferring the supports from the first stage to the second stage without cooling or admitting air, each stage acting simultaneously on both surfaces of the metal supports.
Abstract:
A CARBON SUBSTRATE IS SUBJECTED TO SUPERFICAL CATHODE SPUTTERING TO ALTER ITS SURFACE CHARACTERISTICS. CARBON SUBSTRATES THUS TREATED ARE USEFUL FOR THE FARBRICATION OF VARIOUS COMPOSITE ASSEMBLIES EXHIBTING IMPROVED PHYSICAL PROPER TIES, SUCH AS ENHANCED MECHANICAL STRENGTH.
Abstract:
A process for depositing a precious metal or its oxide on a metallic support by first submitting the metallic support to ionic bombardment in a rare gas atmosphere, then without cooling below 300*C. depositing the precious metal by cathodic sputtering conducted first in a rare gas atmosphere and then in an atmosphere of mixed oxygen and rare gas.