公开(公告)号：US20190134951A1

公开(公告)日：2019-05-09

申请号：US16094044

申请日：2017-05-11

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： MASAYA KOYAMA ,  KIYOTAKA KOMORI ,  HIROAKI TAKAHASHI ,  YOSHINORI MATSUZAKI ,  TADASHI MORI

IPC: B32B15/092 ,  B32B38/18 ,  H05K3/38 ,  B32B15/20

Abstract: Included are removing an outermost layer or outermost layers on one side or both sides of liquid crystal polymer film; and a molding step of performing thermocompression molding on liquid crystal polymer film and metal foil stacked on the side of liquid crystal polymer film whose outermost layer is removed. A heating temperature in the molding step is in a range from a temperature equal to a melting start temperature, of the liquid crystal polymer film, measured by using a rigid body pendulum type viscoelasticity measuring device to a temperature 60° C. higher than the melting start temperature inclusive.

公开(公告)号：US20170099731A1

公开(公告)日：2017-04-06

申请号：US15128093

申请日：2015-04-07

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： TATSUYA ARISAWA ,  YOSHIHIKO NAKAMURA ,  TOMOYUKI ABE ,  KIYOTAKA KOMORI ,  SYOUJI HASIMOTO ,  MITSUYOSHI NISHINO

IPC: H05K1/03 ,  C08J5/24 ,  H05K3/00 ,  B32B15/08 ,  B32B27/20

CPC classification number: H05K1/0373 ,  B32B15/08 ,  B32B27/20 ,  B32B2305/076 ,  B32B2457/08 ,  C08J5/10 ,  C08J5/24 ,  C08J2300/24 ,  C08J2363/00 ,  C08J2371/12 ,  H05K1/0366 ,  H05K3/0067 ,  H05K2201/0209 ,  H05K2201/0215

Abstract: A resin composition for printed circuit board contains a resin component containing a thermosetting resin, and an inorganic filler. The inorganic filler contains crushed silica having a specific surface area in a range from 0.1 m2/g to 15 m2/g, inclusive, and molybdenum compound particles each having a molybdenum compound in at least a surface layer portion. A content of the crushed silica is in a range from 10 parts by mass to 150 parts by mass inclusive with respect to 100 parts by mass of the resin component.