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公开(公告)号:US20190134951A1
公开(公告)日:2019-05-09
申请号:US16094044
申请日:2017-05-11
Inventor: MASAYA KOYAMA , KIYOTAKA KOMORI , HIROAKI TAKAHASHI , YOSHINORI MATSUZAKI , TADASHI MORI
IPC: B32B15/092 , B32B38/18 , H05K3/38 , B32B15/20
Abstract: Included are removing an outermost layer or outermost layers on one side or both sides of liquid crystal polymer film; and a molding step of performing thermocompression molding on liquid crystal polymer film and metal foil stacked on the side of liquid crystal polymer film whose outermost layer is removed. A heating temperature in the molding step is in a range from a temperature equal to a melting start temperature, of the liquid crystal polymer film, measured by using a rigid body pendulum type viscoelasticity measuring device to a temperature 60° C. higher than the melting start temperature inclusive.