公开(公告)号：US20170374743A1

公开(公告)日：2017-12-28

申请号：US15699570

申请日：2017-09-08

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Arata KISHI ,  Hironori MUNAKATA ,  Koji MOTOMURA ,  Hiroki MARUO

IPC: H05K1/18 ,  H01L23/00 ,  H05K3/34

CPC classification number: H05K1/181 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/10156 ,  H01L2224/16238 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/32052 ,  H01L2224/32057 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/81052 ,  H01L2224/81191 ,  H01L2224/8159 ,  H01L2224/81609 ,  H01L2224/81611 ,  H01L2224/81613 ,  H01L2224/81639 ,  H01L2224/81647 ,  H01L2224/81815 ,  H01L2224/81935 ,  H01L2224/81951 ,  H01L2224/81986 ,  H01L2224/83104 ,  H01L2224/83192 ,  H01L2224/9211 ,  H01L2224/92125 ,  H01L2924/00014 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/384 ,  H05K3/3436 ,  H05K3/3463 ,  H05K3/3484 ,  H05K2201/10734 ,  H05K2201/10977 ,  H05K2201/10992 ,  H05K2201/2009 ,  H05K2201/2036 ,  H05K2201/2045 ,  Y02P70/613 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A mounting structure includes a bonding material (106) that bonds second electrodes (104) of a circuit board (105) and bumps (103) of a semiconductor package (101), the bonding material (106) being surrounded by a first reinforcing resin (107). Moreover, a portion between the outer periphery of the semiconductor package (101) and the circuit board (105) is covered with a second reinforcing resin (108). Even if the bonding material (106) is a solder material having a lower melting point than a conventional bonding material, high drop resistance is obtained.

公开(公告)号：US20150327393A1

公开(公告)日：2015-11-12

申请号：US14706349

申请日：2015-05-07

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Honami NAWA ,  Hirohisa HINO ,  Arata KISHI ,  Naomichi OHASHI ,  Yasuhiro SUZUKI ,  Hidenori MIYAKAWA

IPC: H05K7/20 ,  C09K5/14

CPC classification number: C09K5/14 ,  C08K3/34 ,  C08K2201/003 ,  C08K2201/016 ,  C08L23/16 ,  C08L91/00 ,  C09D123/16 ,  H05K7/205 ,  C08L23/083

Abstract: Provided is a heat-dissipating resin composition including: a rubber material having an average emissivity of 80% or higher in a wavelength range from 5 μm to 20 μm; and a filler having a grain diameter of 15 μm or smaller and an aspect ratio of 3 to 10, wherein the heat-dissipating resin composition has an emissivity of 90% or higher in the wavelength range from 5 μm to 20 μm.

Abstract translation: 本发明提供一种散热性树脂组合物，其特征在于，具有：在5μm〜20μm的波长范围内的平均发射率为80％以上的橡胶材料; 和粒径为15μm以下，纵横比为3〜10的填料，其中散热性树脂组合物的发射率在5μm至20μm的波长范围内具有90％以上的发射率。

公开(公告)号：US20190284388A1

公开(公告)日：2019-09-19

申请号：US16298038

申请日：2019-03-11

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Yuki YOSHIOKA ,  Arata KISHI

IPC: C08L63/00 ,  C08L71/12 ,  H01B1/20 ,  C08K3/11

Abstract: Disclosed is a resin composition that contains conductive particles, a resin component and a curing agent. The conductive particles contain solder, and the resin component contains an epoxy resin and a phenoxy resin. The curing agent contains a first compound having at least one thiol group and a second compound having an amino group.