公开(公告)号：US20150136837A1

公开(公告)日：2015-05-21

申请号：US14404285

申请日：2013-03-04

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Akira Maeda ,  Kennan Mou ,  Toshihiko Nagaya

IPC: H05K13/08 ,  B23K3/06 ,  B23K1/00 ,  H05K3/34

CPC classification number: H05K13/08 ,  B23K1/0016 ,  B23K1/008 ,  B23K3/0638 ,  B23K3/08 ,  B23K2101/42 ,  H05K1/0269 ,  H05K1/0393 ,  H05K3/0097 ,  H05K3/1216 ,  H05K3/341 ,  H05K3/3484 ,  H05K13/0815 ,  H05K2201/053 ,  H05K2201/083 ,  H05K2203/163

Abstract: A deformation state of a predetermined specific site as a site of singulated substrates where the electrodes are liable to be positionally deviated due to deformation is detected for each of the singulated substrates. In component mounting operation for picking up electronic components, and mounting the electronic components on the singulated substrates, it is determined whether the mounting of the electronic component on the specific site of the singulated substrates is suitable or not, based on the detection results of the deformation state for each of the singulated substrates. The operation of mounting all of the electronic components on the singulated substrate having the specific site determined to be not suitable in mounting is canceled.

Abstract translation: 对于每个单个基板，检测预定特定位置的变形状态，作为单个基板的位置，其中电极易于由于变形而位置偏离。 在用于拾取电子部件的组件安装操作和将电子部件安装在单个基板上的情况下，基于单个基板的检测结果确定电子部件在单片基板的特定位置的安装是否合适 每个单个基板的变形状态。 将所有电子部件安装在具有确定为不适合安装的特定部位的单片基板上的操作被取消。